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公开(公告)号：US06265020B1
公开(公告)日：2001-07-24
申请号：US09387472
申请日：1999-09-01
IPC分类号： B05D136
CPC分类号： C25D5/08 , C23C18/1619 , H05K3/0088
摘要： The present invention relates to new methods for delivering solutions during electronic device manufacture. Methods of the invention include delivering metallization solutions to the device at an angle of less than 90 degrees with the surface of the device. The method may further comprise partially treating the device by delivering the metallization solutions from above the device, turning the device over, and then completing treatment by delivering the metallization solutions from below the article. The method is particularly useful in the formation of printed circuit boards and other electronic packaging devices having through-holes and blind vias.
摘要翻译： 本发明涉及在电子设备制造期间传送解决方案的新方法。 本发明的方法包括以与装置的表面成小于90度的角度将金属化溶液递送到装置。 该方法还可以包括通过从装置上方递送金属化溶液来部分地处理装置，使装置翻转，然后通过从制品下方递送金属化溶液来完成处理。 该方法在形成具有通孔和盲孔的印刷电路板和其它电子封装装置中特别有用。
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公开(公告)号：US5425873A
公开(公告)日：1995-06-20
申请号：US226012
申请日：1994-04-11
申请人： John J. Bladon , Wade Sonnenberg , Inna Sinitskaya , Jeffrey P. Burress , Christopher P. Esposito
发明人： John J. Bladon , Wade Sonnenberg , Inna Sinitskaya , Jeffrey P. Burress , Christopher P. Esposito
CPC分类号： H05K3/424 , C25D5/02 , H05K3/427 , H05K2201/0166 , H05K2203/0591 , H05K2203/121
摘要： A process for electroplating a substrate having a surface comprising metallic and non-metallic regions. The process is characterized by selectively forming a protective film over the metallic regions of the substrate surface and forming a sulfide coating selectively over the remaining portions of said substrate. The protective film enables selective sulfide formation only on metallic sites without formation of a sulfide coating on metallic surface regions of the substrate which would otherwise interfere with metal-to-metal bond during electroplating. Following formation of the sulfide conversion coating, the protective film is removed and the surface of the substrate electroplated.
摘要翻译： 一种用于电镀具有包括金属和非金属区域的表面的衬底的方法。 该方法的特征在于在衬底表面的金属区域上选择性地形成保护膜，并在所述衬底的剩余部分上选择性地形成硫化物涂层。 保护膜仅在金属位置上形成选择性硫化物形成，而不在基板的金属表面区域上形成硫化物涂层，否则在电镀期间会干扰金属 - 金属键。 在形成硫化物转化膜之后，除去保护膜，并将基板的表面电镀。
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3.发明授权
公开(公告)号：US6036835A
公开(公告)日：2000-03-14
申请号：US936300
申请日：1997-09-24
CPC分类号： C25D5/02 , H05K3/424 , H05K3/429 , H05K2201/0329 , H05K2203/0789 , Y10S205/917
摘要： A microetch composition for a circuit board containing sulfuric acid in combination with a carboxylic acid having 2 to 6 carbon atoms, wherein the volume of the carboxylic acid is preferably greater than the amount of sulfuric acid. The method discloses the contacting of a electrically conductive polymer with the microetch composition disclosed above to expose copper underlying the electrically conductive polymer.
摘要翻译： 一种用于含有硫酸与具有2至6个碳原子的羧酸的电路板的微蚀刻组合物，其中羧酸的体积优选大于硫酸的量。 该方法公开了导电聚合物与上述公开的微蚀刻组合物的接触，以暴露导电聚合物下面的铜。
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公开(公告)号：US5007990A
公开(公告)日：1991-04-16
申请号：US153357
申请日：1988-02-08
申请人： John J. Bladon
发明人： John J. Bladon
CPC分类号： C25D5/54 , H05K3/188 , H05K3/424 , H05K2203/0716 , H05K3/427
摘要： A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a catalytic metal chalcogenide conversion coating adjacent to and in contact with conductive areas. The metal sulfide is of a metal that would be catalytic to electroless metal deposition. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.
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公开(公告)号：US4919768A
公开(公告)日：1990-04-24
申请号：US410907
申请日：1989-09-22
申请人： John J. Bladon
发明人： John J. Bladon
CPC分类号： H05K3/188 , C25D5/54 , H05K3/424 , H05K2203/0716 , H05K3/427
摘要： A method for electroplating an article of manufacture comprising an electrically nonconductive body portion comprising treatment with sequentially a solution of a stannous salt; a solution containing a dissolved sulfide capable of reacting with said stannous salt; and a solution containing a dissolved platinum family metal; followed by electrolytic metal plating of the surface of the article.
