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公开(公告)号：US20100044219A1
公开(公告)日：2010-02-25
申请号：US12608410
申请日：2009-10-29
CPC分类号： C25B11/0484 , C25B1/265 , Y10T428/12708 , Y10T428/12771 , Y10T428/12806
摘要： The present invention relates to an electrocatalytic coating and an electrode having the coating thereon, wherein the coating is a mixed metal oxide coating, preferably ruthenium, titanium and tin or antimony oxides. The coating uses water as a solvent that provides for a smoother surface than alcohol based solvents. The electrocatalytic coating can be used especially as an anode component of an electrolysis cell and in particular a cell for the electrolysis of aqueous chlor-alkali solutions.
摘要翻译： 本发明涉及电催化涂层和其上具有涂层的电极，其中涂层是混合金属氧化物涂层，优选钌，钛和锡或氧化锑。 涂层使用水作为溶剂，其提供比醇基溶剂更光滑的表面。 电催化涂层可以特别用作电解槽的阳极组件，特别是用于电解氯碱水溶液的电池。
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公开(公告)号：US07632535B2
公开(公告)日：2009-12-15
申请号：US10553026
申请日：2004-05-07
IPC分类号： B05D5/12
CPC分类号： C25B11/0484 , C25B1/265 , Y10T428/12708 , Y10T428/12771 , Y10T428/12806
摘要： The present invention relates to an electrocatalytic coating and an electrode having the coating thereon, wherein the coating is a mixed metal oxide coating, preferably ruthenium, titanium and tin or antimony oxides. The coating uses water as a solvent that provides for a smoother surface than alcohol based solvents. The electrocatalytic coating can be used especially as an anode component of an electrolysis cell and in particular a cell for the electrolysis of aqueous chlor-alkali solutions.
摘要翻译： 本发明涉及电催化涂层和其上具有涂层的电极，其中涂层是混合金属氧化物涂层，优选钌，钛和锡或氧化锑。 涂层使用水作为溶剂，其提供比醇基溶剂更光滑的表面。 电催化涂层可以特别用作电解槽的阳极组件，特别是用于电解氯碱水溶液的电池。
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公开(公告)号：US08142898B2
公开(公告)日：2012-03-27
申请号：US12608410
申请日：2009-10-29
CPC分类号： C25B11/0484 , C25B1/265 , Y10T428/12708 , Y10T428/12771 , Y10T428/12806
摘要： The present invention relates to an electrocatalytic coating and an electrode having the coating thereon, wherein the coating is a mixed metal oxide coating, preferably ruthenium, titanium and tin or antimony oxides. The coating uses water as a solvent that provides for a smoother surface than alcohol based solvents. The electrocatalytic coating can be used especially as an anode component of an electrolysis cell and in particular a cell for the electrolysis of aqueous chlor-alkali solutions.
摘要翻译： 本发明涉及电催化涂层和其上具有涂层的电极，其中涂层是混合金属氧化物涂层，优选钌，钛和锡或氧化锑。 涂层使用水作为溶剂，其提供比醇基溶剂更光滑的表面。 电催化涂层可以特别用作电解槽的阳极组件，特别是用于电解氯碱水溶液的电池。
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公开(公告)号：US07884044B2
公开(公告)日：2011-02-08
申请号：US11661819
申请日：2004-09-01
CPC分类号： C25B11/0484 , C25B1/26 , C25B11/0478
摘要： The present invention relates to an electrocatalytic coating and an electrode having the coating thereon, wherein the coating is a mixed metal oxide coating, preferably platinum group metal oxides with or without valve metal oxides, and containing a transition metal component such as palladium, rhodium or cobalt. The electrocatalytic coating can be used especially as an anode component of an electrolysis cell for the electrolysis of a halogen-containing solution wherein the palladium component reduces the operating potential of the anode and eliminates the necessity of a “break-in” period to obtain the lowest anode potential.
