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    Method of manufacturing ultrasound transducer device having acoustic backing
    1.
    发明申请
    Method of manufacturing ultrasound transducer device having acoustic backing 有权
    制造具有声学背衬的超声波换能器装置的方法

    公开(公告)号：US20050046311A1

    公开(公告)日：2005-03-03

    申请号：US10960871

    申请日：2004-10-06

    申请人： Charles Baumgartner ,  David Mills ,  Robert Lewandowski ,  Lowell Smith ,  Douglas Wildes

    发明人： Charles Baumgartner ,  David Mills ,  Robert Lewandowski ,  Lowell Smith ,  Douglas Wildes

    IPC分类号： G01N29/24 ,  A61B8/00 ,  A61B8/14 ,  B06B1/02 ,  B06B1/06 ,  B81B3/00 ,  G01H11/06 ,  H01L41/053 ,  H01L41/08 ,  H01L41/09 ,  H01L41/187 ,  H01L41/193 ,  H02N2/00 ,  H04R1/32 ,  H04R17/00 ,  H04R19/00

    CPC分类号： B06B1/0292 ,  B06B1/0685 ,  B06B1/0688 ,  G01H11/06 ,  Y10T29/49004 ,  Y10T29/49005 ,  Y10T29/4908

    摘要： An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface. The backing material may also possess a high thermal conductivity to assist in removal of heat from the device.

    摘要翻译： 一种超声波换能器装置，包括：微机械加工在基底上的超声换能器阵列; 连接到换能器阵列的柔性电连接; 以及支撑衬底和柔性电连接的声衰减材料体。 声学衬垫材料可以包含附加特征，例如突片或凹口，用于在最终组装期间制造或将换能器定位在壳体内时将换能器定位在固定装置上。 仅在制造期间使用的标签或其它特征可随后从装置中移除。 MUT设备本身也可以被减薄，以便根据需要提供灵活性。 背衬材料优选地与硅晶片的声阻抗匹配，以便防止在向后传播的任何声能的界面处的反射，即远离器件前表面的方向上的反射。 背衬材料还可以具有高热导率以帮助从装置移除热量。

    Backing material for micromachined ultrasonic transducer devices
    3.
    发明申请
    Backing material for micromachined ultrasonic transducer devices 审中-公开
    用于微加工超声波换能器的支撑材料

    公开(公告)号：US20050043628A1

    公开(公告)日：2005-02-24

    申请号：US10959343

    申请日：2004-10-06

    申请人： Charles Baumgartner ,  David Mills ,  Robert Lewandowski ,  Lowell Smith ,  Douglas Wildes

    发明人： Charles Baumgartner ,  David Mills ,  Robert Lewandowski ,  Lowell Smith ,  Douglas Wildes

    IPC分类号： G01N29/24 ,  A61B8/00 ,  A61B8/14 ,  B06B1/02 ,  B06B1/06 ,  B81B3/00 ,  G01H11/06 ,  H01L41/053 ,  H01L41/08 ,  H01L41/09 ,  H01L41/187 ,  H01L41/193 ,  H02N2/00 ,  H04R1/32 ,  H04R17/00 ,  H04R19/00

    CPC分类号： B06B1/0292 ,  B06B1/0685 ,  B06B1/0688 ,  G01H11/06 ,  Y10T29/49004 ,  Y10T29/49005 ,  Y10T29/4908

    摘要： An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface. The backing material may also possess a high thermal conductivity to assist in removal of heat from the device.

    摘要翻译： 一种超声波换能器装置，包括：微机械加工在基底上的超声换能器阵列; 连接到换能器阵列的柔性电连接; 以及支撑衬底和柔性电连接的声衰减材料体。 声学衬垫材料可以包含附加特征，例如突片或凹口，用于在最终组装期间制造或将换能器定位在壳体内时将换能器定位在固定装置上。 仅在制造期间使用的标签或其它特征可随后从装置中移除。 MUT设备本身也可以被减薄，以便根据需要提供灵活性。 背衬材料优选地与硅晶片的声阻抗匹配，以便防止在向后传播的任何声能的界面处的反射，即远离器件前表面的方向上的反射。 背衬材料还可以具有高热导率以帮助从装置移除热量。

