公开(公告)号：US20180240904A1

公开(公告)日：2018-08-23

申请号：US15853357

申请日：2017-12-22

申请人： Silanna Asia Pte Ltd

发明人： Shanghui Larry Tu ,  Michael A. Stuber ,  Befruz Tasbas ,  Stuart B. Molin ,  Raymond Jiang

IPC分类号： H01L29/786 ,  H01L21/768 ,  H01L21/48 ,  H01L21/84 ,  H01L23/48 ,  H01L23/495 ,  H01L23/00 ,  H01L27/12 ,  H01L29/10 ,  H01L29/66 ,  H01L29/78 ,  H01L29/417

CPC分类号： H01L29/786 ,  H01L21/4825 ,  H01L21/4853 ,  H01L21/743 ,  H01L21/76898 ,  H01L21/84 ,  H01L23/481 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/49517 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/5225 ,  H01L23/535 ,  H01L24/32 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/84 ,  H01L25/50 ,  H01L27/1203 ,  H01L27/1207 ,  H01L29/0649 ,  H01L29/1087 ,  H01L29/1095 ,  H01L29/41766 ,  H01L29/66659 ,  H01L29/66681 ,  H01L29/66696 ,  H01L29/7816 ,  H01L29/7824 ,  H01L29/7835 ,  H01L2224/32245 ,  H01L2224/4001 ,  H01L2224/40141 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48247 ,  H01L2224/73213 ,  H01L2224/73265 ,  H01L2924/00

摘要： A semiconductor package includes a leadframe, having perimeter package leads and a ground voltage lead, a bottom semiconductor die flip-chip mounted to the leadframe, and a top semiconductor die. The bottom semiconductor die has a first frontside active layer with first frontside electrical contacts electrically connected to the leadframe, a first backside portion, and a buried oxide layer situated between the first frontside active layer and the first backside portion. The top semiconductor die is mounted to the first backside portion. The first frontside active layer includes a circuit electrically connected to the first backside portion by a backside electrical connection through the buried oxide layer. The first backside portion of the bottom semiconductor die is electrically connected to the ground voltage lead through a first electrical contact of the first frontside electrical contacts to minimize crosstalk.

公开(公告)号：US20180240876A1

公开(公告)日：2018-08-23

申请号：US15899911

申请日：2018-02-20

申请人： Silanna Asia Pte Ltd

发明人： Shanghui Larry Tu ,  Michael A. Stuber ,  Befruz Tasbas ,  Stuart B. Molin ,  Raymond Jiang

IPC分类号： H01L29/10 ,  H01L21/74 ,  H01L21/84 ,  H01L29/06 ,  H01L29/66 ,  H01L27/12 ,  H01L29/78

CPC分类号： H01L29/786 ,  H01L21/4825 ,  H01L21/4853 ,  H01L21/743 ,  H01L21/76898 ,  H01L21/84 ,  H01L23/481 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/49517 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/5225 ,  H01L23/535 ,  H01L24/32 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/84 ,  H01L25/50 ,  H01L27/1203 ,  H01L27/1207 ,  H01L29/0649 ,  H01L29/1087 ,  H01L29/1095 ,  H01L29/41766 ,  H01L29/66659 ,  H01L29/66681 ,  H01L29/66696 ,  H01L29/7816 ,  H01L29/7824 ,  H01L29/7835 ,  H01L2224/32245 ,  H01L2224/4001 ,  H01L2224/40141 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48247 ,  H01L2224/73213 ,  H01L2224/73265 ,  H01L2924/00

摘要： In an active layer over a semiconductor substrate, a semiconductor device has a first lateral diffusion field effect transistor (LDFET) that includes a source, a drain, and a gate, and a second LDFET that includes a source, a drain, and a gate. The source of the first LDFET and the drain of the second LDFET are electrically connected to a common node. A first front-side contact and a second front-side contact are formed over the active layer, and a substrate contact electrically connected to the semiconductor substrate is formed. Each of the first front-side contact, the second front-side contact, and the substrate contact is electrically connected to a different respective one of the drain of the first LDFET, the source of the second LDFET, and the common node.