摘要翻译： 本发明涉及电催化涂层及其上具有涂层的电极，其中涂层是混合金属氧化物涂层，优选具有或不具有阀金属氧化物的铂族金属氧化物，并且含有过渡金属组分如钯，铑或 钴。 电催化涂层可以特别用作用于电解含卤素溶液的电解池的阳极组分，其中钯组分降低了阳极的操作电位，并且消除了“入室”时间以获得 最低阳极电位。
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公开(公告)号：US5431803A
公开(公告)日：1995-07-11
申请号：US141483
申请日：1993-10-22
CPC分类号： C25D3/38 , C25D1/04 , H05K1/09 , H05K2201/0355 , H05K3/382 , Y10T428/12 , Y10T428/12431
摘要： This invention is directed to a controlled low profile electrodeposited copper foil. In one embodiment this foil has a substantially uniform randomly oriented grain structure that is essentially columnar grain free and twin boundary free and has an average grain size of up to about 10 microns. In one embodiment this foil has an ultimate tensile strength measured at 23.degree. C. in the range of about 87,000 to about 120,000 psi and an elongation measured at 180.degree. C. of about 15% to about 28%. The invention is also directed to a process for making the foregoing foil, the process comprising: (A) flowing an electrolyte solution between an anode and a cathode and applying an effective amount of voltage across said anode and said cathode to deposit copper on said cathode; said electrolyte solution comprising copper ions, sulfate ions and at least one organic additive or derivative thereof, the chloride ion concentration of said solution being up to about 1 ppm; the current density being in the range of about 0.1 to about 5 A/cm.sup.2 ; and (B) removing copper foil from said cathode.
摘要翻译： 本发明涉及一种受控的低剖面电沉积铜箔。 在一个实施方案中，该箔具有基本上均匀的随机取向的晶粒结构，其基本上是无柱形的和双边界自由的并且具有高达约10微米的平均晶粒尺寸。 在一个实施方案中，该箔具有在23℃下在约87,000至约120,000psi的范围内测量的极限拉伸强度，并且在180℃下测量的伸长率为约15％至约28％。 本发明还涉及一种制备上述箔的方法，该方法包括：（A）在阳极和阴极之间流动电解质溶液，并在所述阳极和所述阴极之间施加有效量的电压以在所述阴极上沉积铜 ; 所述电解质溶液包含铜离子，硫酸根离子和至少一种有机添加剂或其衍生物，所述溶液的氯离子浓度高达约1ppm; 电流密度在约0.1至约5A / cm2的范围内; 和（B）从所述阴极去除铜箔。
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6.发明授权Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same 失效具有印刷电路板应用和程序的控制性能的电沉积箔和用于制备它们的电解槽解决方案
公开(公告)号：US5215645A
公开(公告)日：1993-06-01
申请号：US406894
申请日：1989-09-13
CPC分类号： H05K1/09 , C25D1/04 , C25D3/38 , H05K2201/0355 , Y10T428/12
摘要： Copper conductive foil for use in preparing printed circuit boards is electrodeposited from an electrolyte solution containing copper ions, sulphate ions, animal glue and thiourea. The thiourea operates to decrease the roughness of the foil, to enable operation at higher current densities and/or to modify the ductility characteristics of the foil.
摘要翻译： 用于制备印刷电路板的铜导电箔从含有铜离子，硫酸根离子，动物胶和硫脲的电解液中电沉积。 硫脲用于降低箔的粗糙度，以使得能够以更高的电流密度操作和/或改变箔的延展性。
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公开(公告)号：US5454926A
公开(公告)日：1995-10-03
申请号：US363704
申请日：1994-12-23
CPC分类号： C25D3/38 , C25D1/04 , H05K1/09 , H05K2201/0355 , H05K3/382 , Y10S428/935 , Y10T428/12431 , Y10T428/12993
摘要： This invention relates to electrodeposited copper foil having an elongation measured at 180.degree. C. in excess of about 5.5%, an ultimate tensile strength measured at 23.degree. C. in excess of about 60,000 psi, and a matte-side R.sub.tm in the range of about 4.5 to about 18 .mu.m. This invention also relates to a process for making electrodeposited copper foil which comprises: preparing a copper deposition bath comprising water, copper ions and sulfate ions, said bath containing less than about 20 ppm chloride ions; and applying electric current to said bath to electrodeposit copper from said bath using a current density in the range of about 200 to about 3000 amps per square foot.
