公开(公告)号：US20180320031A1

公开(公告)日：2018-11-08

申请号：US15768050

申请日：2016-12-13

Applicant: DEXERIALS CORPORATION

Inventor： Daichi MORI ,  Tomoyuki ISHIMATSU

IPC: C09J7/30 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J163/00 ,  H01L21/304 ,  H01L21/683 ,  B32B27/06

CPC classification number: C09J7/30 ,  B32B27/06 ,  B32B2457/14 ,  C09J7/00 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J163/00 ,  H01L21/304 ,  H01L21/6836

Abstract: A thermosetting adhesive sheet capable of reducing semiconductor wafer warping and chipping and a method for manufacturing a semiconductor device includes a thermosetting adhesive layer formed from a resin composition containing a resin component and a filler, the resin component containing an epoxy compound and a curing agent, a total value obtained by multiplying the reciprocal of epoxy equivalent of the epoxy compound by content of the epoxy compound in the resin component being 1.15E-04 or more, and blending amount of the filler being 50 pts. mass or more with respect to 100 pts. mass of the resin component; the thermosetting adhesive sheet is applied to a ground surface of a semiconductor and cured before dicing.

公开(公告)号：US20190016930A1

公开(公告)日：2019-01-17

申请号：US16068206

申请日：2016-12-19

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Tomoyuki ISHIMATSU ,  Takashi MATSUMURA ,  Masaharu AOKI

IPC: C09J9/02 ,  C09J11/04 ,  C09J11/08 ,  C09J11/06 ,  C09J163/00 ,  H01L33/62 ,  H01L33/60

Abstract: An adhesive composition having excellent life properties is provided. This adhesive composition achieves excellent life properties by containing an epoxy compound, an aluminum chelating agent, and a hindered amine compound. This is presumably because the aluminum chelating agent stably exists due to the coordination of the nitrogen atom of the hindered amine compound with aluminum of the aluminum chelating agent.

公开(公告)号：US20180312728A1

公开(公告)日：2018-11-01

申请号：US15768197

申请日：2016-12-13

Applicant: DEXERIALS CORPORATION

Inventor： Daichi MORI ,  Tomoyuki ISHIMATSU

IPC: C09J7/30 ,  C09J11/04 ,  C09J11/06 ,  H01L21/304 ,  H01L21/683

CPC classification number: C09J7/30 ,  C08K3/013 ,  C09J7/10 ,  C09J11/04 ,  C09J11/06 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  H01L21/304 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/68381

Abstract: Provided are a thermosetting adhesive sheet and a method for manufacturing a semiconductor device capable of reducing semiconductor wafer warping and chipping. The thermosetting adhesive sheet includes a thermosetting adhesive layer containing a resin component and a filler, the resin component containing a (meth)acrylate and a polymerization initiator, the (meth)acrylate containing a solid (meth)acrylate and a trifunctional or higher functional (meth)acrylate, content of the solid (meth)acrylate in the resin component being 55 wt % or more; a total value obtained by multiplying the number of functional groups per unit molecular weight of the (meth)acrylate by content of the (meth)acrylate in the resin component being 2.7E-03 or more, and blending amount of the filler being 80 to 220 pts. mass with respect to 100 pts. mass of the resin component.

公开(公告)号：US20170359904A1

公开(公告)日：2017-12-14

申请号：US15541621

申请日：2016-01-05

Applicant: DEXERIALS CORPORATION

Inventor： Kenichi HAGA ,  Tomoyuki ISHIMATSU ,  Yasushi AKUTSU

IPC: H05K3/32 ,  H01B5/16 ,  H01B1/22 ,  H01L23/00 ,  C09J9/02 ,  H05K3/34

Abstract: An anisotropic conductive film includes, as conductive particles for anisotropic conductive connection, metal particles such as solder particles having on the surface an oxide film. In this anisotropic conductive film, the metal particles are contained in an insulating film and regularly arranged as viewed in a plan view. A flux is disposed to be in contact with, or in proximity to, at least one of ends of the metal particles on a front surface side of the anisotropic conductive film and a rear surface side of the anisotropic conductive film. Preferable metal particles are solder particles. Preferably, the insulating film has a structure of two layers, and the metal particles are disposed between the two layers.

公开(公告)号：US20170107406A1

公开(公告)日：2017-04-20

申请号：US15126898

申请日：2015-01-29

Applicant: DEXERIALS CORPORATION

Inventor： Yuta ARAKI ,  Tomoyuki ISHIMATSU

IPC: C09J7/00 ,  H01L23/00 ,  B32B27/20 ,  C09J9/02 ,  B32B27/08

Abstract: An anisotropic conductive film contains conductive particles and spacers. The spacers are arranged at a central part of the film in a width direction. The central part of the film in the width direction represents 20 to 80% of the overall width of the film. The height of the spacers in the thickness direction of the anisotropic conductive film is larger than 5 μm and less than 75 μm. Such an anisotropic conductive film has a layered structure having a first insulating adhesion layer and a second insulating adhesion layer, wherein the conductive particles are dispersed in the first insulating adhesion layer, and the spacers are regularly arranged on a surface of the first insulating adhesion layer on a side of the second insulating adhesion layer.

