Method for fabricating a cylindrical capacitor using amorphous carbon-based layer
    1.
    发明申请
    Method for fabricating a cylindrical capacitor using amorphous carbon-based layer 失效
    使用无定形碳基层制造圆柱形电容器的方法

    公开(公告)号:US20080003741A1

    公开(公告)日:2008-01-03

    申请号:US11646481

    申请日:2006-12-28

    IPC分类号: H01L21/8244

    CPC分类号: H01L28/91 H01L27/10852

    摘要: A method for fabricating a cylindrical capacitor. The method includes forming an isolation structure including an interlayer on a substrate, the substrate having a plurality of contact plugs formed therein, forming a plurality of opening regions by etching the isolation structure, thereby exposing selected portions of the contact plugs, forming storage nodes on a surface of the opening regions, etching selected portions of the isolation structure to form a patterned interlayer that encompasses selected portions of the storage nodes, thereby supporting the storage nodes, removing remaining portions of the isolation structure, and removing the patterned interlayer to expose inner and outer walls of the storage nodes.

    摘要翻译: 一种制造圆柱形电容器的方法。 所述方法包括在基板上形成包括中间层的隔离结构,所述基板具有形成在其中的多个接触塞,通过蚀刻隔离结构形成多个开口区域,从而暴露接触塞的选定部分,形成储存节点 蚀刻开口区域的表面,蚀刻隔离结构的选定部分以形成包围存储节点的选定部分的图案化中间层,从而支撑存储节点,去除隔离结构的剩余部分,以及去除图案化中间层以暴露内部 和存储节点的外壁。

    Method for fabricating a cylindrical capacitor using amorphous carbon-based layer
    2.
    发明授权
    Method for fabricating a cylindrical capacitor using amorphous carbon-based layer 失效
    使用无定形碳基层制造圆柱形电容器的方法

    公开(公告)号:US07670903B2

    公开(公告)日:2010-03-02

    申请号:US11646481

    申请日:2006-12-28

    IPC分类号: H01L21/8242

    CPC分类号: H01L28/91 H01L27/10852

    摘要: A method for fabricating a cylindrical capacitor. The method includes forming an isolation structure including an interlayer on a substrate, the substrate having a plurality of contact plugs formed therein, forming a plurality of opening regions by etching the isolation structure, thereby exposing selected portions of the contact plugs, forming storage nodes on a surface of the opening regions, etching selected portions of the isolation structure to form a patterned interlayer that encompasses selected portions of the storage nodes, thereby supporting the storage nodes, removing remaining portions of the isolation structure, and removing the patterned interlayer to expose inner and outer walls of the storage nodes.

    摘要翻译: 一种制造圆柱形电容器的方法。 所述方法包括在基板上形成包括中间层的隔离结构,所述基板具有形成在其中的多个接触塞,通过蚀刻隔离结构形成多个开口区域,从而暴露接触塞的选定部分,形成储存节点 蚀刻开口区域的表面,蚀刻隔离结构的选定部分以形成包围存储节点的选定部分的图案化中间层,从而支撑存储节点,去除隔离结构的剩余部分,以及去除图案化中间层以暴露内部 和存储节点的外壁。

    Method for fabricating capacitor in semiconductor device
    6.
    发明授权
    Method for fabricating capacitor in semiconductor device 有权
    在半导体器件中制造电容器的方法

    公开(公告)号:US07361544B2

    公开(公告)日:2008-04-22

    申请号:US11448797

    申请日:2006-06-08

    IPC分类号: H01L21/8242

    摘要: A method for fabricating a capacitor in a semiconductor device is provided. The method includes forming an insulation layer over a substrate; flushing a metal source onto the insulation layer to change a characteristic of a surface of the insulation layer to improve adherence of a metal-based material to the surface of the insulation layer; forming a storage node comprising the metal-based material over the flushed insulation layer; and sequentially forming a dielectric layer and a plate electrode over the metal-based storage node.

    摘要翻译: 提供了一种在半导体器件中制造电容器的方法。 该方法包括在衬底上形成绝缘层; 将金属源冲洗到绝缘层上以改变绝缘层的表面的特性,以改善金属基材料对绝缘层表面的粘附性; 在所述冲洗绝缘层上形成包括所述金属基材料的存储节点; 并且在金属基存储节点上依次形成电介质层和平板电极。

    Method for fabricating capacitor in semiconductor device
    8.
    发明申请
    Method for fabricating capacitor in semiconductor device 有权
    在半导体器件中制造电容器的方法

    公开(公告)号:US20070148897A1

    公开(公告)日:2007-06-28

    申请号:US11448797

    申请日:2006-06-08

    IPC分类号: H01L21/20

    摘要: A method for fabricating a capacitor in a semiconductor device is provided. The method includes forming an insulation layer over a substrate; flushing a metal source onto the insulation layer to change a characteristic of a surface of the insulation layer to improve adherence of a metal-based material to the surface of the insulation layer; forming a storage node comprising the metal-based material over the flushed insulation layer; and sequentially forming a dielectric layer and a plate electrode over the metal-based storage node.

    摘要翻译: 提供了一种在半导体器件中制造电容器的方法。 该方法包括在衬底上形成绝缘层; 将金属源冲洗到绝缘层上以改变绝缘层的表面的特性,以改善金属基材料对绝缘层表面的粘附性; 在所述冲洗绝缘层上形成包括所述金属基材料的存储节点; 并且在金属基存储节点上依次形成电介质层和平板电极。

    METHOD FOR FABRICATING A CAPACITOR
    10.
    发明申请
    METHOD FOR FABRICATING A CAPACITOR 失效
    制造电容器的方法

    公开(公告)号:US20110171808A1

    公开(公告)日:2011-07-14

    申请号:US13069294

    申请日:2011-03-22

    IPC分类号: H01L21/02

    摘要: A method for fabricating a capacitor includes forming an isolation layer over a cell region and a peripheral region of a substrate. The isolation layer forms a plurality of open regions in the cell region. Storage nodes are formed on surfaces of the open regions. A sacrificial pattern is formed over the isolation layer and covers the cell region. The isolation layer is etched in the peripheral region to expose side portions of the resulting structure obtained after forming the sacrificial pattern in the cell region. With the sacrificial pattern supporting the storage nodes, the isolation layer in the cell region is removed. The sacrificial pattern is then removed.

    摘要翻译: 制造电容器的方法包括在衬底的单元区域和周边区域上形成隔离层。 隔离层在单元区域中形成多个开放区域。 存储节点形成在开放区域的表面上。 在隔离层上形成牺牲图案并覆盖单元区域。 在外围区域中蚀刻隔离层,以暴露在单元区域中形成牺牲图案之后获得的所得结构的侧面部分。 利用支持存储节点的牺牲图案,移除单元区域中的隔离层。 然后去除牺牲图案。