Polymerizable dielectric material
    8.
    发明申请
    Polymerizable dielectric material 审中-公开
    可聚合电介质材料

    公开(公告)号:US20070034842A1

    公开(公告)日:2007-02-15

    申请号:US11501724

    申请日:2006-08-10

    IPC分类号: H01B1/12

    CPC分类号: H01B3/303

    摘要: The present invention relates to a novel polymerizable dielectric material comprising crosslinkable organic amine compounds and crosslinked polymers obtained therefrom, which are useful for the manufacture of dielectric layers of electronic devices; to a novel method for the manufacture of dielectric layers of electronic devices; and to electronic devices obtained by said method.

    摘要翻译: 本发明涉及包含交联性有机胺化合物和由其获得的交联聚合物的新型可聚合电介质材料,其可用于制造电子器件的电介质层; 涉及一种用于制造电子器件的介电层的新颖方法; 以及通过所述方法获得的电子设备。