公开(公告)号：US08692361B2

公开(公告)日：2014-04-08

申请号：US13562177

申请日：2012-07-30

申请人： Joachim Mahler ,  Edward Fuergut ,  Khalil Hosseini ,  Georg Meyer-Berg

发明人： Joachim Mahler ,  Edward Fuergut ,  Khalil Hosseini ,  Georg Meyer-Berg

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/296 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/19 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05681 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/29116 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/40249 ,  H01L2224/4103 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/73213 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2224/8381 ,  H01L2224/8382 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10335 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01049 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A system and method for manufacturing an electric device package are disclosed. An embodiment comprises comprising a first carrier contact, a first electric component, the first electric component having a first top surface and a first bottom surface, the first electric component comprising a first component contact disposed on the first top surface, the first bottom surface being connected to the carrier and an connection element comprising a second electric component and an interconnect element, the connection element having a connection element top surface and a connection element bottom surface, wherein the connection element bottom surface comprises a first connection element contact and a second connection element contact, and wherein the first connection element contact is connected to the first component contact and the second connection element contact is connected to the first carrier contact. The packaged device further comprises an encapsulant encapsulating the first electric component.

摘要翻译： 公开了一种用于制造电子器件封装的系统和方法。 一个实施例包括第一载体接触件，第一电气部件，第一电气部件，具有第一顶部表面和第一底部表面，第一电气部件包括设置在第一顶部表面上的第一部件触点，第一底部表面是 连接到所述载体和包括第二电气部件和互连元件的连接元件，所述连接元件具有连接元件顶表面和连接元件底表面，其中所述连接元件底表面包括第一连接元件触点和第二连接 元件接触，并且其中所述第一连接元件触点连接到所述第一元件触点，并且所述第二连接元件触点连接到所述第一载体触点。 封装装置还包括封装第一电气部件的密封剂。

公开(公告)号：US20120276693A1

公开(公告)日：2012-11-01

申请号：US13548120

申请日：2012-07-12

申请人： Ralf Otremba ,  Xaver Schloegel ,  Khai Huat Jeffrey Low ,  Chee Soon Law

发明人： Ralf Otremba ,  Xaver Schloegel ,  Khai Huat Jeffrey Low ,  Chee Soon Law

IPC分类号： H01L21/50

CPC分类号： H01L23/49503 ,  B81C1/00301 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/00 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/84 ,  H01L24/85 ,  H01L24/91 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/37144 ,  H01L2224/40245 ,  H01L2224/4103 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/73213 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/84801 ,  H01L2224/85045 ,  H01L2224/85099 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85801 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1304 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2924/01016 ,  H01L2924/01026 ,  H01L2924/01201

摘要： A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.

摘要翻译： 模块包括具有至少第一端子接触表面和第二端子接触表面的半导体芯片。 由基于Cu的材料制成的第一接合元件附接到第一端子接触表面，并且第二接合元件附接到第二端子接触表面。 第二结合元件由与第一结合元件的材料不同的材料制成，或者由不同于第一粘结元件的类型的粘结元件制成。

公开(公告)号：US20180047649A1

公开(公告)日：2018-02-15

申请号：US15655617

申请日：2017-07-20

申请人： Renesas Electronics Corporation

发明人： Koji BANDO ,  Akira MUTO

IPC分类号： H01L23/053 ,  H01L23/057 ,  H01L23/00 ,  H01L25/18 ,  H01L23/50 ,  H01L25/07 ,  H01L23/495

CPC分类号： H01L23/053 ,  H01L23/057 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/50 ,  H01L24/32 ,  H01L24/33 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L25/115 ,  H01L25/18 ,  H01L29/7395 ,  H01L29/7802 ,  H01L29/8611 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40101 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48175 ,  H01L2224/73213 ,  H01L2224/73215 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2924/12036 ,  H01L2924/13055 ,  H01L2924/13091 ,  H02M7/003

