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    Method of manufacturing ultrasound transducer device having acoustic backing
    1.
    发明申请
    Method of manufacturing ultrasound transducer device having acoustic backing 有权
    制造具有声学背衬的超声波换能器装置的方法

    公开(公告)号：US20050046311A1

    公开(公告)日：2005-03-03

    申请号：US10960871

    申请日：2004-10-06

    申请人： Charles Baumgartner ,  David Mills ,  Robert Lewandowski ,  Lowell Smith ,  Douglas Wildes

    发明人： Charles Baumgartner ,  David Mills ,  Robert Lewandowski ,  Lowell Smith ,  Douglas Wildes

    IPC分类号： G01N29/24 ,  A61B8/00 ,  A61B8/14 ,  B06B1/02 ,  B06B1/06 ,  B81B3/00 ,  G01H11/06 ,  H01L41/053 ,  H01L41/08 ,  H01L41/09 ,  H01L41/187 ,  H01L41/193 ,  H02N2/00 ,  H04R1/32 ,  H04R17/00 ,  H04R19/00

    CPC分类号： B06B1/0292 ,  B06B1/0685 ,  B06B1/0688 ,  G01H11/06 ,  Y10T29/49004 ,  Y10T29/49005 ,  Y10T29/4908

    摘要： An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface. The backing material may also possess a high thermal conductivity to assist in removal of heat from the device.

    摘要翻译： 一种超声波换能器装置，包括：微机械加工在基底上的超声换能器阵列; 连接到换能器阵列的柔性电连接; 以及支撑衬底和柔性电连接的声衰减材料体。 声学衬垫材料可以包含附加特征，例如突片或凹口，用于在最终组装期间制造或将换能器定位在壳体内时将换能器定位在固定装置上。 仅在制造期间使用的标签或其它特征可随后从装置中移除。 MUT设备本身也可以被减薄，以便根据需要提供灵活性。 背衬材料优选地与硅晶片的声阻抗匹配，以便防止在向后传播的任何声能的界面处的反射，即远离器件前表面的方向上的反射。 背衬材料还可以具有高热导率以帮助从装置移除热量。

    Backing material for micromachined ultrasonic transducer devices
    3.
    发明申请
    Backing material for micromachined ultrasonic transducer devices 审中-公开
    用于微加工超声波换能器的支撑材料

    公开(公告)号：US20050043628A1

    公开(公告)日：2005-02-24

    申请号：US10959343

    申请日：2004-10-06

    申请人： Charles Baumgartner ,  David Mills ,  Robert Lewandowski ,  Lowell Smith ,  Douglas Wildes

    发明人： Charles Baumgartner ,  David Mills ,  Robert Lewandowski ,  Lowell Smith ,  Douglas Wildes

    IPC分类号： G01N29/24 ,  A61B8/00 ,  A61B8/14 ,  B06B1/02 ,  B06B1/06 ,  B81B3/00 ,  G01H11/06 ,  H01L41/053 ,  H01L41/08 ,  H01L41/09 ,  H01L41/187 ,  H01L41/193 ,  H02N2/00 ,  H04R1/32 ,  H04R17/00 ,  H04R19/00

    CPC分类号： B06B1/0292 ,  B06B1/0685 ,  B06B1/0688 ,  G01H11/06 ,  Y10T29/49004 ,  Y10T29/49005 ,  Y10T29/4908

    摘要： An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface. The backing material may also possess a high thermal conductivity to assist in removal of heat from the device.

