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    WIDE FIELD OF VIEW IMAGING SYSTEM FOR VEHICLE ARTIFICIAL INTELLIGENCE SYSTEM
    1.
    发明申请
    WIDE FIELD OF VIEW IMAGING SYSTEM FOR VEHICLE ARTIFICIAL INTELLIGENCE SYSTEM 有权

    公开(公告)号：US20220182561A1

    公开(公告)日：2022-06-09

    申请号：US17493836

    申请日：2021-10-04

    Applicant: DIGITAL DIRECT IR, INC.

    Inventor： Peter N. Kaufman

    IPC: H04N5/341 ,  H04N5/378

    Abstract: A system comprises a photodetector array comprising a plurality of pixels, and a plurality of image processors. The photodetector array is logically partitioned into a plurality of regions comprising a central region, a first peripheral region, and a second peripheral region. Each image processor is configured to process image data generated by a respective one of the regions of the photodetector array.

    Multi-spectrum imaging
    4.
    发明授权
    Multi-spectrum imaging 有权

    公开(公告)号：US10948349B2

    公开(公告)日：2021-03-16

    申请号：US16237412

    申请日：2018-12-31

    Applicant: DIGITAL DIRECT IR, INC.

    Inventor： Peter N. Kaufman

    IPC: G01J3/00 ,  G01J3/28 ,  G01J3/02 ,  G01J3/36

    Abstract: Multi-spectrum imaging systems and methods are provided for imaging in multiple spectrums, e.g., thermal IR (infrared) at wavelengths of 4 microns and 11 microns, near-IR, and visible light, all on a same optical centerline. For example, an imaging system includes a first imager and a second imager. The first imager includes an array of thermal IR detectors, wherein the first imager is configured to receive incident photonic radiation and generate a thermal IR image, wherein each thermal IR detector comprises a photon absorber member that is configured to absorb thermal IR photonic radiation from the incident photonic radiation, and reflect remaining photonic radiation in the incident photonic radiation along an optical path of the imaging system. The second imager is disposed in said optical path of the imaging system, wherein the second imager is configured to receive the remaining photonic radiation reflected from the first imager and generate a second image.

    MULTI-SPECTRUM IMAGING
    5.
    发明申请
    MULTI-SPECTRUM IMAGING 审中-公开
    多光谱成像

    公开(公告)号：US20170026589A1

    公开(公告)日：2017-01-26

    申请号：US15099558

    申请日：2016-04-14

    Applicant: DIGITAL DIRECT IR, INC.

    Inventor： Peter N. Kaufman

    IPC: H04N5/33

    CPC classification number: H04N5/332 ,  G01J3/0208 ,  G01J3/021 ,  G01J3/2803 ,  G01J3/36 ,  G01J5/44

    Abstract: Multi-spectrum imaging systems and methods are provided to imaging in multiple spectrums, e.g., thermal IR (infrared) at 4 μm and 10 μm wavelengths, near-IR, and visible light, all on a same optical centerline. For example, an imaging system includes a first imager and a second imager. The first imager includes an array of thermal IR detectors, wherein the first imager is configured to receive incident photonic radiation and generate a thermal IR image, wherein each thermal IR detector comprises a photon absorber member that is configured to absorb thermal IR photonic radiation from the incident photonic radiation, and reflect remaining photonic radiation in the incident photonic radiation along an optical path of the imaging system. The second imager is disposed in said optical path of the imaging system, wherein the second imager is configured to receive the remaining photonic radiation reflected from the first imager and generate a second image.

    Abstract translation: 提供多光谱成像系统和方法用于在多个光谱中成像，例如在相同光学中心线上的4μm和10μm波长，近红外和可见光的热IR（红外）。 例如，成像系统包括第一成像器和第二成像器。 第一成像器包括一组热IR检测器，其中第一成像器被配置为接收入射光子辐射并产生热IR图像，其中每个热IR检测器包括光子吸收体构件，其构造成吸收来自 入射光子辐射，并沿着成像系统的光路反射入射光子辐射中的剩余光子辐射。 第二成像器设置在成像系统的所述光路中，其中第二成像器被配置为接收从第一成像器反射的剩余光子辐射并产生第二图像。

    Side-scan infrared imaging devices
    6.
    发明授权
    Side-scan infrared imaging devices 有权

    公开(公告)号：US10791916B2

    公开(公告)日：2020-10-06

    申请号：US15601932

    申请日：2017-05-22

    Applicant: DIGITAL DIRECT IR, INC.