摘要： Each of first and second semiconductor devices mounted on a substrate includes an emitter terminal electrically connected with a front surface electrode of a semiconductor chip and exposed from a main surface of a sealing body located on a front surface side of the semiconductor chip. Each of the first and second semiconductor devices includes a collector terminal electrically connected with a back surface electrode of the semiconductor chip and exposed from the main surface of the sealing body located on a back surface side of the semiconductor chip. The collector terminal of the first semiconductor device is electrically connected with the emitter terminal of the second semiconductor device via a conductor pattern formed on an upper surface of the substrate.

公开(公告)号：US09698091B2

公开(公告)日：2017-07-04

申请号：US14754167

申请日：2015-06-29

申请人： Mitsubishi Electric Corporation

发明人： Shinsuke Asada ,  Naoki Yoshimatsu ,  Yuji Imoto ,  Yusuke Ishiyama ,  Junji Fujino

IPC分类号： H05K7/00 ,  H01L23/498 ,  H01L23/00 ,  H01L23/373 ,  H01L23/057 ,  H01L23/29 ,  H01L25/07 ,  H01L23/24

CPC分类号： H01L23/49827 ,  H01L23/057 ,  H01L23/24 ,  H01L23/295 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/37 ,  H01L24/40 ,  H01L25/072 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/37011 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40095 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/73213 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A power semiconductor device includes an insulating substrate, a semiconductor element, a case, and a wiring member. The case forms a container body having a bottom surface defined by a surface of the insulating substrate, to which said semiconductor element is bonded. The wiring member has a bonding portion positioned above an upper surface electrode of the semiconductor element. The bonding portion of the wiring member is provided with a projection portion projecting toward the upper surface electrode of the semiconductor element and bonded to the upper surface electrode with a solder, and a through hole passing through the bonding portion in a thickness direction through the projection portion.

公开(公告)号：US09620475B2

公开(公告)日：2017-04-11

申请号：US14546854

申请日：2014-11-18

申请人： Infineon Technologies Americas Corp.

发明人： Eung San Cho

IPC分类号： H01L29/15 ,  H01L23/00 ,  H01L23/433 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L24/73 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/27436 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29295 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48245 ,  H01L2224/73213 ,  H01L2224/73215 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/83191 ,  H01L2224/83424 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84424 ,  H01L2224/84444 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2224/8485 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/92 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2924/00012

摘要： In one implementation, a method of fabricating a power semiconductor package is disclosed. The method includes providing a conductive carrier array including a plurality of power modules held together with connecting bars, where each of the plurality of power modules includes a control transistor, a sync transistor, and a driver IC. The method further includes overlying on the conductive carrier array a heat spreader array including a plurality of power electrode heat spreaders such that each of the plurality of power electrode heat spreaders couples a drain of the sync transistor to a source of the control transistor in each power module.

公开(公告)号：US09117811B2

公开(公告)日：2015-08-25

申请号：US13158797

申请日：2011-06-13

申请人： Wael Zohni

发明人： Wael Zohni

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L23/49811 ,  H01L21/4846 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/84 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11003 ,  H01L2224/11332 ,  H01L2224/1134 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/13566 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/16111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/1624 ,  H01L2224/32225 ,  H01L2224/40106 ,  H01L2224/4024 ,  H01L2224/40475 ,  H01L2224/41176 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4813 ,  H01L2224/48225 ,  H01L2224/484 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/73204 ,  H01L2224/73213 ,  H01L2224/81192 ,  H01L2224/8184 ,  H01L2224/84 ,  H01L2224/8502 ,  H01L2224/85355 ,  H01L2224/8584 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/37099

摘要： A microelectronic package includes a substrate overlying the front face of a microelectronic element. A plurality of metal bumps can project from conductive elements of the substrate towards the microelectronic element, the metal bumps having first ends extending from the conductive elements, second ends remote from the conductive elements, and lateral surfaces extending between the first and second ends. A conductive matrix material can contact the second ends and at least portions of the lateral surfaces of respective ones of the metal bumps and join the metal bumps with contacts of the microelectronic element.

