公开(公告)号：US5142239A

公开(公告)日：1992-08-25

申请号：US702490

申请日：1991-05-20

申请人： Daniel C. Brayton ,  Ngai-Ming Lau

发明人： Daniel C. Brayton ,  Ngai-Ming Lau

IPC分类号： H03F1/22 ,  H03F1/42 ,  H03F3/191 ,  H03F3/60 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K1/16 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36

CPC分类号： H03F3/191 ,  H05K1/141 ,  H05K1/0216 ,  H05K1/0237 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/167 ,  H05K2201/0792 ,  H05K2201/10166 ,  H05K2203/049 ,  H05K3/328 ,  H05K3/341 ,  H05K3/368

摘要： A wide bandwidth linear amplifier (10) that has an operating band in excess of 1 GHz mounts the high power dissipating components (11) of the amplifier (10), and the components 917, 18) that control the high frequency gain and stability of the amplifier (10) onto a daughter board (32) that has a high thermal conductivity. The daughter board (32) and the remaining circuit components (21, 22, 23, 24, 26a, 26b) are then mounted on a mother board (31) that has a lower thermal conductivity. The assembly (30) reduces the circuit's parasitic inductance (46, 47, 48, 49) and parasitic capacitance (51, 52), and provides unconditional stability at high frequencies.

摘要翻译： 具有超过1GHz的工作频带的宽带宽线性放大器（10）安装放大器（10）的高功率耗散部件（11）和控制高频增益和稳定性的部件917,18） 放大器（10）到具有高导热性的子板（32）上。 然后将子板（32）和剩余的电路部件（21,22,23,24,26a，26b）安装在具有较低热导率的母板（31）上。 组件（30）减小了电路的寄生电感（46,47,48,49）和寄生电容（51,52），并在高频下提供了无条件的稳定性。