专利检索 ap:("David W. Boss" OR "Timothy W. Carr" OR "Derry J. Dubetsky" OR "George M. Greenstein" OR "Warren D. Grobman" OR "Carl P. Hayunga" OR "Amanda H. Kumar" OR "Walter F. Lange" OR "Robert H. Massey" OR "Paul H. Palmateer" OR "John A. Romano" OR "Da-Yuan Shih") AND inv:"George M. Greenstein" 第 1 页

1.

发明授权
Sealing and stress relief layers and use thereof 失效
标题翻译：密封和应力消除层及其用途

公开(公告)号：US4880684A

公开(公告)日：1989-11-14

申请号：US167290

申请日：1988-03-11

申请人： David W. Boss , Timothy W. Carr , Derry J. Dubetsky , George M. Greenstein , Warren D. Grobman , Carl P. Hayunga , Amanda H. Kumar , Walter F. Lange , Robert H. Massey , Paul H. Palmateer , John A. Romano , Da-Yuan Shih

发明人： David W. Boss , Timothy W. Carr , Derry J. Dubetsky , George M. Greenstein , Warren D. Grobman , Carl P. Hayunga , Amanda H. Kumar , Walter F. Lange , Robert H. Massey , Paul H. Palmateer , John A. Romano , Da-Yuan Shih

IPC分类号： H05K9/00 , H01L23/498 , H05K3/46

CPC分类号： H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01L2924/15312 , Y10S428/901 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/12396 , Y10T428/24917 , Y10T428/24926 , Y10T428/31681

摘要： Sealing and stress relief are provided to a low-fracture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymer overlays with interconnection between the underlying via or pad metallurgy and the device, chip, wire or pin bonded to the surface of the layer. Multilevel structures are taught along with a self-aligned sealing and wiring process.