公开(公告)号：US20170358549A1

公开(公告)日：2017-12-14

申请号：US15543113

申请日：2016-01-13

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro SHINOHARA ,  Yasushi AKUTSU ,  Tomoyuki ISHIMATSU

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L24/27 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/13164 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2224/13686 ,  H01L2224/1369 ,  H01L2224/1403 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16146 ,  H01L2224/16147 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/17107 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27515 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81101 ,  H01L2224/81122 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83122 ,  H01L2224/83203 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/00015 ,  H01L2924/3841 ,  H01L2224/83851 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/05432

Abstract: Provided is a multilayer substrate including laminated semiconductor substrates each having a penetrating hole (hereinafter referred to as through hole) having a plated film formed in the inner surface. The multilayer substrate has excellent conduction characteristics and can be manufactured at low cost. Conductive particles are selectively present at a position where the through holes face each other as viewed in a plan view of the multilayer substrate. The multilayer substrate has a connection structure in which the facing through holes are connected by the conductive particles, and the semiconductor substrates each having the through hole are bonded by an insulating adhesive.

公开(公告)号：US20170323701A1

公开(公告)日：2017-11-09

申请号：US15522162

申请日：2015-10-28

Applicant: DEXERIALS CORPORATION

Inventor： Tomoyuki ISHIMATSU ,  Reiji TSUKAO

IPC: H01B5/16 ,  B32B27/08 ,  B32B7/12 ,  H01B1/22 ,  H05K3/32 ,  H01L23/00

CPC classification number: H01B5/16 ,  B32B7/12 ,  B32B27/08 ,  C08K3/08 ,  C08K9/02 ,  C09J7/10 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  H01B1/22 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/294 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2924/07802 ,  H01R12/7076 ,  H01R13/2414 ,  H05K3/323 ,  H01L2924/00014

Abstract: The present invention provides an anisotropic electrically conductive film with a structure, in which electrically conductive particles are disposed at lattice points of a planar lattice pattern in an electrically insulating adhesive base layer. A proportion of the lattice points, at which no electrically conductive particle is disposed, with respect to all the lattice points of the planar lattice pattern assumed as a reference region, is less than 20%. A proportion of the lattice points, at which plural electrically conductive particles are disposed in an aggregated state, with respect to all the lattice points of the planar lattice pattern, is not greater than 15%. A sum of omission of the electrically conductive particle and an aggregation of the electrically conductive particles is less than 25%.

公开(公告)号：US20190308403A1

公开(公告)日：2019-10-10

申请号：US16451441

申请日：2019-06-25

Applicant: DEXERIALS CORPORATION

Inventor： Tomoyuki ISHIMATSU

IPC: B32B37/18 ,  B32B27/20 ,  H01L23/00 ,  B32B37/00 ,  B32B37/24 ,  B32B3/30

Abstract: The present invention is to provide an anisotropic conductive film that excels in dispersing conductive particles and trapping the particles, and maintains conduction reliability even between narrow-pitched terminals. By a method for manufacturing an anisotropic conductive film containing conductive particles, the conductive particles are buried in grooves in a sheet having the grooves regularly formed in the same direction, the conductive particles are arranged, a first resin film having a thermo-setting resin layer formed on a stretchable base film is laminated on the surface of the sheet on the side of the grooves to transfer and attach the conductive particles to the first resin film, the first resin film is uniaxially stretched in a direction other than the direction perpendicular to the array direction of the conductive particles, and a second resin film is laminated.

公开(公告)号：US20180218990A1

公开(公告)日：2018-08-02

申请号：US15542343

申请日：2016-01-13

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU ,  Tomoyuki ISHIMATSU

IPC: H01L23/00

Abstract: A bump-forming film is used for forming, on a semiconductor device such as a bumpless IC chip, bumps which are low in cost and can achieve stable conduction reliability. The bump-forming film is configured such that conductive fillers for bumps are arranged regularly in a planar view in an insulating adhesive resin layer. The regular arrangement has a periodic repeating unit in the longitudinal direction of the film. The straight line which connects one ends of the conductive fillers for bumps in the thickness direction of the film is substantially parallel to the surface of the film.

公开(公告)号：US20180151405A1

公开(公告)日：2018-05-31

申请号：US15574729

申请日：2016-06-03

Applicant: DEXERIALS CORPORATION

Inventor： Hironobu MORIYAMA ,  Hidekazu YAGI ,  Tomoyuki ISHIMATSU ,  Katsuyuki EBISAWA ,  Keiji HONJYO ,  Junichi KANEKO

IPC: H01L21/683 ,  B32B27/08 ,  B32B38/10 ,  H01L21/304 ,  H01L21/78 ,  H01L23/00 ,  C09J7/25 ,  C09J7/24 ,  C09J7/38 ,  C09J163/04

CPC classification number: H01L21/6836 ,  B32B27/00 ,  B32B27/08 ,  B32B38/10 ,  B32B2405/00 ,  C09J7/245 ,  C09J7/255 ,  C09J7/29 ,  C09J7/38 ,  C09J163/00 ,  C09J163/04 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2423/046 ,  C09J2431/006 ,  C09J2463/00 ,  C09J2467/006 ,  H01L21/304 ,  H01L21/78 ,  H01L23/562 ,  H01L24/11 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386 ,  H01L2224/11009

Abstract: A protective tape that improves solder bonding properties and reduces wafer warping. The protective tape includes, in the following order, an adhesive agent layer, a first thermoplastic resin layer, a second thermoplastic resin layer, and a matrix film layer. The protective tape satisfies the conditions expressed by the following formulae (1) to (3): Ga>Gb  (1) Ta