摘要翻译： 一种用于对包含非导电体部分的制品进行电镀的方法，包括依次用亚锡盐溶液处理; 含有能够与所述亚锡盐反应的溶解硫化物的溶液; 和含有溶解的铂族金属的溶液; 然后用电解金属电镀表面的物品。
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公开(公告)号：US5017742A
公开(公告)日：1991-05-21
申请号：US435348
申请日：1989-11-13
申请人： John J. Bladon
发明人： John J. Bladon
CPC分类号： C23C18/28 , H05K3/424 , H05K2203/0716 , H05K3/427 , Y10S428/901
摘要： A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a catalytic metal chalcogenide conversion coating adjacent to and in contact with conductive areas. The metal sulfide is of a metal that would be catalytic to electroless metal deposition. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating. In a preferred embodiment through holes in the circuit board substrate have their walls coated with a metal adhered to the plastic surface of the hole wall through an intermediate layer of tin-palladium sulfide.
摘要翻译： 一种用于金属电镀由有机塑料形成的制品的表面的方法。 该方法包括使浸入含有溶解电镀金属的电解质中的两个电极之间的电流通过的步骤。 其中一个电极是待镀的制品，并且具有与导电区域相邻并与导电区域接触的具有催化金属硫族化物转化膜的区域的表面。 金属硫化物是对无电金属沉积有催化作用的金属。 该方法对于印刷电路板的形成特别有用，并且通过涉及图形电镀的工艺能够形成印刷电路板是非常通用的。 在优选实施例中，电路板基板中的通孔穿过其中的锡 - 硫化钯中间层，其壁上涂有金属，该金属通过孔壁的塑料表面附着。
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公开(公告)号：US4952286A
公开(公告)日：1990-08-28
申请号：US153366
申请日：1988-02-08
CPC分类号： H05K3/188 , C25D5/54 , H05K3/424 , H05K2203/0716 , H05K3/427 , Y10S205/92
摘要： A method for metal plating the surface of a nonconducting article. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a catalytic metal chalcogenide conversion coating. The metal chalcogenide is of a metal that would be catalytic to electroless metal deposition.
摘要翻译： 一种用于对不导电制品的表面进行金属电镀的方法。 该方法包括使浸入含有溶解电镀金属的电解质中的两个电极之间的电流通过的步骤。 其中一个电极是待镀的制品，并且设置有具有催化金属硫族化物转化膜的区域的表面。 金属硫族化物是对无电金属沉积有催化作用的金属。
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公开(公告)号：US4725314A
公开(公告)日：1988-02-16
申请号：US908277
申请日：1986-09-17
申请人： Michael Gulla , Oleh B. Dutkewych , John J. Bladon
发明人： Michael Gulla , Oleh B. Dutkewych , John J. Bladon
CPC分类号： C23C18/30
摘要： A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.
摘要翻译： 一种悬浮在水溶液中的催化吸附物，其包含在有机悬浮剂上的还原催化金属，其中还原催化金属的最大尺寸不超过500埃。 催化吸附物对于无电金属沉积的非金属沉积基材是非常有用的。
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公开(公告)号：US4652311A
公开(公告)日：1987-03-24
申请号：US691880
申请日：1985-01-16
申请人： Michael Gulla , Oleh B. Dutkewych , John J. Bladon
发明人： Michael Gulla , Oleh B. Dutkewych , John J. Bladon
摘要： A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms and the organic suspending agent is one capable of complexing with ions of the catalytic metal. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.
摘要翻译： 悬浮在水溶液中的催化吸附物，其包含在有机悬浮剂上的还原催化金属，其中还原的催化金属的最大尺寸不超过500埃，有机悬浮剂是能够与催化金属的离子络合的。 催化吸附物对于无电金属沉积的非金属沉积基材是非常有用的。
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公开(公告)号：US5419829A
公开(公告)日：1995-05-30
申请号：US243980
申请日：1994-05-17
摘要： A method for electroplating a nonconducting surface using a metal oxide colloid. The process comprises contacting the surface of the nonconductor to be plated with a preformed colloid of a metal oxide to adsorb the colloid onto the surface of the nonconductor and then electroplating metal over the surface having the adsorbed metal oxide colloid. The process may include a step of reducing the metal oxide to a lower valent state prior to the step of metal plating.
摘要翻译： 一种使用金属氧化物胶体电镀不导电表面的方法。 该方法包括将待镀的非导体表面与金属氧化物的预制胶体接触，以将胶体吸附到非导体的表面上，然后在具有吸附的金属氧化物胶体的表面上电镀金属。 该方法可以包括在金属电镀步骤之前将金属氧化物还原为低价态的步骤。
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