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公开(公告)号：US20130292655A1
公开(公告)日：2013-11-07
申请号：US13823921
申请日：2011-07-28
Applicant: Dirk Becker , Erwin Lang , Thilo Reusch
Inventor： Dirk Becker , Erwin Lang , Thilo Reusch
Abstract: A method for producing an electronic component may include: applying an electrode growth layer on or above a layer structure by means of an atomic layer deposition method; and applying an electrode on the electrode growth layer, wherein the electrode growth layer is applied with a layer thickness in a range of approximately 1.5 nm to approximately 28 nm.
Abstract translation: 电子部件的制造方法可以包括：通过原子层沉积法在层结构上或上方施加电极生长层; 以及在所述电极生长层上施加电极，其中所述电极生长层的厚度在约1.5nm至约28nm的范围内。
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公开(公告)号：US09059423B2
公开(公告)日：2015-06-16
申请号：US13387690
申请日：2010-07-15
Applicant: Dirk Becker , Thomas Dobbertin , Thilo Reusch , Erwin Lang
Inventor： Dirk Becker , Thomas Dobbertin , Thilo Reusch , Erwin Lang
CPC classification number: H01L51/5203 , H01L2251/558
Abstract: An electronic component (100), which comprises a substrate (1), at least one first electrode (3) arranged on the substrate (3) and a growth layer (7) on the side of the electrode (3) remote from the substrate (7), wherein the electrode (7) arranged on the growth layer (3) comprises a metal layer (9) with a thickness of less than or equal to 30 nm and the growth layer (7) has a thickness which is less than or equal to 10 nm. An electrical contact is also disclosed.
Abstract translation: 一种电子部件（100），其包括基板（1），布置在所述基板（3）上的至少一个第一电极（3）和远离所述基板的所述电极（3）侧的生长层（7） （7），其中布置在生长层（3）上的电极（7）包括厚度小于或等于30nm的金属层（9），并且生长层（7）的厚度小于 或等于10nm。 还公开了电接触。
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3.发明申请公开(公告)号：US20120132953A1
公开(公告)日：2012-05-31
申请号：US13260560
申请日：2010-03-22
Applicant: Dirk Becker , Thomas Dobbertin , Erwin Lang , Thilo Reusch
Inventor： Dirk Becker , Thomas Dobbertin , Erwin Lang , Thilo Reusch
CPC classification number: H01L51/448 , H01L51/5256 , Y02E10/549 , Y02P70/521
Abstract: A thin-layer encapsulation (1) for an optoelectronic component. The thin-layer encapsulation (1) comprises a sequence of layers (2) that comprises the following layers: a first ALD layer (3) deposited by means of atomic layer deposition, and a second ALD layer (4) deposited by means of atomic layer deposition. A method is disclosed for producing the thin-layer encapsulation and an optoelectronic component is disclosed having such a thin-layer encapsulation.
Abstract translation: 用于光电子元件的薄层封装（1）。 薄层封装（1）包括层序列（2），其包括以下层：通过原子层沉积沉积的第一ALD层（3）和通过原子沉积的第二ALD层（4） 层沉积。 公开了用于制造薄层封装的方法，并且公开了具有这种薄层封装的光电子部件。
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4.发明授权公开(公告)号：US09444062B2
公开(公告)日：2016-09-13
申请号：US13260560
申请日：2010-03-22
Applicant: Dirk Becker , Thomas Dobbertin , Erwin Lang , Thilo Reusch
Inventor： Dirk Becker , Thomas Dobbertin , Erwin Lang , Thilo Reusch
CPC classification number: H01L51/448 , H01L51/5256 , Y02E10/549 , Y02P70/521
Abstract: A thin-layer encapsulation (1) for an optoelectronic component. The thin-layer encapsulation (1) comprises a sequence of layers (2) that comprises the following layers: a first ALD layer (3) deposited by means of atomic layer deposition, and a second ALD layer (4) deposited by means of atomic layer deposition. A method is disclosed for producing the thin-layer encapsulation and an optoelectronic component is disclosed having such a thin-layer encapsulation.
