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公开(公告)号：US20120216084A1
公开(公告)日：2012-08-23
申请号：US13029934
申请日：2011-02-17
申请人： Dexter T. Chun , Jack K. Wolf , Jungwon Suh , Tirdad Sowlati
发明人： Dexter T. Chun , Jack K. Wolf , Jungwon Suh , Tirdad Sowlati
IPC分类号： G06F11/00
CPC分类号： H04L12/12 , H04L1/0001 , H04L1/0036 , H04L25/02 , H04W52/0209 , Y02D70/00
摘要： A system involves a first SerDes link from a first integrated circuit (IC) to a second IC and a second link from the second IC to the first IC. Power consumption settings in circuitry of the first link are adjusted to control power consumption such that the bit error rate of the first link is maintained in a range, where the lower bound of the range is substantially greater than zero. Power consumption settings in circuitry for the second link are adjusted to control power consumption such that the bit error rate of the second link is maintained in range, where the lower bound of the range is substantially greater than zero. In one example, circuitry in the second IC detects errors in the first link and reports back via the second link. The first IC uses the reported information to determine a bit error rate for the first link.
摘要翻译： 系统涉及从第一集成电路（IC）到第二IC的第一SerDes链路以及从第二IC到第一IC的第二链路。 调整第一链路的电路中的功率消耗设置以控制功率消耗，使得第一链路的误码率保持在范围的下限基本上大于零的范围内。 调整用于第二链路的电路中的功率消耗设置以控制功率消耗，使得第二链路的误码率保持在范围内，其范围的下限基本上大于零。 在一个示例中，第二IC中的电路检测第一链路中的错误并通过第二链路报告。 第一个IC使用报告的信息来确定第一个链路的误码率。
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2.发明申请公开(公告)号：US20130271920A1
公开(公告)日：2013-10-17
申请号：US13445385
申请日：2012-04-12
CPC分类号： H01L23/3672 , H01L2924/0002 , H05K7/2039 , H05K7/20409 , Y10T29/49826 , H01L2924/00
摘要： Electronic devices incorporating a heat dissipation feature include an enclosure, and at least one heat-generating component positioned within the enclosure. The heat dissipation feature is sufficiently coupled to the at least one heat-generating component to facilitate conductive heat transfer from the heat-generating component. The heat dissipation feature includes a plurality of protrusions exposed externally to the enclosure. A thermally insulating material may be disposed on at least a tip portion of at least some of the protrusions. The thermally insulating material is selected to provide a touch temperature that is below a predetermined threshold. In some instances, the thermally insulating material can provide such a touch temperature by selecting the material to include properties for thermal conductivity (k), density (ρ), and specific heat (Cp) such that the product of k*ρ*Cp results in a value less than a product of k*ρ*Cp for human skin.
摘要翻译： 结合散热特征的电子设备包括外壳，以及至少一个定位在外壳内的发热元件。 散热特征与至少一个发热部件充分耦合，以便于来自发热部件的传导热传递。 散热特征包括暴露在外壳外部的多个突起。 绝热材料可以设置在至少一些突起的至少一个尖端部分上。 选择绝热材料以提供低于预定阈值的触摸温度。 在某些情况下，绝热材料可以通过选择材料来提供这样的触摸温度，以包括热导率（k），密度（rho）和比热（Cp）的性质，使得k * rho * Cp的结果结果 其值小于人皮肤的k * rho * Cp的乘积。
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3.发明授权公开(公告)号：US09165854B2
公开(公告)日：2015-10-20
申请号：US13445385
申请日：2012-04-12
IPC分类号： H05K7/20 , H01L23/373 , H01L23/367
CPC分类号： H01L23/3672 , H01L2924/0002 , H05K7/2039 , H05K7/20409 , Y10T29/49826 , H01L2924/00
摘要： Electronic devices incorporating a heat dissipation feature include an enclosure, and at least one heat-generating component positioned within the enclosure. The heat dissipation feature is sufficiently coupled to the at least one heat-generating component to facilitate conductive heat transfer from the heat-generating component. The heat dissipation feature includes a plurality of protrusions exposed externally to the enclosure. A thermally insulating material may be disposed on at least a tip portion of at least some of the protrusions. The thermally insulating material is selected to provide a touch temperature that is below a predetermined threshold. In some instances, the thermally insulating material can provide such a touch temperature by selecting the material to include properties for thermal conductivity (k), density (ρ), and specific heat (Cp) such that the product of k*ρ*Cp results in a value less than a product of k*ρ*Cp for human skin.
摘要翻译： 结合散热特征的电子设备包括外壳，以及至少一个定位在外壳内的发热元件。 散热特征与至少一个发热部件充分耦合，以便于来自发热部件的传导热传递。 散热特征包括暴露在外壳外部的多个突起。 绝热材料可以设置在至少一些突起的至少一个尖端部分上。 选择绝热材料以提供低于预定阈值的触摸温度。 在一些情况下，绝热材料可以通过选择材料来提供这样的触摸温度，以包括热导率（k），密度（＆rgr）和比热（Cp）的性质，使得k *＆rgr; * Cp导致小于人类皮肤的k *＆rgr; * Cp的乘积的值。
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