摘要:
A non-volatile semiconductor storage device includes: a memory cell array having memory cells arranged therein, the memory cells storing data in a non-volatile manner; and a plurality of transfer transistors transferring a voltage to the memory cells, the voltage to be supplied for data read, write and erase operations with respect to the memory cells. Each of the transfer transistors includes: a gate electrode formed on a semiconductor substrate via a gate insulation film; and diffusion layers formed to sandwich the gate electrode therebetween and functioning as drain/source layers. Upper layer wirings are provided above the diffusion layers and provided with a predetermined voltage to prevent depletion of the diffusion layers at least when the transfer transistors become conductive.
摘要:
A nonvolatile semiconductor memory according to an aspect of the invention includes memory cell arrays including plural cell units, a power supply pad disposed on one end in a first direction of the memory cell arrays, and page buffers disposed in the first direction of the memory cell arrays. The nonvolatile semiconductor memory also includes plural bit lines which are disposed on the memory cell arrays while extending in the first direction and a first power supply line which is disposed on the plural bit lines on the memory cell arrays to connect the power supply pad and the page buffers.
摘要:
According to one embodiment, a semiconductor memory device includes first and second select transistors, memory cells, a driver circuit, first transfer transistors, and a detection circuit. The memory cells are stacked above a semiconductor substrate. The driver circuit outputs a first voltage. The first transfer transistors transfer the first voltage to associated word lines and select gate lines. In data erase, the detection circuit detects a second voltage applied to bit lines and/or a source line and generates a flag in accordance with the detection result. The driver circuit changes the value of the first voltage in response to the flag to cut off the first transfer transistors.
摘要:
A semiconductor memory device including a memory cell array with NAND cell units arranged therein, the NAND cell unit having a plurality of electrically rewritable and non-volatile memory cells connected in series, first and second select gate transistors disposed for coupling the both ends of the NAND cell unit to a bit line and a source line, respectively, and a dummy cell disposed adjacent to at least one of the first and second select gate transistors, wherein after erasing the memory cells in an erase unit, the memory cells excepting the dummy cell are subject to soft-program.
摘要:
A semiconductor memory according to an example of the present invention is provided with a memory cell array, a plurality of word lines provided on the memory cell array, and a plurality of transfer transistors each one of which is connected to each of the plurality of word lines. Direction of one of the plurality of transfer transistors is different from direction of another one of the transfer transistors.
摘要:
A non-volatile semiconductor storage device includes: a memory cell array having memory cells arranged therein, the memory cells storing data in a non-volatile manner; and a plurality of transfer transistors transferring a voltage to the memory cells, the voltage to be supplied for data read, write and erase operations with respect to the memory cells. Each of the transfer transistors includes: a gate electrode formed on a semiconductor substrate via a gate insulation film; and diffusion layers formed to sandwich the gate electrode therebetween and functioning as drain/source layers. Upper layer wirings are provided above the diffusion layers and provided with a predetermined voltage to prevent depletion of the diffusion layers at least when the transfer transistors become conductive.
摘要:
A nonvolatile semiconductor memory according to an aspect of the invention includes memory cell arrays including plural cell units, a power supply pad disposed on one end in a first direction of the memory cell arrays, and page buffers disposed in the first direction of the memory cell arrays. The nonvolatile semiconductor memory also includes plural bit lines which are disposed on the memory cell arrays while extending in the first direction and a first power supply line which is disposed on the plural bit lines on the memory cell arrays to connect the power supply pad and the page buffers.
摘要:
A nonvolatile semiconductor memory device comprises: a memory cell array including a plurality of memory cell units each including memory cells, a plurality of bit lines, and a common source line; a sense amplifier operative to read data from a selected memory cell; a control circuit operative to control a read operation of the sense amplifier; and a cell source monitoring circuit operative to detect a voltage of the common source line, compare the detected voltage of the common source line with a reference voltage, and output a read control signal. The sense amplifier is configured to read data from the selected memory cell through at least two cycles. The control circuit is configured to perform control to determine whether the data reading is to be ended after a first reading cycle or a second reading cycle is to be carried out, based on the read control signal.
摘要:
A NAND flash memory includes a semiconductor substrate, a well region in the semiconductor substrate, memory cells connected in series in the well region, a discharge circuit connected to the well region, a word line connected to the memory cells, and a control circuit which controls potentials of the well region and the word line. The control circuit set the well region to a first potential, and set the word line to a second potential lower than the first potential, in an erase operation. The discharge circuit comprises a constant current source with a constant discharge speed independent on a temperature, and discharges the well region after the erase operation.
摘要:
A nonvolatile semiconductor memory device includes: a memory cell array configured to have a plurality of blocks arranged thereon, each of the blocks being configured by an assembly of NAND cell units, each of the NAND cell units including a plurality of nonvolatile memory cells connected in series and word lines configured to commonly connect control gates of the memory cells. A data erase operation is executed by first applying a pre-charge voltage to the word lines, then setting to a floating state the word lines in a non-selected block where erasure of data is not to be executed, applying a certain voltage to the word lines in a selected block where erasure of data is to be executed and applying an erase voltage to a well where the memory cell array is formed, thereby altering a threshold voltage of the memory cells in the selected block.