    INTERCONNECT STRUCTURE FOR TRANSDUCER ASSEMBLY
    5.
    发明申请
    INTERCONNECT STRUCTURE FOR TRANSDUCER ASSEMBLY 有权
    变压器总成互连结构

    公开(公告)号：US20070148999A1

    公开(公告)日：2007-06-28

    申请号：US11315641

    申请日：2005-12-22

    申请人： Bruno Haider ,  Douglas Wildes ,  Robert Lewandowski

    发明人： Bruno Haider ,  Douglas Wildes ,  Robert Lewandowski

    IPC分类号： H01R12/00

    CPC分类号： H04R1/00 ,  B06B1/0629 ,  G10K11/346

    摘要： An interconnect assembly is presented. The assembly includes an interconnect structure including a plurality of interconnect layers disposed in a spaced relationship, where each of the plurality of interconnect layers comprises a plurality of conductive traces disposed thereon. Furthermore, the assembly includes a redistribution layer disposed proximate the interconnect structure, where the redistribution layer is configured to facilitate coupling the interconnect structure to the one or more transducer elements on the transducer array.

    摘要翻译： 提出了互连组件。 组件包括互连结构，其包括以间隔关系设置的多个互连层，其中多个互连层中的每一个包括布置在其上的多个导电迹线。 此外，组件包括邻近互连结构设置的再分配层，其中再分配层被配置为便于将互连结构耦合到换能器阵列上的一个或多个换能器元件。

    HIGH-DENSITY CONNECTION BETWEEN MULTIPLE CIRCUIT BOARDS
    7.
    发明申请
    HIGH-DENSITY CONNECTION BETWEEN MULTIPLE CIRCUIT BOARDS 有权
    多电路板之间的高密度连接

    公开(公告)号：US20050221633A1

    公开(公告)日：2005-10-06

    申请号：US10813945

    申请日：2004-03-30

    申请人： Douglas Wildes ,  Robert Lewandowski ,  Geir Haugen

    发明人： Douglas Wildes ,  Robert Lewandowski ,  Geir Haugen

    IPC分类号： H05K1/14 ,  H01R12/00 ,  H05K1/00 ,  H05K1/11 ,  H05K3/36

    CPC分类号： H01R12/62 ,  H01R12/52 ,  H05K1/117 ,  H05K3/365 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2203/1572

    摘要： A high-density connection of multiple circuit boards having overlapping ends arranged in a stack. The metal traces on the stacked circuit boards are electrically connected by contact of the ends of the traces, which ends may be pads. The stacked circuit boards can be clamped, soldered or bonded together. Multiple circuit boards may be connected to a single circuit board. In one embodiment, double-sided circuit boards are stacked so that a first circuit board connects to a second circuit board through a third circuit board disposed intermediate the first and second circuit boards. The circuit boards may be flexible or rigid.

    摘要翻译： 具有重叠端的多个电路板的高密度连接被布置成堆叠。 层叠电路板上的金属迹线通过迹线端部的接触而电连接，该端部可以是焊盘。 堆叠电路板可以夹紧，焊接或粘合在一起。 多个电路板可以连接到单个电路板。 在一个实施例中，双面电路板被堆叠，使得第一电路板通过布置在第一和第二电路板之间的第三电路板连接到第二电路板。 电路板可以是柔性的或刚性的。

    Apparatus for catheter tips, including mechanically scanning ultrasound probe catheter tip
    8.
    发明申请
    Apparatus for catheter tips, including mechanically scanning ultrasound probe catheter tip 审中-公开
    用于导管尖端的装置，包括机械扫描超声探头导管尖端

    公开(公告)号：US20070167825A1

    公开(公告)日：2007-07-19

    申请号：US11330377

    申请日：2006-01-11

    申请人： Warren Lee ,  Douglas Wildes ,  George Sogoian ,  Charles Baumgartner ,  Weston Griffin ,  Mark Langer

    发明人： Warren Lee ,  Douglas Wildes ,  George Sogoian ,  Charles Baumgartner ,  Weston Griffin ,  Mark Langer

