专利检索 ap:("Danfoss Silicon Power GmbH") AND inv:"David Benning" 第 1 页

1.

发明授权
Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other 有权

公开(公告)号：US12125817B2

公开(公告)日：2024-10-22

申请号：US17608856

申请日：2020-05-06

申请人： Danfoss Silicon Power GmbH

发明人： Martin Becker , André Bastos Abibe , Ronald Eisele , Jacek Rudzki , Frank Osterwald , David Benning

IPC分类号： H01L23/00 , H01L23/498

CPC分类号： H01L24/40 , H01L23/49833 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/85 , H01L2224/29139 , H01L2224/32225 , H01L2224/32245 , H01L2224/4001 , H01L2224/40091 , H01L2224/40095 , H01L2224/40225 , H01L2224/48011 , H01L2224/48245 , H01L2224/73213 , H01L2224/73221 , H01L2224/73263 , H01L2224/8384 , H01L2224/8484 , H01L2224/85203 , H01L2924/10272 , H01L2924/351 , H01L2924/37001

摘要： Semiconductor module having a first substrate, a second substrate and a spacer distancing the substrates from each other, wherein the spacer is formed by at least one elastic shaped metal body.

2.

发明申请
SEMICONDUCTOR MODULE WITH A FIRST SUBSTRATE, A SECOND SUBSTRATE AND A SPACER SEPARATING THE SUBSTRATES FROM EACH OTHER 有权

公开(公告)号：US20220302073A1

公开(公告)日：2022-09-22

申请号：US17608856

申请日：2020-05-06

申请人： Danfoss Silicon Power GmbH

发明人： Martin Becker , André Bastos Abibe , Ronald Eisele , Jacek Rudzki , Frank Osterwald , David Benning

IPC分类号： H01L23/00 , H01L23/498

摘要： Semiconductor module having a first substrate, a second substrate and a spacer distancing the substrates from each other, wherein the spacer is formed by at least one elastic shaped metal body.

3.

发明申请
SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SHAPED METAL BODY THAT IS ELECTRICALLY CONTACTED BY THE SEMICONDUCTOR 有权

公开(公告)号：US20220302072A1

公开(公告)日：2022-09-22

申请号：US17608770

申请日：2020-04-30

申请人： Danfoss Silicon Power GmbH

发明人： André Bastos Abibe , Frank Osterwald , Jacek Rudzki , Martin Becker , Ronald Eisele , David Benning

IPC分类号： H01L23/00

摘要： Semiconductor module including a semiconductor and including a shaped metal body that is electrically contacted by the semiconductor, for forming a contact surface for an electrical conductor, wherein the shaped metal body is bent or folded. A method is also described for establishing electrical contacting of an electrical conductor on a semiconductor, said method including the steps of: fastening a bent or folded shaped metal body of a constant thickness to the semiconductor by means of a first fastening method and then fastening the electrical conductor to the shaped metal body by means of a second fastening method.