    Inventor： Peter N. Kaufman

    IPC: A61B1/04 ,  G01J5/02 ,  A61B1/00 ,  A61B1/05 ,  A61B5/00 ,  A61B1/06 ,  G01J5/04 ,  G01J5/08 ,  G01J5/50 ,  G01J5/00

    Abstract: Infrared imaging devices are provided which are configured to implement side-scan infrared imaging for, e.g., medical applications. For example, an imaging device includes a ring-shaped detector element comprising a circular array of infrared detectors configured to detect thermal infrared radiation, and a focusing element configured to focus incident infrared radiation towards the circular array of infrared detectors. The imaging device can be an ingestible imaging device (e.g., swallowable camera) or the imaging device can be implemented as part of an endoscope device, for example.

    PASSIVE DETECTORS FOR IMAGING SYSTEMS
    8.
    发明申请
    PASSIVE DETECTORS FOR IMAGING SYSTEMS 有权
    成像系统被动探测器

    公开(公告)号：US20170023414A1

    公开(公告)日：2017-01-26

    申请号：US15099440

    申请日：2016-04-14

    Applicant: DIGITAL DIRECT IR, INC.

    Inventor： Peter N. Kaufman

    IPC: G01J5/40 ,  G01J5/34 ,  G01J5/06 ,  G01J5/20

    CPC classification number: G01J5/40 ,  G01J1/44 ,  G01J5/0225 ,  G01J5/023 ,  G01J5/046 ,  G01J5/06 ,  G01J5/0806 ,  G01J5/10 ,  G01J5/20 ,  G01J5/34 ,  G01J5/44 ,  G01J2005/0077 ,  G01J2005/065

    Abstract: Passive detector structures for imaging systems are provided, which are based on a coefficient of thermal expansion (CTE) framework. With such framework, a CTE-based passive detector structure includes a detector member that is configured to expand or contract in response to thermal heating resulting from photon exposure. The expanding/contracting CTE detector structure is configured to exert mechanical forces on resistor and/or capacitor circuit elements, which are part of an oscillator circuit, to vary the resistance and capacitance of such circuit elements and change a frequency or period of oscillation of an output signal of the oscillator circuit. The change in the frequency or period of oscillation of the output signal of the oscillator circuit is utilized to determine an amount of photon exposure of the CTE-based detector.

    Abstract translation: 提供了用于成像系统的被动检测器结构，其基于热膨胀系数（CTE）框架。 利用这种框架，基于CTE的被动检测器结构包括检测器构件，其被配置为响应于由光子暴露引起的热加热而膨胀或收缩。 扩展/收缩CTE检测器结构被配置为对作为振荡器电路的一部分的电阻器和/或电容器电路元件施加机械力，以改变这种电路元件的电阻和电容，并且改变振荡的频率或振荡周期 振荡电路的输出信号。 振荡器电路的输出信号的频率或振荡周期的变化用于确定基于CTE的检测器的光子曝光量。

    SIDE-SCAN INFRARED IMAGING DEVICES
    9.
    发明申请
    SIDE-SCAN INFRARED IMAGING DEVICES 有权

    公开(公告)号：US20210137367A1

    公开(公告)日：2021-05-13

    申请号：US17063557

    申请日：2020-10-05

    Applicant: DIGITAL DIRECT IR, INC.

    Inventor： Peter N. Kaufman

    IPC: A61B1/04 ,  G01J5/04 ,  G01J5/02 ,  G01J5/08 ,  A61B1/00 ,  A61B1/05 ,  A61B1/06 ,  A61B5/00 ,  G01J5/50

    Abstract: Infrared imaging devices are provided which are configured to implement side-scan infrared imaging for, e.g., medical applications. For example, an imaging device includes a ring-shaped detector element comprising a circular array of infrared detectors configured to detect thermal infrared radiation, and a focusing element configured to focus incident infrared radiation towards the circular array of infrared detectors. The imaging device can be an ingestible imaging device (e.g., swallowable camera) or the imaging device can be implemented as part of an endoscope device, for example.

    MULTI-SPECTRUM IMAGING
    10.
    发明申请
    MULTI-SPECTRUM IMAGING 审中-公开

    公开(公告)号：US20190383665A1

    公开(公告)日：2019-12-19

    申请号：US16237412

    申请日：2018-12-31

    Applicant: DIGITAL DIRECT IR, INC.

    Inventor： Peter N. Kaufman

    IPC: G01J3/28

    Abstract: Multi-spectrum imaging systems and methods are provided to imaging in multiple spectrums, e.g., thermal IR (infrared) at wavelengths of 4 microns and 11 microns, near-IR, and visible light, all on a same optical centerline. For example, an imaging system includes a first imager and a second imager. The first imager includes an array of thermal IR detectors, wherein the first imager is configured to receive incident photonic radiation and generate a thermal IR image, wherein each thermal IR detector comprises a photon absorber member that is configured to absorb thermal IR photonic radiation from the incident photonic radiation, and reflect remaining photonic radiation in the incident photonic radiation along an optical path of the imaging system. The second imager is disposed in said optical path of the imaging system, wherein the second imager is configured to receive the remaining photonic radiation reflected from the first imager and generate a second image.

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