公开(公告)号：US20050214449A1

公开(公告)日：2005-09-29

申请号：US10998497

申请日：2004-11-29

申请人： Deborah Hirst ,  Mark Poole ,  Susan Green ,  Inna Sinitskaya ,  John Graves

发明人： Deborah Hirst ,  Mark Poole ,  Susan Green ,  Inna Sinitskaya ,  John Graves

IPC分类号： H05K3/26 ,  C08J7/02 ,  C09K13/00 ,  C23C18/20 ,  C23C18/24 ,  C23C18/30 ,  H05K3/38 ,  H05K3/00

CPC分类号： C23C18/24 ,  C08J7/02 ,  C23C18/2086 ,  C23C18/30 ,  H05K3/381

摘要： A lactone solvent swell composition and method of using the composition. The lactone swell composition is used to condition resinous material for etching to form a porous textured surface on the resinous material. The porous texture permits the deposition of a metal on the resinous material such that a high integrity bond is formed between the textured resinous material and the deposited metal. Such a bond between the metal and the resinous material prevents de-lamination of the metal and resin bond. The lactone solvent swell compositions also desmear resin material from substrates. The lactone solvent swell compositions may be employed to treat resinous material used in the manufacture of printed wiring boards. Metal may be deposited on the textured resinous material by electroless plating.

摘要翻译： 内酯溶剂溶胀组合物和使用该组合物的方法。 内酯溶胀组合物用于调节树脂材料进行蚀刻以在树脂材料上形成多孔纹理表面。 多孔结构允许在树脂材料上沉积金属，使得在纹理树脂材料和沉积的金属之间形成高完整性结合。 金属和树脂材料之间的这种结合防止了金属和树脂粘结的脱层。 内酯溶剂溶胀组合物也从基材上去除树脂材料。 内酯溶剂溶胀组合物可用于处理印刷线路板制造中使用的树脂材料。 可以通过化学镀将金属沉积在纹理树脂材料上。

公开(公告)号：US06265020B1

公开(公告)日：2001-07-24

申请号：US09387472

申请日：1999-09-01

申请人： George R. Allardyce ,  John J. Bladon ,  David Oglesby ,  Inna Sinitskaya

发明人： George R. Allardyce ,  John J. Bladon ,  David Oglesby ,  Inna Sinitskaya

IPC分类号： B05D136

CPC分类号： C25D5/08 ,  C23C18/1619 ,  H05K3/0088

摘要： The present invention relates to new methods for delivering solutions during electronic device manufacture. Methods of the invention include delivering metallization solutions to the device at an angle of less than 90 degrees with the surface of the device. The method may further comprise partially treating the device by delivering the metallization solutions from above the device, turning the device over, and then completing treatment by delivering the metallization solutions from below the article. The method is particularly useful in the formation of printed circuit boards and other electronic packaging devices having through-holes and blind vias.

摘要翻译： 本发明涉及在电子设备制造期间传送解决方案的新方法。 本发明的方法包括以与装置的表面成小于90度的角度将金属化溶液递送到装置。 该方法还可以包括通过从装置上方递送金属化溶液来部分地处理装置，使装置翻转，然后通过从制品下方递送金属化溶液来完成处理。 该方法在形成具有通孔和盲孔的印刷电路板和其它电子封装装置中特别有用。

公开(公告)号：US5425873A

公开(公告)日：1995-06-20

申请号：US226012

申请日：1994-04-11

申请人： John J. Bladon ,  Wade Sonnenberg ,  Inna Sinitskaya ,  Jeffrey P. Burress ,  Christopher P. Esposito

发明人： John J. Bladon ,  Wade Sonnenberg ,  Inna Sinitskaya ,  Jeffrey P. Burress ,  Christopher P. Esposito

IPC分类号： C25D5/02 ,  H05K3/42

CPC分类号： H05K3/424 ,  C25D5/02 ,  H05K3/427 ,  H05K2201/0166 ,  H05K2203/0591 ,  H05K2203/121

摘要： A process for electroplating a substrate having a surface comprising metallic and non-metallic regions. The process is characterized by selectively forming a protective film over the metallic regions of the substrate surface and forming a sulfide coating selectively over the remaining portions of said substrate. The protective film enables selective sulfide formation only on metallic sites without formation of a sulfide coating on metallic surface regions of the substrate which would otherwise interfere with metal-to-metal bond during electroplating. Following formation of the sulfide conversion coating, the protective film is removed and the surface of the substrate electroplated.

摘要翻译： 一种用于电镀具有包括金属和非金属区域的表面的衬底的方法。 该方法的特征在于在衬底表面的金属区域上选择性地形成保护膜，并在所述衬底的剩余部分上选择性地形成硫化物涂层。 保护膜仅在金属位置上形成选择性硫化物形成，而不在基板的金属表面区域上形成硫化物涂层，否则在电镀期间会干扰金属 - 金属键。 在形成硫化物转化膜之后，除去保护膜，并将基板的表面电镀。