Abstract:
A process for the continuous manufacture of phenolic resin foam in an endless sheet which includes mixing expandable liquid phenolic resin with a blowing agent and an acid-containing curing agent, optionally with the addition of additives, and processing of the mixture in a temperature-controllable double belt press. The process also comprises cooling the phenolic resin to a temperature of from about 8* to 15*C., admixing a blowing agent under a high pressure with said resin to form a resin premix, mixing said resin premix with a curing agent resin to form a resin premix, mixing said resin premix with a curing agent and other foam additives to form a curable reaction mixture, continuously applying said mixture uniformily onto a moving substrate, covering the mixture on said substrate with a continuous protective layer, passing the covered mixture into the double belt press, and foaming the mixture under pressure until a desired sheet thickness has been obtained.
Abstract:
A THERMOPLASTIC POLYAMIDE MOLDING COMPOSITION CAPABLE OF FORMING TRANSPARENT HOLLOW BLOW MOLDED OBJECTS AT FORMING TEMPERATURES IN THE RANGE OF 170 TO 230*C., COMPRISES: (A) AT LEAST 40 WEIGHT PERCENT OF AN AMOROPHOUS POLYAMIDE COMPOSED OF AN AROMATIC DICARBOXYLIC ACID, A TRIMETHYL HEXAMETHYLENE DIAMINE AND A NORMAL ALIPHATIC DIAMINE, THE NORMAL ALIPHATIC DIAMINE COMPRISEING UP TO 30 WIEGHT OF THE DIALMINES USED, AND (B) THE BALANCE, ASID FROM CUSTOMARY ADDITIVES OF A SECOND POLYAMIDE FORMED FROM A W-AMINO ACID OR W-LACTAM, OR FORMED FROM A ALIPHATIC DICARBOXYLIC ACID AND A NORMAL ALIPHATIC DIAMINE.
Abstract:
A copolymer of vinyl chloride with ethylene or propylene having a K-value of 45 to 65 and an alkylene (ethylene or propylene) content of 0.5 to 10 weight percent. This product is particularly useful for forming plasticizer-free coatings on substrates by known fluidized bed coating processes and for forming plasticizer-free shaped articles by rotational molding processes.