公开(公告)号：US11641710B1

公开(公告)日：2023-05-02

申请号：US17516038

申请日：2021-11-01

Applicant: Dell Products L.P.

Inventor： James Chen ,  Mallikarjun Vasa ,  Bhyrav Mutnury

IPC: H05K1/02 ,  H05K3/42

Abstract: A circuit board may include a first signal via electrically coupled to multiple layers of the circuit board, a second signal via electrically coupled to multiple layers of the circuit board, and a pair of ground vias configured to provide electrical shielding between the first signal via and the second signal via, the pair of ground vias comprising a first ground via electrically coupled to a ground or power plane of the circuit board and a second ground via electrically coupled to the ground or power plane of the circuit board. The first signal via, the first ground via, and the second ground via may be arranged such that they form an angle of approximately 50 degrees having a vertex at the first signal via, a first ray extending from the first signal via through the first ground via and a second ray extending from the first signal via through the second ground via.

公开(公告)号：US12114419B2

公开(公告)日：2024-10-08

申请号：US17713347

申请日：2022-04-05

Applicant: Dell Products L.P.

Inventor： William Andrew Smith ,  Mallikarjun Vasa ,  Bhyrav M. Mutnury

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K1/0218 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09518 ,  H05K2201/09545

Abstract: An information handling system includes a printed circuit board, a surface mount connector including first and second surface mount connector portions, first and second different pairs, and a ground plane. The first and second surface mount connector portions are mounted on the printed circuit board. The first differential pair is located on the first surface mount connector portion, and the second differential pair is located on the second surface mount connector portion. The ground plane is located in between the first and second surface mount connector portions within the printed circuit board. The first ground via is in physical communication with the ground plane and a first ground pad on a surface of the printed circuit board. The second ground via is in physical communication with the ground plane and a second ground pad on the surface of the printed circuit board.

公开(公告)号：US20190239339A1

公开(公告)日：2019-08-01

申请号：US15885337

申请日：2018-01-31

Applicant: Dell Products L.P.

Inventor： Umesh Chandra ,  Bhyrav M. Mutnury ,  Mallikarjun Vasa

IPC: H05K1/02 ,  H04L25/02 ,  H04B3/32

CPC classification number: H05K1/0228 ,  H04B3/32 ,  H04L25/0272 ,  H05K2201/09227

Abstract: A stubbed differential trace pair system includes a circuit board having a first differential trace pair with a first trace and a second trace, and a second differential trace pair with a third trace and a fourth trace, where the first trace located opposite the second trace and the third trace from the fourth trace. Second trace stubs extend in a spaced apart orientation relative to each other and from a side of the second trace that is opposite the second trace from the first trace. Third trace stubs extend in a spaced apart orientation relative to each other and from a side of the third trace that is opposite the third trace from the fourth trace. The second trace stubs and the third trace stubs are configured to reduce crosstalk generated by the transmission of signals through the first differential trace pair and the second differential trace pair.

公开(公告)号：US20230319978A1

公开(公告)日：2023-10-05

申请号：US17713347

申请日：2022-04-05

Applicant: Dell Products L.P.

Inventor： William Andrew Smith ,  Mallikarjun Vasa ,  Bhyrav M. Mutnury

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K1/0218 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09518 ,  H05K2201/09545

Abstract: An information handling system includes a printed circuit board, a surface mount connector including first and second surface mount connector portions, first and second different pairs, and a ground plane. The first and second surface mount connector portions are mounted on the printed circuit board. The first differential pair is located on the first surface mount connector portion, and the second differential pair is located on the second surface mount connector portion. The ground plane is located in between the first and second surface mount connector portions within the printed circuit board. The first ground via is in physical communication with the ground plane and a first ground pad on a surface of the printed circuit board. The second ground via is in physical communication with the ground plane and a second ground pad on the surface of the printed circuit board.

公开(公告)号：US10667393B2

公开(公告)日：2020-05-26

申请号：US15861877

申请日：2018-01-04

Applicant: DELL PRODUCTS, L.P.

Inventor： Umesh Chandra ,  Bhyrav M. Mutnury ,  Mallikarjun Vasa

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/10 ,  H05K3/00

Abstract: A circuit board assembly of an information handling system has stepped diameter vias that carry communication signals through printed circuit board (PCB) substrates. Each stepped diameter via has a first barrel portion of a first diameter that is drilled through a first portion of the PCB substrates and that is at least lined with a conductive material to electrically conduct a selected one of: (i) a direct current and (ii) a communication signal from an outer layer to an internal layer of the more than one PCB substrate. Each stepped diameter via further includes a second barrel portion that extends from the first barrel portion deeper into the PCB substrates. The second barrel portion has a second diameter that is less than the first diameter and the smaller second diameter improves signal integrity (SI).

公开(公告)号：US20240389219A1

公开(公告)日：2024-11-21

申请号：US18784640

申请日：2024-07-25

Applicant: DELL PRODUCTS L.P.

Inventor： William Andrew Smith ,  Mallikarjun Vasa ,  Bhyrav M. Mutnury

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/42

Abstract: An information handling system includes a printed circuit board, a surface mount connector including first and second surface mount connector portions, first and second different pairs, and a ground plane. The first and second surface mount connector portions are mounted on the printed circuit board. The first differential pair is located on the first surface mount connector portion, and the second differential pair is located on the second surface mount connector portion. The ground plane is located in between the first and second surface mount connector portions within the printed circuit board. The first ground via is in physical communication with the ground plane and a first ground pad on a surface of the printed circuit board. The second ground via is in physical communication with the ground plane and a second ground pad on the surface of the printed circuit board.

公开(公告)号：US20230325569A1

公开(公告)日：2023-10-12

申请号：US17716527

申请日：2022-04-08

Applicant: Dell Products L.P.

Inventor： Vijender Kumar ,  Mallikarjun Vasa ,  Ashish Shrivastava ,  Bhyrav Mutnury ,  Seema P K ,  Sukumar Muthusamy ,  Sanjay Kumar ,  Sunil Pathania

IPC: G06F30/392

CPC classification number: G06F30/392 ,  G06F2119/08

Abstract: An information handling system includes a memory device and a processor. The memory device includes first data representing a thermal profile of a motherboard, and second data representing a circuit trace of the motherboard. The circuit trace provides a high-speed data interconnection between two or more circuit devices. The processor determines an average temperature of the circuit trace on the motherboard based upon the first data and the second data, and models a trace layout for the circuit trace on the motherboard based upon the average temperature.