公开(公告)号：US07863761B2

公开(公告)日：2011-01-04

申请号：US11833646

申请日：2007-08-03

申请人： Dal Jae Lee ,  Nam Ju Cho ,  Soo-San Park ,  Jaepil Kim ,  Sungpil Hur ,  Hyeong Kug Jin ,  JongMin Han ,  SungJae Lim ,  HyoungChul Kwon

发明人： Dal Jae Lee ,  Nam Ju Cho ,  Soo-San Park ,  Jaepil Kim ,  Sungpil Hur ,  Hyeong Kug Jin ,  JongMin Han ,  SungJae Lim ,  HyoungChul Kwon

IPC分类号： H01L23/28 ,  H01L21/44

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L21/565 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48455 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package system comprising: providing a substrate; attaching an integrated circuit die over the substrate; attaching a connector to the integrated circuit die and the substrate; and forming an encapsulant over the substrate, the integrated circuit die, and the connector and minimizing ambient gas deformation of the substrate to keep the connector from touching another connector.

摘要翻译： 一种集成电路封装系统，包括：提供衬底; 在衬底上附着集成电路管芯; 将连接器附接到集成电路管芯和衬底; 以及在衬底，集成电路管芯和连接器上形成密封剂，并且最小化衬底的环境气体变形以保持连接器不会接触另一个连接器。

公开(公告)号：US20080029873A1

公开(公告)日：2008-02-07

申请号：US11833646

申请日：2007-08-03

申请人： Dal Jae Lee ,  Nam Ju Cho ,  Soo-San Park ,  Jaepil Kim ,  Sungpil Hur ,  Hyeong Kug Jin ,  JongMin Han ,  SungJae Lim ,  HyoungChul Kwon

发明人： Dal Jae Lee ,  Nam Ju Cho ,  Soo-San Park ,  Jaepil Kim ,  Sungpil Hur ,  Hyeong Kug Jin ,  JongMin Han ,  SungJae Lim ,  HyoungChul Kwon

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L21/565 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48455 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package system comprising: providing a substrate; attaching an integrated circuit die over the substrate; attaching a connector to the integrated circuit die and the substrate; and forming an encapsulant over the substrate, the integrated circuit die, and the connector and minimizing ambient gas deformation of the substrate to keep the connector from touching another connector.

摘要翻译： 一种集成电路封装系统，包括：提供衬底; 在衬底上附着集成电路管芯; 将连接器附接到集成电路管芯和衬底; 以及在衬底，集成电路管芯和连接器上形成密封剂，并且最小化衬底的环境气体变形以保持连接器不接触另一个连接器。

公开(公告)号：US20100085506A1

公开(公告)日：2010-04-08

申请号：US12549711

申请日：2009-08-28

申请人： Hyo Jin Kim ,  Jae Won Shin ,  Dal Jae Lee

发明人： Hyo Jin Kim ,  Jae Won Shin ,  Dal Jae Lee

IPC分类号： G02F1/1335 ,  F21V7/22

CPC分类号： G02B6/0083 ,  G02B6/0086 ,  G02F1/133615 ,  G02F2201/58 ,  G09G3/3413 ,  G09G2320/0242 ,  G09G2320/0666 ,  G09G2360/145

摘要： A backlight unit having improved reliability is disclosed.The backlight unit includes a support main formed of a mold having a rectangular frame shape, a plurality of LEDs arranged at a side of the support main, a light guide plate arranged parallel to the plurality of LEDs and converting a point light to a surface light, an optical sensor unit arranged at the other side of the support main and detecting light emitted from the plurality of LEDs, and a light incident hole formed at the other side of the support main corresponding to the optical sensor unit and guiding light output from the light guide plate to proceed toward the optical sensor unit by changing a path of the light.

摘要翻译： 公开了具有提高的可靠性的背光单元。 背光单元包括由具有矩形框架形状的模具形成的支撑主体，布置在支撑主体侧的多个LED，平行于多个LED并且将点光转换成表面光的导光板 布置在所述支撑主体的另一侧并检测从所述多个LED发射的光的光学传感器单元，以及形成在所述支撑主体的与所述光学传感器单元相对应的另一侧的光入射孔， 导光板通过改变光的路径而朝向光学传感器单元。

公开(公告)号：US09121988B2

公开(公告)日：2015-09-01

申请号：US13561212

申请日：2012-07-30

申请人： Dal Jae Lee

发明人： Dal Jae Lee

IPC分类号： F21V8/00 ,  G02F1/1333 ,  F21S8/00 ,  F21V17/00

CPC分类号： G02B6/0068 ,  F21S8/00 ,  F21V17/00 ,  G02B6/0011 ,  G02B6/0031 ,  G02B6/0073 ,  G02B6/009 ,  G02B6/0091 ,  G02F2001/133314 ,  G02F2001/133317 ,  Y10T29/53087

摘要： The present invention relates to a back light unit including a bottom case; a first light source unit comprising first light sources and a first board, wherein the first light sources are placed above the first board; a second light source unit comprising second light sources and a second board, wherein the second light sources are placed below the second board; a light guide plate disposed between the first and second light sources; and a support main disposed above the light guide plate. The present invention also relates to an LCD device including the same and a method of making the same.

摘要翻译： 背光单元技术领域本发明涉及一种包括底壳的背光单元; 第一光源单元，包括第一光源和第一板，其中所述第一光源被放置在所述第一板的上方; 第二光源单元，包括第二光源和第二板，其中所述第二光源放置在所述第二板的下方; 布置在第一和第二光源之间的导光板; 以及设置在导光板上方的支撑主体。 本发明还涉及一种包括其的LCD装置及其制造方法。

公开(公告)号：US08054403B2

公开(公告)日：2011-11-08

申请号：US12549711

申请日：2009-08-28

申请人： Hyo Jin Kim ,  Jae Won Shin ,  Dal Jae Lee

发明人： Hyo Jin Kim ,  Jae Won Shin ,  Dal Jae Lee

IPC分类号： G02F1/1335 ,  F21V7/22

CPC分类号： G02B6/0083 ,  G02B6/0086 ,  G02F1/133615 ,  G02F2201/58 ,  G09G3/3413 ,  G09G2320/0242 ,  G09G2320/0666 ,  G09G2360/145

摘要： A backlight unit having improved reliability is disclosed.The backlight unit includes a support main formed of a mold having a rectangular frame shape, a plurality of LEDs arranged at a side of the support main, a light guide plate arranged parallel to the plurality of LEDs and converting a point light to a surface light, an optical sensor unit arranged at the other side of the support main and detecting light emitted from the plurality of LEDs, and a light incident hole formed at the other side of the support main corresponding to the optical sensor unit and guiding light output from the light guide plate to proceed toward the optical sensor unit by changing a path of the light.

摘要翻译： 公开了具有提高的可靠性的背光单元。 背光单元包括由具有矩形框架形状的模具形成的支撑主体，布置在支撑主体侧的多个LED，平行于多个LED并且将点光转换成表面光的导光板 布置在所述支撑主体的另一侧并检测从所述多个LED发射的光的光学传感器单元，以及形成在所述支撑主体的与所述光学传感器单元相对应的另一侧的光入射孔， 导光板通过改变光的路径而朝向光学传感器单元。