    摘要翻译： 一种超声波换能器装置，包括：微机械加工在基底上的超声换能器阵列; 连接到换能器阵列的柔性电连接; 以及支撑衬底和柔性电连接的声衰减材料体。 声学衬垫材料可以包含附加特征，例如突片或凹口，用于在最终组装期间制造或将换能器定位在壳体内时将换能器定位在固定装置上。 仅在制造期间使用的标签或其它特征可随后从装置中移除。 MUT设备本身也可以被减薄，以便根据需要提供灵活性。 背衬材料优选地与硅晶片的声阻抗匹配，以便防止在向后传播的任何声能的界面处的反射，即远离器件前表面的方向上的反射。 背衬材料还可以具有高热导率以帮助从装置移除热量。

    Ultrasound transducer with additional sensors
    4.
    发明申请
    Ultrasound transducer with additional sensors 审中-公开
    超声波换能器附加传感器

    公开(公告)号：US20060004290A1

    公开(公告)日：2006-01-05

    申请号：US10881986

    申请日：2004-06-30

    申请人： Lowell Smith ,  Rayette Fisher ,  David Mills ,  Charles Baumgartner

    发明人： Lowell Smith ,  Rayette Fisher ,  David Mills ,  Charles Baumgartner

    IPC分类号： A61B8/14

    CPC分类号： A61B8/4483 ,  A61B8/00 ,  G01S7/52079 ,  G01S15/899

    摘要： The present technique provides for the manufacture and/or use of an ultrasound probe configured to acquire non-imaging data in addition to imaging data. In particular, the ultrasound probe includes a micro-machined ultrasound transducer formed on the surface of a substrate using micro-electric mechanical systems techniques or other techniques associated with semiconductor processing. Non-imaging sensors are formed on the substrate, either on the surface or the interior, or on a substrate proximate to the substrate upon which the transducer is formed. The non-imaging sensors may be used to acquire non-imaging data in conjunction with the acquisition of imaging data by the transducer.

    摘要翻译： 本技术提供了除了成像数据之外还配置成获取非成像数据的超声波探头的制造和/或使用。 特别地，超声波探头包括使用微电子机械系统技术或与半导体处理相关的其它技术在基板的表面上形成的微加工的超声换能器。 非成像传感器形成在衬底上，无论是在表面还是内部，或者在靠近形成换能器的衬底的衬底上。 非成像传感器可以用于通过换能器获取成像数据来获取非成像数据。

    Curved micromachined ultrasonic transducer arrays and related methods of manufacture
    5.
    发明申请
    Curved micromachined ultrasonic transducer arrays and related methods of manufacture 有权
    弯曲微加工超声波换能器阵列及相关制造方法

    公开(公告)号：US20050146247A1

    公开(公告)日：2005-07-07

    申请号：US10749645

    申请日：2003-12-31

    申请人： Rayette Fisher ,  David Mills ,  Lowell Smith ,  Robert Lewandowski

    发明人： Rayette Fisher ,  David Mills ,  Lowell Smith ,  Robert Lewandowski

    IPC分类号： G01N29/24 ,  A61B8/00 ,  B06B1/02 ,  B81B1/00 ,  B81B3/00 ,  B81B7/04 ,  B81C1/00 ,  G01S7/521 ,  H01L27/20 ,  H01L41/08 ,  H04R17/00

    CPC分类号： G01N29/2406 ,  B06B1/0292

    摘要： A curved sensor device, such as an ultrasonic transducer array, is fabricated from a flat micromachined sensor (such as cMUT or pMUT) array constructed using micromachined electromechanical systems (MEMS) techniques. The device comprises: a support structure comprising a spine having a profile that is generally curved and a multiplicity of teeth extending from one side of the curved spine; and a multiplicity of sensors built on the support structure. The spine can be bent forward or backward and attached to a curved front face of a support member, thereby causing the sensors to adopt a curved array.

