公开(公告)号：US20230198186A1

公开(公告)日：2023-06-22

申请号：US17910987

申请日：2021-03-18

Applicant: DEXERIALS CORPORATION

Inventor： Ryosuke ODAKA ,  Ryo ITO ,  Hiroyuki KUMAKURA ,  Tomoyuki ABE ,  Daisuke SATO ,  Katsuhisa ORIHARA ,  Kazuhisa AOKI

IPC: H01R13/405 ,  H01R4/04 ,  H01R12/71 ,  H01R43/02

CPC classification number: H01R13/405 ,  H01R4/04 ,  H01R12/71 ,  H01R43/02

Abstract: A connection body capable of achieving fine pitch and miniaturization, and a method of manufacturing the connection body. A connection body includes: a substrate having a first terminal array; a connector having second terminal array; and an adhesive layer formed by curing a thermosetting connection material connecting the first terminal array and the second terminal array, wherein the second terminal array is disposed on the bottom surface of the connector and forms a level difference canceling portion for canceling a level difference in the bottom surface, and wherein the thermosetting connection material contains solder particles and a flux component. Thus, the first terminal array and the second terminal array can be connected, so that the terminal array can be made to have a fine pitch, and the connected body can be miniaturized.

公开(公告)号：US20230307252A1

公开(公告)日：2023-09-28

申请号：US18008184

申请日：2021-06-03

Applicant: DEXERIALS CORPORATION

Inventor： Hiroyuki KUMAKURA ,  Tomoyuki ABE

IPC: H01L21/603 ,  H01L21/48

CPC classification number: H01L21/603 ,  H01L21/4875 ,  H01L2021/6015

Abstract: A joined body production method includes subjecting a first electronic component and a second electronic component to thermocompression bonding via a hot-melt adhesive sheet. The hot-melt adhesive sheet includes a binder and solder particles. The binder includes a crystalline polyamide resin having a carboxyl group. A melting point of the solder particles is 30° C. to 0° C. lower than a temperature of the thermocompression bonding. When melt viscosities of the hot-melt adhesive sheet are measured under a condition of a heating rate of 5° C./min., the hot-melt adhesive sheet has a ratio of a melt viscosity at 40° C. lower than the temperature of the thermocompression bonding to a melt viscosity at 20° C. lower than the temperature of the thermocompression bonding of no less than 10.

公开(公告)号：US20230287246A1

公开(公告)日：2023-09-14

申请号：US18008186

申请日：2021-06-03

Applicant: DEXERIALS CORPORATION

Inventor： Hiroyuki KUMAKURA ,  Tomoyuki ABE

IPC: C09J7/35 ,  C09J133/24 ,  C09J11/04 ,  C09J167/06

CPC classification number: C09J7/35 ,  C09J133/24 ,  C09J11/04 ,  C09J167/06 ,  C09J2203/326 ,  C09J2301/312 ,  C09J2427/006 ,  C09J2301/50 ,  C09J2301/408

Abstract: A method for manufacturing a joined body includes subjecting a first electronic component and a second electronic component to thermocompression bonding with a hot-melt adhesive sheet interposed therebetween. The hot-melt adhesive sheet includes a binder and electroconductive particles. The binder includes a crystalline polyamide resin and a crystalline polyester resin. When a melt viscosity of the hot-melt adhesive sheet is measured under a condition of a heating rate of 5° C./min. the hot-melt adhesive sheet has a ratio of a melt viscosity at 20° C. lower than a thermocompression bonding temperature to a melt viscosity at the thermocompression bonding temperature of 10 or higher.

公开(公告)号：US20220363953A1

公开(公告)日：2022-11-17

申请号：US17623928

申请日：2021-06-03

Applicant: DEXERIALS CORPORATION

Inventor： Ryosuke ODAKA ,  Morio SEKIGUCHI ,  Hiroyuki KUMAKURA ,  Tomoyuki ABE

IPC: C09J7/35 ,  C09J5/06 ,  C09J9/02 ,  C09J7/10 ,  G06K19/077 ,  B29C65/48 ,  B29C65/00

Abstract: A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.