公开(公告)号：US20230325569A1

公开(公告)日：2023-10-12

申请号：US17716527

申请日：2022-04-08

Applicant: Dell Products L.P.

Inventor： Vijender Kumar ,  Mallikarjun Vasa ,  Ashish Shrivastava ,  Bhyrav Mutnury ,  Seema P K ,  Sukumar Muthusamy ,  Sanjay Kumar ,  Sunil Pathania

IPC: G06F30/392

CPC classification number: G06F30/392 ,  G06F2119/08

Abstract: An information handling system includes a memory device and a processor. The memory device includes first data representing a thermal profile of a motherboard, and second data representing a circuit trace of the motherboard. The circuit trace provides a high-speed data interconnection between two or more circuit devices. The processor determines an average temperature of the circuit trace on the motherboard based upon the first data and the second data, and models a trace layout for the circuit trace on the motherboard based upon the average temperature.