公开(公告)号：US06733823B2

公开(公告)日：2004-05-11

申请号：US10114211

申请日：2002-04-02

申请人： David M. Lee ,  Arthur S. Francomacaro ,  Seppo J. Lehtonen ,  Harry K. Charles, Jr.

发明人： David M. Lee ,  Arthur S. Francomacaro ,  Seppo J. Lehtonen ,  Harry K. Charles, Jr.

IPC分类号： B05D512

CPC分类号： H05K3/244 ,  C23C18/1651 ,  C23C18/1844 ,  C23C18/54

摘要： A method of electrolessly gold plating copper on a printed circuit board (PCB). Starting with a copper patterned PCB, steps include: clean with ultrasonic agitation with the PCB initially oriented vertically and gradually moved to a 45° angle; rinse; sulfuric acid bath with ultrasonic and mechanical agitation; rinse; another sulfuric acid bath with ultrasonic and mechanical agitation; plate the copper with palladium with ultrasonic agitation with the PCB initially oriented at a 45° angle and flipped half way through to opposing 45° angle; rinse; post dip in sulfuric acid; rinse; electrolessly nickel plate with mechanical agitation; rinse; nitrogen blow dry; visual inspection for nickel coverage of the copper; hydrochloric acid bath with manual agitation; rinse; if full nickel coverage was not achieved, repeat preceding steps starting with second sulfuric acid bath; gold flash plate to establish a first layer of gold; rinse; autocatalytic gold plate; rinse; and nitrogen blow dry.

摘要翻译： 在印刷电路板（PCB）上无电镀金铜的方法。 从铜图案化PCB开始，步骤包括：使用超声波搅拌清洁PCB，PCB最初垂直定向并逐渐移动到45°角; 冲洗; 硫酸浴用超声波和机械搅拌; 冲洗; 超声波和机械搅拌的另一种硫酸浴; 用钯超声波搅拌用铜板将铜最初定向成45°的角度，并以一半的方式翻转到相对的45°角; 冲洗; 硫酸后浸渍; 冲洗; 无电镀镍板机械搅拌; 冲洗; 氮吹干燥; 铜的镍覆盖目视检查; 手动搅拌的盐酸浴; 冲洗; 如果未达到全镍覆盖率，则从第二次硫酸浴开始重复前述步骤; 金闪盘建立第一层金; 冲洗; 自催化金板; 冲洗; 并吹氮。

公开(公告)号：US06881593B2

公开(公告)日：2005-04-19

申请号：US10159682

申请日：2002-05-31

申请人： Binh Q. Le ,  Ark L. Lew ,  Harry K. Charles, Jr. ,  Paul D. Schwartz ,  Seppo J. Lehtonen ,  Sharon X. Ling

发明人： Binh Q. Le ,  Ark L. Lew ,  Harry K. Charles, Jr. ,  Paul D. Schwartz ,  Seppo J. Lehtonen ,  Sharon X. Ling

IPC分类号： G01R1/04 ,  G01R31/28 ,  H01L23/498 ,  H01L21/66

CPC分类号： H01L23/49827 ,  G01R1/0416 ,  G01R31/2884 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/32145 ,  H01L2224/45099 ,  H01L2224/4826 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/49109 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor die adapter assembly includes a semiconductor die cut from a wafer, the die having an active surface including bond pads. A die adapter, also having bond pads, is bonded to the semiconductor die. Die-to-adapter connectors electrically connect the die bond pads to the adapter bond pads. Finally, adapter-to-substrate connectors electrically connect the adapter bond pads to a device substrate. Having bond pads on the die adapter eliminates the need to break and remake the electrical connections to the original bond pads on the die during burn-in testing of the die.

摘要翻译： 半导体管芯适配器组件包括从晶片切割的半导体管芯，该管芯具有包括接合焊盘的活性表面。 还具有接合焊盘的芯片适配器被结合到半导体管芯。 管芯到适配器连接器将管芯接合焊盘电连接到适配器接合焊盘。 最后，适配器到基板连接器将适配器接合焊盘电连接到器件衬底。 在裸片适配器上具有接合垫消除了在裸片的老化测试期间破坏并重新制造与芯片上的原始接合焊盘的电连接的需要。