Abstract translation: 用于光电子元件的薄层封装（1）。 薄层封装（1）包括层序列（2），其包括以下层：通过原子层沉积沉积的第一ALD层（3）和通过原子沉积的第二ALD层（4） 层沉积。 公开了用于制造薄层封装的方法，并且公开了具有这种薄层封装的光电子部件。
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公开(公告)号：US20120175668A1
公开(公告)日：2012-07-12
申请号：US13387690
申请日：2010-07-15
Applicant: Dirk Becker , Thomas Dobbertin , Thilo Reusch , Erwin Lang
Inventor： Dirk Becker , Thomas Dobbertin , Thilo Reusch , Erwin Lang
CPC classification number: H01L51/5203 , H01L2251/558
Abstract: An electronic component (100), which comprises a substrate (1), at least one first electrode (3) arranged on the substrate (3) and a growth layer (7) on the side of the electrode (3) remote from the substrate (7), wherein the electrode (7) arranged on the growth layer (3) comprises a metal layer (9) with a thickness of less than or equal to 30 nm and the growth layer (7) has a thickness which is less than or equal to 10 nm. An electrical contact is also disclosed.
Abstract translation: 一种电子部件（100），其包括基板（1），布置在所述基板（3）上的至少一个第一电极（3）和远离所述基板的所述电极（3）侧的生长层（7） （7），其中布置在生长层（3）上的电极（7）包括厚度小于或等于30nm的金属层（9），并且生长层（7）的厚度小于 或等于10nm。 还公开了电接触。
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Patent Agency Ranking
6.发明申请公开(公告)号：US20140319482A1
公开(公告)日：2014-10-30
申请号：US14131922
申请日：2012-05-31
Applicant: Thomas Dobbertin , Erwin Lang , Thilo Reusch , Daniel Steffen Setz
Inventor： Thomas Dobbertin , Erwin Lang , Thilo Reusch , Daniel Steffen Setz
CPC classification number: H01L51/5268 , H01L27/322 , H01L51/5262 , H01L51/5265 , H01L51/5271 , H01L51/56
Abstract: A light-emitting component may include: a first electrode; an organic electroluminescent layer structure on or above the first electrode; a second translucent electrode on or above the organic electroluminescent layer structure; an optically translucent layer structure on or above the second electrode, wherein the optically translucent layer structure includes photoluminescence material; and a mirror layer structure on or above the optically translucent layer structure.
Abstract translation: 发光部件可以包括：第一电极; 在第一电极上或上方的有机电致发光层结构; 在有机电致发光层结构上或上方的第二透光电极; 在第二电极上或上方的光学半透明层结构，其中所述光学半透明层结构包括光致发光材料; 以及在光学半透明层结构上或上方的镜层结构。
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7.发明申请公开(公告)号：US20140138662A1
公开(公告)日：2014-05-22
申请号：US14131690
申请日：2012-05-31
Applicant: Britta Goeoetz , Erwin Lang , Thilo Reusch , Daniel Steffen Setz
Inventor： Britta Goeoetz , Erwin Lang , Thilo Reusch , Daniel Steffen Setz
CPC classification number: H01L51/5268 , H01L51/5265 , H01L51/5271 , H01L51/529 , H01L51/56 , H01L2251/558
Abstract: A light-emitting component may include: a first electrode; an organic electroluminescent layer structure on or over the first electrode; a second translucent electrode on or over the organic electroluminescent layer structure; and a mirror layer structure on or over the second electrode, wherein the mirror layer structure has a lateral thermal conductance of at least 1*10−3 W/K.
