公开(公告)号：US20230198186A1

公开(公告)日：2023-06-22

申请号：US17910987

申请日：2021-03-18

Applicant: DEXERIALS CORPORATION

Inventor： Ryosuke ODAKA ,  Ryo ITO ,  Hiroyuki KUMAKURA ,  Tomoyuki ABE ,  Daisuke SATO ,  Katsuhisa ORIHARA ,  Kazuhisa AOKI

IPC: H01R13/405 ,  H01R4/04 ,  H01R12/71 ,  H01R43/02

CPC classification number: H01R13/405 ,  H01R4/04 ,  H01R12/71 ,  H01R43/02

Abstract: A connection body capable of achieving fine pitch and miniaturization, and a method of manufacturing the connection body. A connection body includes: a substrate having a first terminal array; a connector having second terminal array; and an adhesive layer formed by curing a thermosetting connection material connecting the first terminal array and the second terminal array, wherein the second terminal array is disposed on the bottom surface of the connector and forms a level difference canceling portion for canceling a level difference in the bottom surface, and wherein the thermosetting connection material contains solder particles and a flux component. Thus, the first terminal array and the second terminal array can be connected, so that the terminal array can be made to have a fine pitch, and the connected body can be miniaturized.