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公开(公告)号：US20080310123A1
公开(公告)日：2008-12-18
申请号：US12121350
申请日：2008-05-15
IPC分类号： H05K7/18
CPC分类号： H05K7/1488
摘要： Included are embodiments for toolless configuration of a computer enclosure. At least one embodiment of an apparatus includes a computer enclosure configured to support a plurality of components, the computer enclosure including a plurality of dividing walls, the dividing walls including a first opening and a second opening. Some embodiments include a divider configured for insertion into the computer enclosure and between the dividing walls, the divider including a first tab for coupling with the first opening, the divider including a second tab for coupling with the second opening, the divider further including a locking tab for locking the divider in place within the computer enclosure.
摘要翻译： 包括用于计算机机箱的无工具配置的实施例。 装置的至少一个实施例包括被配置为支撑多个部件的计算机机壳，所述计算机机壳包括多个分隔壁，所述分隔壁包括第一开口和第二开口。 一些实施例包括分配器，其被配置用于插入到计算机外壳中并且在分隔壁之间，分隔器包括用于与第一开口联接的第一突出部，该分隔器包括用于与第二开口联接的第二突出部，分隔器还包括锁定 将分配器锁定在计算机外壳内的适当位置。
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公开(公告)号：US08982565B2
公开(公告)日：2015-03-17
申请号：US12121350
申请日：2008-05-15
CPC分类号： H05K7/1488
摘要： Included are embodiments for toolless configuration of a computer enclosure. At least one embodiment of an apparatus includes a computer enclosure configured to support a plurality of components, the computer enclosure including a plurality of dividing walls, the dividing walls including a first opening and a second opening. Some embodiments include a divider configured for insertion into the computer enclosure and between the dividing walls, the divider including a first tab for coupling with the first opening, the divider including a second tab for coupling with the second opening, the divider further including a locking tab for locking the divider in place within the computer enclosure.
摘要翻译： 包括用于计算机机箱的无工具配置的实施例。 装置的至少一个实施例包括被配置为支撑多个部件的计算机机壳，所述计算机机壳包括多个分隔壁，所述分隔壁包括第一开口和第二开口。 一些实施例包括分配器，其被配置用于插入到计算机外壳中并且在分隔壁之间，分隔器包括用于与第一开口联接的第一突出部，该分隔器包括用于与第二开口联接的第二突出部，分隔器还包括锁定 将分配器锁定在计算机外壳内的适当位置。
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公开(公告)号：US07619897B2
公开(公告)日：2009-11-17
申请号：US11590127
申请日：2006-10-31
申请人： Troy A. Della Fiora , Scott Stephenson , Belgie B. McClelland , Joseph R. Allen , Eric Mei , David W. Sherrod
发明人： Troy A. Della Fiora , Scott Stephenson , Belgie B. McClelland , Joseph R. Allen , Eric Mei , David W. Sherrod
IPC分类号： H05K5/00
CPC分类号： G06F1/18 , H05K7/1494
摘要： A device that may include a server chassis and a user interface module moveably coupled to the server chassis. In some embodiments, the user interface module is configured to move to a first position that allows access to a first server component and to a second position that allows access to a second server component that is different from the first server component.
摘要翻译： 可以包括可移动地耦合到服务器机箱的服务器机箱和用户接口模块的设备。 在一些实施例中，用户界面模块被配置为移动到允许访问第一服务器组件和允许访问与第一服务器组件不同的第二服务器组件的第二位置的第一位置。
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公开(公告)号：US20080100992A1
公开(公告)日：2008-05-01
申请号：US11590127
申请日：2006-10-31
申请人： Troy A. Della Fiora , Scott Stephenson , Belgie B. McClelland , Joseph R. Allen , Eric Mei , David W. Sherrod
发明人： Troy A. Della Fiora , Scott Stephenson , Belgie B. McClelland , Joseph R. Allen , Eric Mei , David W. Sherrod
IPC分类号： H02B1/00
CPC分类号： G06F1/18 , H05K7/1494
摘要： A device that may include a server chassis and a user interface module moveably coupled to the server chassis. In some embodiments, the user interface module is configured to move to a first position that allows access to a first server component and to a second position that allows access to a second server component that is different from the first server component.
摘要翻译： 可以包括可移动地耦合到服务器机箱的服务器机箱和用户接口模块的设备。 在一些实施例中，用户界面模块被配置为移动到允许访问第一服务器组件和允许访问与第一服务器组件不同的第二服务器组件的第二位置的第一位置。
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公开(公告)号：US20080310097A1
公开(公告)日：2008-12-18
申请号：US12121613
申请日：2008-05-15
申请人： David W. Sherrod , Kevin B. Leigh , Jonathan E. JamesOu , Kurt A. Manweiler , Joseph R. Allen , Tuan A. Pham
发明人： David W. Sherrod , Kevin B. Leigh , Jonathan E. JamesOu , Kurt A. Manweiler , Joseph R. Allen , Tuan A. Pham
CPC分类号： H05K7/1488 , H05K7/1492
摘要： A blade device enclosure has a chassis configured to selectively house a plurality of configurations of full-high and half-high blade devices, an administrator module, and at least one input/output device. The blade device enclosure also has a printed circuit board including a passive high-speed midplane configured to electronically couple the blade devices to the administrator module and the at least one input/output device.