摘要翻译： 微电子封装包括覆盖在微电子元件的前表面上的衬底。 多个金属凸块可以从基板的导电元件朝向微电子元件突出，金属凸块具有从导电元件延伸的第一端，远离导电元件的第二端以及在第一和第二端之间延伸的侧表面。 导电基质材料可接触金属凸块中相应金属凸块的第二端和至少部分横向表面，并将金属凸块与微电子元件的触点接合。

公开(公告)号：US20150162303A1

公开(公告)日：2015-06-11

申请号：US14546854

申请日：2014-11-18

申请人： International Rectifier Corporation

发明人： Eung San Cho

IPC分类号： H01L23/00 ,  H01L27/06 ,  H01L23/34 ,  H01L27/088

CPC分类号： H01L24/73 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/27436 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29295 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48245 ,  H01L2224/73213 ,  H01L2224/73215 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/83191 ,  H01L2224/83424 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84424 ,  H01L2224/84444 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2224/8485 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/92 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2924/00012

摘要： In one implementation, a method of fabricating a power semiconductor package is disclosed. The method includes providing a conductive carrier array including a plurality of power modules held together with connecting bars, where each of the plurality of power modules includes a control transistor, a sync transistor, and a driver IC. The method further includes overlying on the conductive carrier array a heat spreader array including a plurality of power electrode heat spreaders such that each of the plurality of power electrode heat spreaders couples a drain of the sync transistor to a source of the control transistor in each power module.

摘要翻译： 在一个实施方式中，公开了一种制造功率半导体封装的方法。 该方法包括提供包括与连接条保持在一起的多个功率模块的导电载体阵列，其中多个功率模块中的每一个包括控制晶体管，同步晶体管和驱动器IC。 该方法还包括在导电载体阵列上覆盖散热器阵列，散热器阵列包括多个功率电极散热器，使得多个功率电极散热器中的每一个在每个功率中将同步晶体管的漏极耦合到控制晶体管的源极 模块。

公开(公告)号：US20130214404A1

公开(公告)日：2013-08-22

申请号：US13773443

申请日：2013-02-21

申请人： Norimune ORIMOTO

发明人： Norimune ORIMOTO

IPC分类号： H01L23/498

CPC分类号： H01L23/49838 ,  H01L23/051 ,  H01L24/06 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L25/117 ,  H01L2224/06181 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/50 ,  H01L2224/73213 ,  H01L2224/73263 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/10337 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/00

摘要： A semiconductor module includes a semiconductor element, a case member, a cylindrical body, a lid member, a bus bar, and an insulating plate. The case member includes a bottom member and an extended portion. Eight protruding portions are formed on an outer peripheral surface of the cylindrical body. Eight recessed portions are formed on an inner surface of a central hole of the bus bar. The cylindrical body is inserted into the central hole of the bus bar. The protruding portions of the cylindrical body are engaged with the recessed portions of the bus bar. A direction in which an extended portion of the bus bar extends is fixed in one direction, from among a plurality of directions in a circumferential direction of the cylindrical body, by engagement of the protruding portions with the recessed portions.

摘要翻译： 半导体模块包括半导体元件，壳体构件，圆柱体，盖构件，汇流条和绝缘板。 壳体构件包括底部构件和延伸部分。 在圆筒体的外周面上形成有8个突出部。 在母线的中心孔的内表面上形成有八个凹部。 圆筒体插入母线的中心孔。 圆柱体的突出部与母线的凹部接合。 汇流条延伸部分的延伸部分的方向通过突出部与凹部的接合而沿圆筒体的圆周方向上的多个方向沿一个方向固定。