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公开(公告)号：US20130194814A1
公开(公告)日：2013-08-01
申请号：US13362171
申请日：2012-01-31
CPC分类号： B32B15/088 , B32B1/00 , B32B7/12 , B32B27/281 , Y10T428/2419
摘要： A bent layered structure is disclosed having a top conductive layer and a dielectric layer. The dielectric layer is a polyimide derived from at least 70 mole percent aromatic dianhydride based upon total dianhydride content of the polyimide and at least 70 mole percent aromatic diamine based upon total diamine content of the polyimide. The bent layered structure has a radius of at least 2 mm and a bend angle of at least 45 degrees at least once along a longitudinal or at least once parallel to the longitudinal axis or both and maintains a 150 to 350 V/micron breakdown voltage.
摘要翻译： 公开了具有顶部导电层和电介质层的弯曲分层结构。 介电层是基于聚酰亚胺的总二氢化物含量至少70摩尔％的芳族二酐衍生的聚酰亚胺和基于聚酰亚胺的总二胺含量的至少70摩尔％芳族二胺。 弯曲的分层结构具有至少2mm的半径和至少45度的弯曲角，沿纵向或至少一次平行于纵向轴线或两者均至少一次，并且保持150至350V /微米的击穿电压。
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公开(公告)号：US20130193452A1
公开(公告)日：2013-08-01
申请号：US13362262
申请日：2012-01-31
IPC分类号： H01L27/15
CPC分类号： H01L25/0753 , H01L33/641 , H01L2924/0002 , H05K1/028 , H05K1/0346 , H05K1/189 , H05K3/0061 , H05K2201/0154 , H05K2201/10106 , H05K2203/302 , H01L2924/00
摘要： A light emitting diode system is disclosed having a bent layered structure conformed to a least a portion of a self-supporting three dimensional heat sink and maintains a breakdown voltage from 150 to 350 V/micron. The bent layered structure has an electrical circuit, a dielectric layer and at least one LED package, LED chip on board or mixtures thereof attached to the electrical circuit. The dielectric layer is a polyimide derived from at least 70 mole percent aromatic dianhydride based upon total dianhydride content of the polyimide and at least 70 mole percent aromatic diamine based upon total diamine content of the polyimide.
摘要翻译： 公开了一种发光二极管系统，其具有符合自支撑三维散热器的至少一部分的弯曲分层结构，并将击穿电压保持在150至350V /微米。 弯曲的分层结构具有电路，电介质层和至少一个LED封装，板上的LED芯片或其混合物附接到电路。 介电层是基于聚酰亚胺的总二氢化物含量至少70摩尔％的芳族二酐衍生的聚酰亚胺和基于聚酰亚胺的总二胺含量的至少70摩尔％芳族二胺。
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公开(公告)号：USD687980S1
公开(公告)日：2013-08-13
申请号：US29412126
申请日：2012-01-31
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公开(公告)号：USD685932S1
公开(公告)日：2013-07-09
申请号：US29412127
申请日：2012-01-31
CPC分类号： F21S8/00 , F21W2111/00 , F21W2121/00 , F21Y2115/10
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5.发明授权公开(公告)号：US08637880B2
公开(公告)日：2014-01-28
申请号：US13326623
申请日：2011-12-15
申请人： Kurt Douglas Roberts
发明人： Kurt Douglas Roberts
IPC分类号： H01L29/18
CPC分类号： F21K9/23 , F21K9/27 , F21S4/24 , F21V29/70 , F21V29/74 , F21Y2103/10 , F21Y2115/10 , H01L25/0753 , H01L33/642 , H01L2924/0002 , H05K1/0278 , H05K1/189 , H05K3/0061 , H05K2201/09745 , H05K2201/10106 , H01L2924/00
摘要： A flexible layered structure is disclosed having a flexible top conductive layer, a flexible bottom heat sink layer and a flexible dielectric middle layer. The combination has a longitudinal axis and a plurality of defined positions spaced along the longitudinal axis. The defined positions can be used for aligning a circuit and/or for the placement of LED lights. The flexible layered structure can be easily bent to form a LED substrate for shining light in more than one direction while efficiently removing heat arising from the LEDs.
摘要翻译： 公开了一种柔性分层结构，其具有柔性顶部导电层，柔性底部散热层和柔性电介质中间层。 该组合具有纵向轴线和沿着纵向轴线间隔开的多个限定位置。 定义的位置可用于对齐电路和/或放置LED灯。 柔性层状结构可以容易地弯曲以形成用于在多于一个方向上发光的LED基板，同时有效地去除由LED产生的热量。
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6.发明授权公开(公告)号：US08629464B2
公开(公告)日：2014-01-14
申请号：US13326629
申请日：2011-12-15
申请人： Kurt Douglas Roberts
发明人： Kurt Douglas Roberts
IPC分类号： H01L29/18
CPC分类号： F21V29/74 , F21Y2103/10 , F21Y2115/10 , H01L25/0753 , H01L33/641 , H01L2924/0002 , H01L2924/00
摘要： A flexible layered structure is disclosed having a flexible top conductive layer, a flexible bottom heat sink layer and a flexible dielectric middle layer. The combination has a longitudinal axis and a plurality of defined positions spaced along the longitudinal axis. The defined positions can be used for aligning a circuit and/or for the placement of LED lights. The flexible layered structure can be easily bent to form a LED substrate for shining light in more than one direction while efficiently removing heat arising from the LEDs.
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公开(公告)号：US20070284731A1
公开(公告)日：2007-12-13
申请号：US11724188
申请日：2007-03-15
申请人： Takashi Atsumi , Junzo Ukai , Kenji Eto , Kenji Nakamura , Sezto Daiza , Paul Arthur Meloni , Attignal N. Sreeram , Kurt Douglas Roberts , David Leroy Sutton
发明人： Takashi Atsumi , Junzo Ukai , Kenji Eto , Kenji Nakamura , Sezto Daiza , Paul Arthur Meloni , Attignal N. Sreeram , Kurt Douglas Roberts , David Leroy Sutton
IPC分类号： H01L23/36
CPC分类号： H01L23/3737 , H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H01L2924/00
摘要： The mounting structure of a power device is simplified so as to reduce cost while achieving improvements in heat dissipation and reliability. A power module 100 is comprised of a metal wiring board 13, a power device 11 disposed on an upper surface of the metal wiring board 13 via a solder layer 12, a metal heat dissipating plate 15 disposed on a lower surface of the metal wiring board 13, and a heat sink 19 disposed on a lower surface of the metal heat dissipating plate 15. A resin-based insulating layer 14 is disposed between any desired two of the aforementioned layers.
摘要翻译： 功率器件的安装结构简化，从而降低成本，同时实现散热和可靠性的提高。 功率模块100包括金属布线板13，经由焊料层12配置在金属布线基板13的上表面的电力装置11，配置在金属布线基板13的下表面的金属散热板15 13和设置在金属散热板15的下表面上的散热器19.树脂基绝缘层14设置在任何所需的两个上述层之间。
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