    摘要翻译： 诸如超声换能器阵列的弯曲传感器装置由使用微加工机电系统（MEMS）技术构造的平面微机械传感器（例如cMUT或pMUT）阵列制造。 该装置包括：支撑结构，其包括具有大致弯曲的轮廓的脊柱和从弯曲脊的一侧延伸的多个齿; 以及建立在支撑结构上的多个传感器。 脊柱可以向前或向后弯曲并且附接到支撑构件的弯曲前表面，从而使传感器采用弯曲阵列。

    Micromachined ultrasonic transducer cells having compliant support structure
    6.
    发明申请
    Micromachined ultrasonic transducer cells having compliant support structure 有权
    具有顺应性支撑结构的微加工超声换能器单元

    公开(公告)号：US20050146240A1

    公开(公告)日：2005-07-07

    申请号：US10748920

    申请日：2003-12-29

    申请人： Lowell Smith ,  Douglas Wildes

    发明人： Lowell Smith ,  Douglas Wildes

    IPC分类号： B81B3/00 ,  B81B7/04 ,  B81C1/00 ,  H02N1/00 ,  H02N2/00

    CPC分类号： B06B1/0292 ,  H02N1/006

    摘要： A micromachined ultrasonic transducer array comprising a multiplicity of cMUT cells built on a substrate. Each cMUT cell comprises a compliant support structure built on the substrate, a membrane supported over a cavity by the compliant support structure, a first electrode supported by the membrane, and a second electrode that forms a capacitor with the first electrode, the cavity being disposed between the first and second electrodes. The compliant support structure uncouples the non-membrane outer surface of each cMUT cell from the supporting substrate.

    摘要翻译： 一种微机械加工的超声波换能器阵列，其包括建立在基底上的多个cMUT电池。 每个cMUT单元包括构建在基板上的柔性支撑结构，由柔性支撑结构支撑在空腔上的膜，由膜支撑的第一电极，以及与第一电极形成电容器的第二电极， 在第一和第二电极之间。 顺应性支撑结构将每个cMUT电池的非膜外表面与支撑衬底断开。

    Image-based probe guidance system
    7.
    发明申请
    Image-based probe guidance system 审中-公开
    基于图像的探针引导系统

    公开(公告)号：US20070066880A1

    公开(公告)日：2007-03-22

    申请号：US11223354

    申请日：2005-09-09

    申请人： Warren Lee ,  Mir Seyed-Bolorforosh ,  Douglas Wildes ,  Lowell Smith ,  Kai Thomenius

    发明人： Warren Lee ,  Mir Seyed-Bolorforosh ,  Douglas Wildes ,  Lowell Smith ,  Kai Thomenius

    IPC分类号： A61B5/05

    CPC分类号： A61B8/12 ,  A61B5/06 ,  A61B5/062 ,  A61B5/067

    摘要： A system for guiding probe is presented. The system includes a probe configured to acquire image data representative of a region of interest. Additionally, the system includes an imaging system in operative association with the probe and configured to facilitate guiding the probe to a desirable location based on the acquired image data and indications of change in position of the probe.

    摘要翻译： 介绍了一种引导探针的系统。 该系统包括被配置为获取表示感兴趣区域的图像数据的探针。 另外，该系统包括与探头可操作地相关联的成像系统，并且被配置为便于基于所获取的图像数据和探针的位置变化的指示来将探针引导到期望的位置。

    Micromachined ultrasonic transducer cells having compliant support structure
    8.
    发明申请
    Micromachined ultrasonic transducer cells having compliant support structure 有权

    公开(公告)号：US20060125348A1

    公开(公告)日：2006-06-15

    申请号：US11348984

    申请日：2006-02-07

    申请人： Lowell Smith ,  Douglas Wildes

    发明人： Lowell Smith ,  Douglas Wildes

    IPC分类号： H04R17/00 ,  H04R25/00 ,  H02N1/00

    CPC分类号： B06B1/0292 ,  H02N1/006

    摘要： A micromachined ultrasonic transducer array comprising a multiplicity of cMUT cells built on a substrate. Each cMUT cell comprises a compliant support structure built on the substrate, a membrane supported over a cavity by the compliant support structure, a first electrode supported by the membrane, and a second electrode that forms a capacitor with the first electrode, the cavity being disposed between the first and second electrodes. The compliant support structure uncouples the non-membrane outer surface of each cMUT cell from the supporting substrate.