摘要翻译： 刀片设备外壳具有被配置为选择性地容纳全高和半高刀片设备的多个配置的机箱，管理员模块和至少一个输入/输出设备。 刀片设备外壳还具有印刷电路板，其包括被配置为将刀片设备电子耦合到管理员模块和至少一个输入/输出设备的被动高速中间面板。
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公开(公告)号：US08670241B2
公开(公告)日：2014-03-11
申请号：US12121613
申请日：2008-05-15
申请人： David W. Sherrod , Kevin B. Leigh , Jonathan E. JamesOu , Kurt A. Manweiler , Joseph R. Allen , Tuan A. Pham
发明人： David W. Sherrod , Kevin B. Leigh , Jonathan E. JamesOu , Kurt A. Manweiler , Joseph R. Allen , Tuan A. Pham
IPC分类号： H05K7/20
CPC分类号： H05K7/1488 , H05K7/1492
摘要： A blade device enclosure has a chassis configured to selectively house a plurality of configurations of full-high and half-high blade devices, an administrator module, and at least one input/output device. The blade device enclosure also has a printed circuit board including a passive high-speed midplane configured to electronically couple the blade devices to the administrator module and the at least one input/output device.
摘要翻译： 刀片设备外壳具有被配置为选择性地容纳全高和半高刀片设备的多个配置的机箱，管理员模块和至少一个输入/输出设备。 刀片设备外壳还具有印刷电路板，其包括被配置为将刀片设备电子耦合到管理员模块和至少一个输入/输出设备的被动高速中间面板。
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公开(公告)号：US07719836B2
公开(公告)日：2010-05-18
申请号：US12472764
申请日：2009-05-27
IPC分类号： H05K7/20
CPC分类号： F04D29/646 , F04D29/664 , G06F1/20 , H05K7/20172 , H05K7/20581
摘要： A cooling fan module is disclosed. The cooling fan module includes a module housing, a fan assembly, a fan control circuit board, and an electrical connector. The fan assembly is disposed within the module housing and includes a fan housing, a motor disposed within the fan housing, and a blade assembly coupled to the motor. The fan control circuit board is disposed between the module housing and the fan housing, and is coupled to the motor. The electrical connector is coupled to the fan control circuit board and projects outside of the module housing.
摘要翻译： 公开了一种冷却风扇模块。 冷却风扇模块包括模块壳体，风扇组件，风扇控制电路板和电连接器。 风扇组件设置在模块壳体内，并且包括风扇壳体，设置在风扇壳体内的电动机和联接到电动机的叶片组件。 风扇控制电路板设置在模块壳体和风扇壳体之间，并且联接到电动机。 电连接器连接到风扇控制电路板并且突出到模块壳体外部。
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公开(公告)号：US06858792B2
公开(公告)日：2005-02-22
申请号：US10324693
申请日：2002-12-19
申请人： John P. Franz , Wade D. Vinson , Joseph R. Allen , David W. Deis
发明人： John P. Franz , Wade D. Vinson , Joseph R. Allen , David W. Deis
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the present invention overcome the deficiencies of the prior art by providing a tool-less, lever actuated, robust yet tolerant, high load delivery, low-profile component retention assembly for coupling components together. The assembly may include a plate and a lever coupled to the plate.
摘要翻译： 本发明的实施例通过提供一种无需工具的杠杆致动的，坚固但耐受的，高负荷传递的低轮廓部件保持组件来克服现有技术的缺陷，用于将部件耦合在一起。 组件可以包括板和耦合到板的杆。
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公开(公告)号：USD705231S1
公开(公告)日：2014-05-20
申请号：US29427009
申请日：2012-07-12
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公开(公告)号：US20090231804A1
公开(公告)日：2009-09-17
申请号：US12472764
申请日：2009-05-27
CPC分类号： F04D29/646 , F04D29/664 , G06F1/20 , H05K7/20172 , H05K7/20581
摘要： A cooling fan module is disclosed. The cooling fan module includes a module housing, a fan assembly, a fan control circuit board, and an electrical connector. The fan assembly is disposed within the module housing and includes a fan housing, a motor disposed within the fan housing, and a blade assembly coupled to the motor. The fan control circuit board is disposed between the module housing and the fan housing, and is coupled to the motor. The electrical connector is coupled to the fan control circuit board and projects outside of the module housing.
摘要翻译： 公开了一种冷却风扇模块。 冷却风扇模块包括模块壳体，风扇组件，风扇控制电路板和电连接器。 风扇组件设置在模块壳体内，并且包括风扇壳体，设置在风扇壳体内的电动机和联接到电动机的叶片组件。 风扇控制电路板设置在模块壳体和风扇壳体之间，并且联接到电动机。 电连接器连接到风扇控制电路板并且突出到模块壳体外部。
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