    IPC分类号： A61B8/14

    CPC分类号： A61B8/4461 ,  A61B8/12 ,  A61B8/4411 ,  A61B8/445

    摘要： A catheter tip (50, 170) is provided that is adapted for mating attachment to a catheter body (90, 300). In an embodiment, the catheter tip (50,170) comprises a transducer array (32, 60, 110, 210) in electrical communication with an interconnect (120, 220) and in a mechanical driven relationship with an actuator (80), also in the catheter tip (50, 170), via a drive shaft (38, 82). Oscillating back and forth motion of the transducer array (32, 60, 110, 210) provides ultrasonic imaging functionality that may include real time three-dimensional imaging. Other embodiments of the catheter tip (50, 170) and methods of fabrication also are provided.

    摘要翻译： 提供导管尖端（50,170），其适于与导管主体（90,300）配合。 在一个实施例中，导管尖端（50,170）包括与互连（120,220）电连通并且与致动器（80）机械驱动关系的换能器阵列（32,60,110,210），也在 导管尖端（50,170），经由驱动轴（38,82）。 振荡器阵列（32,60,110,210）的来回摆动提供可包括实时三维成像的超声成像功能。 还提供了导管尖端（50,170）的其它实施例和制造方法。

    Method of manufacture of catheter tips, including mechanically scanning ultrasound probe catheter tip, and apparatus made by the method
    9.
    发明申请
    Method of manufacture of catheter tips, including mechanically scanning ultrasound probe catheter tip, and apparatus made by the method 审中-公开
    导管尖端的制造方法，包括机械扫描超声探头导管尖端，以及由该方法制成的装置

    公开(公告)号：US20070167824A1

    公开(公告)日：2007-07-19

    申请号：US11329815

    申请日：2006-01-11

    申请人： Warren Lee ,  Douglas Wildes ,  George Sogoian ,  Charles Baumgartner ,  Weston Griffin ,  Mark Langer

    发明人： Warren Lee ,  Douglas Wildes ,  George Sogoian ,  Charles Baumgartner ,  Weston Griffin ,  Mark Langer

    IPC分类号： A61B8/14

    CPC分类号： A61B8/4461 ,  A61B8/12 ,  A61B8/445 ,  A61B8/4488 ,  A61B17/2202 ,  A61B18/1492 ,  A61M25/001 ,  A61M25/0069 ,  A61M25/008 ,  A61M25/0082 ,  G10K11/352

    摘要： A method to fabricate a catheter tip that encapsulates a mechanically actuated ultrasound transducer assembly is provided. In a representative procedure, the steps include providing an ultrasound transducer assembly (100) adapted for use with a catheter (300), the ultrasound transducer assembly (100) comprising a proximal end (102) and a distal end (104), a drive linkage (132) to an actuator (130), and a transducer array (110), the transducer array (110) electrically connected to an interconnect (120) adapted for passage to or through a body of the catheter (300), connecting the actuator (130), adapted for use with the ultrasound transducer assembly (100), to the drive linkage (132); and inserting the ultrasound transducer assembly (100) and the actuator (132) into a polymer or a plastic type or reinforced polymer sheath (140) comprising an acoustically transparent section, a closed end (142) at its distal end and an open end (144) at its proximal end, wherein the polymer sheath (140) provides a defined rigidity.

    摘要翻译： 提供了一种制造封装机械致动的超声换能器组件的导管尖端的方法。 在代表性的程序中，步骤包括提供适于与导管（300）一起使用的超声换能器组件（100），超声换能器组件（100）包括近端（102）和远端（104），驱动器 连接（132）到致动器（130），以及换能器阵列（110），所述换能器阵列（110）电连接到适于通向导管（300）的主体或通过导管（300）的主体的互连（120） 致动器（130），适于与超声换能器组件（100）一起使用于驱动连杆机构（132）; 以及将所述超声换能器组件（100）和所述致动器（132）插入聚合物或塑料型或增强的聚合物护套（140）中，所述聚合物护套包括声透明部分，在其远端处的封闭端（142）和开口端 144）在其近端处，其中所述聚合物护套（140）提供限定的刚性。