摘要翻译： 本发明涉及电沉积铜箔，其在180℃下测得的伸长率超过约5.5％，在23℃下测得的超过约60,000psi的极限抗拉强度， 约4.5至约18亩。 本发明还涉及一种制备电沉积铜箔的方法，其包括：制备包含水，铜离子和硫酸根离子的铜沉积浴，所述浴含有少于约20ppm的氯离子; 以及向所述浴施加电流以使用约200至约3000安培/平方英尺范围内的电流密度从所述浴电沉积铜。
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8.发明授权
公开(公告)号：US5171417A
公开(公告)日：1992-12-15
申请号：US510231
申请日：1990-04-18
CPC分类号： H05K1/09 , C25D1/04 , C25D3/38 , H05K2201/0355 , Y10T428/12
摘要： Copper conductive foil for use in preparing printed circuit boards is electrodeposited from an electrolyte solution containing copper ions, sulphate ions and thiourea. The thiourea operates to decrease the roughness of the foil, to enable operation at higher current densities, and/or to modify the tensile strength and ductility characteristics of the foil. An IPC Class 2 foil is prepared without annealing.
摘要翻译： 用于制备印刷电路板的铜导电箔从含有铜离子，硫酸根离子和硫脲的电解液中电沉积。 硫脲的作用是降低箔的粗糙度，使得能够以更高的电流密度操作，和/或改变箔的拉伸强度和延展性。 制备IPC Class 2箔不退火。
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9.发明授权
公开(公告)号：US5421985A
公开(公告)日：1995-06-06
申请号：US865791
申请日：1992-04-07
CPC分类号： C25D3/38 , C25D1/04 , H05K1/09 , H05K2201/0355 , H05K3/382 , Y10S428/935 , Y10T428/12431 , Y10T428/12993
摘要： This invention relates to electrodeposited copper foil having an elongation measured at 180.degree. C. in excess of about 5.5%, an ultimate tensile strength measured at 23.degree. C. in excess of about 60,000 psi, and a matte-side R.sub.tm in the range of about 4.5 to about 18 .mu.m. This invention also relates to a process for making electrodeposited copper foil which comprises: preparing a copper deposition bath comprising water, copper ions and sulfate ions, said bath containing less than about 20 ppm chloride ions; and applying electric current to said bath to electrodeposit copper from said bath using a current density in the range of about 200 to about 3000 amps per square foot.
摘要翻译： 本发明涉及电沉积铜箔，其在180℃下测得的伸长率超过约5.5％，在23℃下测得的超过约60,000psi的极限抗拉强度， 约4.5至约18亩。 本发明还涉及一种制备电沉积铜箔的方法，其包括：制备包含水，铜离子和硫酸根离子的铜沉积浴，所述浴含有少于约20ppm的氯离子; 以及向所述浴施加电流以使用约200至约3000安培/平方英尺范围内的电流密度从所述浴电沉积铜。
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公开(公告)号：US5332486A
公开(公告)日：1994-07-26
申请号：US11367
申请日：1993-01-29
申请人： Dino F. DiFranco
发明人： Dino F. DiFranco
CPC分类号： H05K3/384 , C25D1/04 , C25D5/48 , H05K3/282 , H05K2201/0355 , H05K2203/0723 , H05K3/244 , Y10T428/12438 , Y10T428/12903
摘要： This invention relates to a method for increasing oxidation protection and decreasing the nonuniformities in an electrodeposited layer of a treated copper foil or treated copper-based alloy foil, comprising depositing a protective anti-oxidation coating onto at least one surface of said foil from a solution comprising arsenic. The invention also encompasses the copper foil or copper-based alloy foil coated to improve appearance and oxidation resistance of the foil.
摘要翻译： 本发明涉及一种用于增加氧化保护并降低经处理的铜箔或经处理的铜基合金箔的电沉积层中的不均匀性的方法，包括从溶液中将所述箔的至少一个表面上沉积保护性抗氧化涂层 包括砷。 本发明还包括涂覆以提高箔的外观和抗氧化性的铜箔或铜基合金箔。
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