公开(公告)号：US4880684A

公开(公告)日：1989-11-14

申请号：US167290

申请日：1988-03-11

申请人： David W. Boss ,  Timothy W. Carr ,  Derry J. Dubetsky ,  George M. Greenstein ,  Warren D. Grobman ,  Carl P. Hayunga ,  Amanda H. Kumar ,  Walter F. Lange ,  Robert H. Massey ,  Paul H. Palmateer ,  John A. Romano ,  Da-Yuan Shih

发明人： David W. Boss ,  Timothy W. Carr ,  Derry J. Dubetsky ,  George M. Greenstein ,  Warren D. Grobman ,  Carl P. Hayunga ,  Amanda H. Kumar ,  Walter F. Lange ,  Robert H. Massey ,  Paul H. Palmateer ,  John A. Romano ,  Da-Yuan Shih

IPC分类号： H05K9/00 ,  H01L23/498 ,  H05K3/46

CPC分类号： H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15312 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/12396 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/31681

摘要： Sealing and stress relief are provided to a low-fracture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymer overlays with interconnection between the underlying via or pad metallurgy and the device, chip, wire or pin bonded to the surface of the layer. Multilevel structures are taught along with a self-aligned sealing and wiring process.

公开(公告)号：US4677254A

公开(公告)日：1987-06-30

申请号：US763389

申请日：1985-08-07

申请人： David W. Boss ,  Derry J. Dubetsky

发明人： David W. Boss ,  Derry J. Dubetsky

IPC分类号： H01L23/538 ,  C04B35/64 ,  H01L21/48 ,  H01L23/52 ,  H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/46

CPC分类号： H01L21/4807 ,  C04B35/64 ,  H01L21/4857 ,  H05K3/4629 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2203/063 ,  Y10T29/49126

摘要： A method of fabricating a multilayer ceramic substrate with an internal conductive metallurgy circuit network, wherein additional green sheet material is added to the stack of ceramic green sheets during assembly to areas of the substrate outside of the conductive metallurgy to compensate for the volume of conductive metal paste to thereby eliminate or minimize substrate distortion during the sintering operation. An unsintered intermediate green ceramic substrate made up of green ceramic sheets with via holes and conductive metal lines on the surface which collectively form the circuit network where the improvement is additional green ceramic material in the substrate in areas outside of the conductive metallurgy network to compensate for the additional volume of material of the conductive metal which additional material provides a more uniform ceramic material density through the substrate.

摘要翻译： 一种制造具有内部导电冶金电路网络的多层陶瓷衬底的方法，其中在组装到导电冶金学外部的衬底的区域期间，附加的生片材料被添加到陶瓷生片的堆叠中以补偿导电金属的体积 从而消除或最小化烧结操作期间的衬底变形。 由具有通孔的绿色陶瓷片和表面上的导电金属线构成的未烧结的中间绿色陶瓷衬底，其共同形成电路网络，其中改进是在导电冶金网络外部的区域中的附加生坯陶瓷材料，以补偿 导电金属的额外体积的材料，附加材料通过基底提供更均匀的陶瓷材料密度。