公开(公告)号：US06991967B2

公开(公告)日：2006-01-31

申请号：US10785293

申请日：2004-02-23

申请人： Deming Liu ,  Ran Fu ,  Kui Kam Lam ,  Man Chung Raymond Ng ,  Wai Yuen Cheung

发明人： Deming Liu ,  Ran Fu ,  Kui Kam Lam ,  Man Chung Raymond Ng ,  Wai Yuen Cheung

IPC分类号： H01L21/44

CPC分类号： H01L24/83 ,  H01L21/67132 ,  H01L23/49861 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83801 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00015

摘要： The invention provides an apparatus for die attachment onto a substrate including non-metallic material, and metallic material that is adapted to receive a die having a eutectic coating. A heating conduit is provided through which the substrate is movable for heating the metallic material to a eutectic bonding temperature to facilitate bonding between the die and the metallic material at a die-attach position. An induction heating device at the die-attach position heats the metallic material of the substrate to the eutectic bonding temperature prior to attaching a die onto the metallic material.

摘要翻译： 本发明提供一种用于芯片附着到包括非金属材料的基板上的设备，以及适于接收具有共晶涂层的模具的金属材料。 提供加热导管，通过该加热导管可移动基板，以将金属材料加热至共晶接合温度，以便于在模具附着位置处与模具和金属材料之间的结合。 在将模具附接到金属材料上之前，在芯片附着位置处的感应加热装置将基板的金属材料加热至共晶粘合温度。

公开(公告)号：US08590143B2

公开(公告)日：2013-11-26

申请号：US13115261

申请日：2011-05-25

申请人： Kui Kam Lam ,  Yen Hsi Tang ,  Wai Yuen Cheung ,  Wing Kin Lam

发明人： Kui Kam Lam ,  Yen Hsi Tang ,  Wai Yuen Cheung ,  Wing Kin Lam

IPC分类号： B23P19/00

CPC分类号： H01L21/67144 ,  H01L24/75 ,  Y10T29/515 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183

摘要： An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually leveled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.

摘要翻译： 用于将半导体部件212输送到基板206a的装置200; 206b; 500a 500b; 500c在半导体封装制造过程中。 装置200包括平台216和固定到平台216的多个传送模块202a，202b。多个传送模块202a，202b中的每一个具有支撑装置204a; 204b，用于支撑基板206a; 206b; 500a; 500b; 500c，以及输送装置208a; 208b，用于将半导体部件212传送到基板206a; 206b; 500a; 500b; 500c。 特别地，支撑装置204a，204的高度相互平齐以输送基板206a; 206b; 500a; 500b; 500c在多个传送模块202a，202b之间。

公开(公告)号：US20120301251A1

公开(公告)日：2012-11-29

申请号：US13115261

申请日：2011-05-25

申请人： Kui Kam LAM ,  Yen Hsi Tang ,  Wai Yuen Cheung ,  Wing Kin Lam

发明人： Kui Kam LAM ,  Yen Hsi Tang ,  Wai Yuen Cheung ,  Wing Kin Lam

IPC分类号： H01L21/67

CPC分类号： H01L21/67144 ,  H01L24/75 ,  Y10T29/515 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183

摘要： An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing is disclosed. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually levelled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.

摘要翻译： 用于将半导体部件212输送到基板206a的装置200; 206b; 500a; 500b; 公开了半导体封装制造期间的500c。 装置200包括平台216和固定到平台216的多个传送模块202a，202b。多个传送模块202a，202b中的每一个具有支撑装置204a; 204b，用于支撑基板206a; 206b; 500a; 500b; 500c，以及输送装置208a; 208b，用于将半导体部件212传送到基板206a; 206b; 500a; 500b; 500c。 特别地，支撑装置204a，204的高度相互平齐以输送基板206a; 206b; 500a; 500b; 500c在多个传送模块202a，202b之间。

公开(公告)号：US08293043B2

公开(公告)日：2012-10-23

申请号：US11459503

申请日：2006-07-24

申请人： Kwok Kee Chung ,  Kui Kam Lam ,  Chi Keung Leung ,  Wai Yuen Cheung

发明人： Kwok Kee Chung ,  Kui Kam Lam ,  Chi Keung Leung ,  Wai Yuen Cheung

IPC分类号： B32B37/00

CPC分类号： H01L24/83 ,  H01L22/26 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/83 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/00

摘要： A die bonding apparatus and method is provided to automatically adjust a level of a die bonder to compensate for any physical changes occurring in the die bonder during bonding. A bond arm support is drivable to a bonding level to position a die onto a bonding surface, and a bond arm is slidably mounted to the bond arm support for holding and bonding the die. The bond arm is configured to be urged by the bonding surface to move relative to the bond arm support upon contact of the die onto the bonding surface. A measuring device is provided for determining a distance moved by the bond arm relative to the bond arm support during bonding, and a controller is responsive to the distance determined by the measuring device to change the bonding level to which the bond arm support is driven.

摘要翻译： 提供管芯接合装置和方法来自动调节管芯接合器的水平以补偿在接合期间在管芯接合器中发生的任何物理变化。 接合臂支撑件可驱动到结合水平以将模具定位到接合表面上，并且接合臂可滑动地安装到接合臂支撑件以保持和接合模具。 接合臂被配置为当接合到接合表面时被接合表面推动以相对于接合臂支撑件移动。 提供测量装置，用于确定在接合期间由接合臂相对于接合臂支撑件移动的距离，并且控制器响应于由测量装置确定的距离，以改变键合臂支撑件被驱动到的结合水平。

公开(公告)号：US20080017293A1

公开(公告)日：2008-01-24

申请号：US11459503

申请日：2006-07-24

申请人： Kwok Kee Chung ,  Kui Kam Lam ,  Chi Keung Leung ,  Wai Yuen Cheung

发明人： Kwok Kee Chung ,  Kui Kam Lam ,  Chi Keung Leung ,  Wai Yuen Cheung

IPC分类号： B32B37/00

CPC分类号： H01L24/83 ,  H01L22/26 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/83 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/00

摘要： A die bonding apparatus and method is provided to automatically adjust a level of a die bonder to compensate for any physical changes occurring in the die bonder during bonding. A bond arm support is drivable to a bonding level to position a die onto a bonding surface, and a bond arm is slidably mounted to the bond arm support for holding and bonding the die. The bond arm is configured to be urged by the bonding surface to move relative to the bond arm support upon contact of the die onto the bonding surface. A measuring device is provided for determining a distance moved by the bond arm relative to the bond arm support during bonding, and a controller is responsive to the distance determined by the measuring device to change the bonding level to which the bond arm support is driven.

摘要翻译： 提供管芯接合装置和方法来自动调节管芯接合器的水平以补偿在接合期间在管芯接合器中发生的任何物理变化。 接合臂支撑件可驱动到结合水平以将模具定位到接合表面上，并且接合臂可滑动地安装到接合臂支撑件以保持和接合模具。 接合臂被配置为当接合到接合表面时被接合表面推动以相对于接合臂支撑件移动。 提供测量装置，用于确定在接合期间由接合臂相对于接合臂支撑件移动的距离，并且控制器响应于由测量装置确定的距离，以改变键合臂支撑件被驱动到的结合水平。