Abstract translation: 发光部件可以包括：第一电极; 在第一电极上或上方的有机电致发光层结构; 在有机电致发光层结构上或上方的第二透明电极; 以及在所述第二电极上或上方的镜层结构，其中所述镜层结构具有至少1×10 -3 W / K的横向热导率。
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公开(公告)号：US09105874B2
公开(公告)日：2015-08-11
申请号：US14131690
申请日：2012-05-31
Applicant: Britta Goeoetz , Erwin Lang , Thilo Reusch , Daniel Steffen Setz
Inventor： Britta Goeoetz , Erwin Lang , Thilo Reusch , Daniel Steffen Setz
CPC classification number: H01L51/5268 , H01L51/5265 , H01L51/5271 , H01L51/529 , H01L51/56 , H01L2251/558
Abstract: A light-emitting component may include: a first electrode; an organic electroluminescent layer structure on or over the first electrode; a second translucent electrode on or over the organic electroluminescent layer structure; and a mirror layer structure on or over the second electrode, wherein the mirror layer structure has a lateral thermal conductance of at least 1*10−3 W/K.
Abstract translation: 发光部件可以包括：第一电极; 在第一电极上或上方的有机电致发光层结构; 在有机电致发光层结构上或上方的第二透明电极; 以及在所述第二电极上或上方的镜层结构，其中所述镜层结构具有至少1×10 -3 W / K的横向热导率。
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9.发明申请ORGANIC LIGHT-EMITTING COMPONENT AND METHOD FOR PRODUCING AN ORGANIC LIGHT-EMITTING COMPONENT 审中-公开有机发光元件及生产有机发光元件的方法公开(公告)号：US20140225086A1
公开(公告)日：2014-08-14
申请号：US14131685
申请日：2012-06-20
Applicant: Thomas Dobbertin , Erwin Lang , Thilo Reusch , Daniel Steffen Setz
Inventor： Thomas Dobbertin , Erwin Lang , Thilo Reusch , Daniel Steffen Setz
CPC classification number: H01L51/5268 , H01L51/5265 , H01L51/5271 , H01L51/5275 , H01L51/56 , H01L2251/53 , H01L2251/56
Abstract: An organic light-emitting component, may include: a first electrode; an organic light-generating layer structure on or above the first electrode; a second translucent electrode on or above the organic light-generating layer structure; an optically translucent layer structure on or above the second electrode; and a mirror layer structure on or above the optically translucent layer structure, wherein the mirror layer structure has a light-scattering structure on that side of the mirror layer structure which lies toward the optically translucent layer structure.
Abstract translation: 有机发光部件可以包括：第一电极; 在第一电极上或上方的有机发光层结构; 在有机发光层结构上方或上方的第二透光性电极; 在第二电极上或上方的光学半透明层结构; 以及在所述光学半透明层结构上或上方的镜层结构，其中所述镜层结构在所述镜层结构的朝向所述光学半透明层结构的所述侧上具有光散射结构。
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公开(公告)号：US09172057B2
公开(公告)日：2015-10-27
申请号：US14129997
申请日：2012-06-20
Applicant: Richard Baisl , Dirk Becker , Thomas Dobbertin , Doreen Heppner , Benjamin Krummacher , Erwin Lang , Tilman Schlenker , Christian Schmid
Inventor： Richard Baisl , Dirk Becker , Thomas Dobbertin , Doreen Heppner , Benjamin Krummacher , Erwin Lang , Tilman Schlenker , Christian Schmid
CPC classification number: H01L51/5253 , H01L51/448 , H01L51/5237 , H01L51/524 , H01L51/5256
Abstract: An encapsulation structure for an optoelectronic component, may include: a thin-film encapsulation for protecting the optoelectronic component against chemical impurities; an adhesive layer formed on the thin-film encapsulation; and a cover layer formed on the adhesive layer and serving for protecting the thin-film encapsulation and/or the optoelectronic component against mechanical damage, wherein the adhesive layer is formed such that particle impurities situated at the surface of the thin-film encapsulation are at least partly enclosed by the adhesive layer.
Abstract translation: 用于光电子部件的封装结构可以包括：用于保护光电子部件免受化学杂质的薄膜封装; 形成在薄膜封装上的粘合剂层; 以及形成在所述粘合剂层上并用于保护所述薄膜封装和/或所述光电部件免受机械损伤的覆盖层，其中所述粘合剂层形成为使得位于所述薄膜封装表面处的颗粒杂质处于 最少部分地被粘合剂层包围。
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