公开(公告)号：US4880684A

公开(公告)日：1989-11-14

申请号：US167290

申请日：1988-03-11

申请人： David W. Boss ,  Timothy W. Carr ,  Derry J. Dubetsky ,  George M. Greenstein ,  Warren D. Grobman ,  Carl P. Hayunga ,  Amanda H. Kumar ,  Walter F. Lange ,  Robert H. Massey ,  Paul H. Palmateer ,  John A. Romano ,  Da-Yuan Shih

发明人： David W. Boss ,  Timothy W. Carr ,  Derry J. Dubetsky ,  George M. Greenstein ,  Warren D. Grobman ,  Carl P. Hayunga ,  Amanda H. Kumar ,  Walter F. Lange ,  Robert H. Massey ,  Paul H. Palmateer ,  John A. Romano ,  Da-Yuan Shih

IPC分类号： H05K9/00 ,  H01L23/498 ,  H05K3/46

CPC分类号： H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15312 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/12396 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/31681

摘要： Sealing and stress relief are provided to a low-fracture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymer overlays with interconnection between the underlying via or pad metallurgy and the device, chip, wire or pin bonded to the surface of the layer. Multilevel structures are taught along with a self-aligned sealing and wiring process.

公开(公告)号：US5309545A

公开(公告)日：1994-05-03

申请号：US749116

申请日：1991-08-23

申请人： Donald J. Spigarelli ,  John M. DeCarlo ,  John A. Romano ,  William F. Drislane

发明人： Donald J. Spigarelli ,  John M. DeCarlo ,  John A. Romano ,  William F. Drislane

IPC分类号： B23K1/005 ,  H05K3/34 ,  H05K13/04 ,  B23K1/012

CPC分类号： B23K1/0053 ,  H05K13/0465 ,  H05K3/3421 ,  H05K3/3494

摘要： A combined radiative and convective rework system is provided for repair, replacement, removal and rework of an electronic component on a printed circuit board. The system includes a guide for guiding heat-inducing radiation and heated gas towards at least one lead of the electronic component, and for preventing the heat-inducing radiation from damaging the body of the component. A heater, including a source of infrared radiation, provides the heat-inducing radiation and the heated gas. In one embodiment, the guide includes a single funnel cooperative with apparatus for reducing component body heating. In second and third embodiments, the guide includes two concentric funnels which form a volume which is traversed by the heat-inducing radiation and heated gas, and which provide at least one narrow region of heat energy to at least one of the leads, but not directly to the component body. In another embodiment, a plurality of removable guides are provided, each being specialized for use with a variety of different component types and sizes. The system also includes a viewing system for viewing the component along a central axis of symmetry of the guide.

摘要翻译： 提供组合的辐射和对流返修系统用于印刷电路板上的电子部件的修理，更换，移除和返修。 该系统包括用于将导热辐射和加热气体引向电子部件的至少一个引线的引导件，并且用于防止热诱导辐射损坏部件的主体。 包括红外辐射源的加热器提供导热辐射和加热的气体。 在一个实施例中，引导件包括与用于减少部件主体加热的装置协作的单漏斗。 在第二和第三实施例中，引导件包括形成体积的两个同心漏斗，该体积由导热辐射和加热气体穿过，并且向至少一个引线提供至少一个狭窄的热能区域，但不包括 直接到组件体。 在另一个实施例中，提供了多个可移除的引导件，每个引导件专门用于各种不同的部件类型和尺寸。 该系统还包括用于沿导向件的中心对称轴线观察部件的观察系统。