公开(公告)号：US20230198186A1

公开(公告)日：2023-06-22

申请号：US17910987

申请日：2021-03-18

Applicant: DEXERIALS CORPORATION

Inventor： Ryosuke ODAKA ,  Ryo ITO ,  Hiroyuki KUMAKURA ,  Tomoyuki ABE ,  Daisuke SATO ,  Katsuhisa ORIHARA ,  Kazuhisa AOKI

IPC: H01R13/405 ,  H01R4/04 ,  H01R12/71 ,  H01R43/02

CPC classification number: H01R13/405 ,  H01R4/04 ,  H01R12/71 ,  H01R43/02

Abstract: A connection body capable of achieving fine pitch and miniaturization, and a method of manufacturing the connection body. A connection body includes: a substrate having a first terminal array; a connector having second terminal array; and an adhesive layer formed by curing a thermosetting connection material connecting the first terminal array and the second terminal array, wherein the second terminal array is disposed on the bottom surface of the connector and forms a level difference canceling portion for canceling a level difference in the bottom surface, and wherein the thermosetting connection material contains solder particles and a flux component. Thus, the first terminal array and the second terminal array can be connected, so that the terminal array can be made to have a fine pitch, and the connected body can be miniaturized.

公开(公告)号：US20230307252A1

公开(公告)日：2023-09-28

申请号：US18008184

申请日：2021-06-03

Applicant: DEXERIALS CORPORATION

Inventor： Hiroyuki KUMAKURA ,  Tomoyuki ABE

IPC: H01L21/603 ,  H01L21/48

CPC classification number: H01L21/603 ,  H01L21/4875 ,  H01L2021/6015

Abstract: A joined body production method includes subjecting a first electronic component and a second electronic component to thermocompression bonding via a hot-melt adhesive sheet. The hot-melt adhesive sheet includes a binder and solder particles. The binder includes a crystalline polyamide resin having a carboxyl group. A melting point of the solder particles is 30° C. to 0° C. lower than a temperature of the thermocompression bonding. When melt viscosities of the hot-melt adhesive sheet are measured under a condition of a heating rate of 5° C./min., the hot-melt adhesive sheet has a ratio of a melt viscosity at 40° C. lower than the temperature of the thermocompression bonding to a melt viscosity at 20° C. lower than the temperature of the thermocompression bonding of no less than 10.

公开(公告)号：US20170081564A1

公开(公告)日：2017-03-23

申请号：US15123591

申请日：2015-03-03

Applicant: Dexerials Corporation

Inventor： Tomoyuki ABE

IPC: C09J133/06 ,  C09J11/04

CPC classification number: C09J133/062 ,  C08K3/04 ,  C08K9/12 ,  C08K2201/003 ,  C09J7/10 ,  C09J11/04 ,  C09J133/066 ,  C09J2203/318 ,  C09J2205/102 ,  C09J2205/11 ,  C09J2433/00 ,  C08F2220/1858 ,  C08F220/06 ,  C08F2222/1013 ,  C08F220/54

Abstract: A double-sided black adhesive tape having a hollow particle-containing adhesive agent layer, wherein a surface of the hollow particle is subjected to a black pigment adhesion treatment.

公开(公告)号：US20230287246A1

公开(公告)日：2023-09-14

申请号：US18008186

申请日：2021-06-03

Applicant: DEXERIALS CORPORATION

Inventor： Hiroyuki KUMAKURA ,  Tomoyuki ABE

IPC: C09J7/35 ,  C09J133/24 ,  C09J11/04 ,  C09J167/06

CPC classification number: C09J7/35 ,  C09J133/24 ,  C09J11/04 ,  C09J167/06 ,  C09J2203/326 ,  C09J2301/312 ,  C09J2427/006 ,  C09J2301/50 ,  C09J2301/408

Abstract: A method for manufacturing a joined body includes subjecting a first electronic component and a second electronic component to thermocompression bonding with a hot-melt adhesive sheet interposed therebetween. The hot-melt adhesive sheet includes a binder and electroconductive particles. The binder includes a crystalline polyamide resin and a crystalline polyester resin. When a melt viscosity of the hot-melt adhesive sheet is measured under a condition of a heating rate of 5° C./min. the hot-melt adhesive sheet has a ratio of a melt viscosity at 20° C. lower than a thermocompression bonding temperature to a melt viscosity at the thermocompression bonding temperature of 10 or higher.

公开(公告)号：US20220363953A1

公开(公告)日：2022-11-17

申请号：US17623928

申请日：2021-06-03

Applicant: DEXERIALS CORPORATION

Inventor： Ryosuke ODAKA ,  Morio SEKIGUCHI ,  Hiroyuki KUMAKURA ,  Tomoyuki ABE

IPC: C09J7/35 ,  C09J5/06 ,  C09J9/02 ,  C09J7/10 ,  G06K19/077 ,  B29C65/48 ,  B29C65/00

Abstract: A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.

公开(公告)号：US20150284602A1

公开(公告)日：2015-10-08

申请号：US14743393

申请日：2015-06-18

Applicant: DEXERIALS CORPORATION

Inventor： Noboru ARAKI ,  Tomoyuki ABE ,  Takanori OGATA

IPC: C09J133/08 ,  C09J7/02

CPC classification number: C09J133/08 ,  B32B7/12 ,  B32B15/043 ,  B32B15/088 ,  B32B15/20 ,  B32B25/14 ,  B32B27/40 ,  B32B2605/00 ,  C09J4/00 ,  C09J7/22 ,  C09J7/243 ,  C09J7/26 ,  C09J7/38 ,  C09J133/04 ,  C09J133/06 ,  C09J2201/128 ,  C09J2201/622 ,  C09J2400/243 ,  C09J2423/006 ,  C09J2423/046 ,  C09J2433/00 ,  C09J2433/003 ,  Y10T428/249983

Abstract: In a double-sided adhesive tape in which acrylic-based adhesive layers are formed on respective sides of an electron beam cross-linked polyethylene foam substrate, the acrylic-based adhesive layers are formed from a cured resin composition formed by irradiating a solvent-free photopolymerizable monomer composition containing an acrylic-based monomer and a photopolymerization initiator with ultraviolet rays to photo-polymerize the acrylic-based monomer. The cured resin composition contains an adhesion-imparting polymer having a weight average molecular weight of 2,000 to 10,000, an acrylic-based polymer A obtained by photopolymerization in the absence of a cross-linking agent and having a weight average molecular weight of 700,000 to 3,000,000, and an acrylic-based polymer B obtained by photopolymerization in the absence of a cross-linking agent and having a weight average molecular weight of 350,000 to 650,000. The molecular weight distribution of the cured resin composition measured by gel permeation chromatography using tetrahydrofuran is 2.4 to 4.4.

Abstract translation: 在电子束交联聚乙烯泡沫基材的两侧形成有丙烯酸类粘合剂层的双面胶带中，丙烯酸类粘合剂层由通过照射无溶剂形成的固化树脂组合物形成 含有丙烯酸系单体和光聚合引发剂的紫外线光聚合性单体组合物，使丙烯酸类单体光聚合。 固化树脂组合物含有重均分子量为2,000〜10,000的粘合赋予性聚合物，在不存在交联剂的情况下通过光聚合得到的丙烯酸类聚合物A，其重均分子量为70万〜300万 和在不存在交联剂的情况下通过光聚合得到的丙烯酸系聚合物B，其重均分子量为35万〜65万。 通过使用四氢呋喃的凝胶渗透色谱法测定的固化树脂组合物的分子量分布为2.4〜4.4。