摘要:
The invention relates to an ultrathin semiconductor circuit having contact bumps and to a corresponding production method. The semiconductor circuit includes a bump supporting layer having a supporting layer thickness and having a supporting layer opening for uncovering a contact layer element being formed on the surface of a semiconductor circuit. An electrode layer is situated on the surface of the contact layer element within the opening of the bump supporting layer, on which electrode layer is formed a bump metallization for realizing the contact bump. On account of the bump supporting layer, a thickness of the semiconductor circuit can be thinned to well below 300 micrometers, with the wafer reliably being prevented from breaking. Furthermore, the moisture barrier properties of the semiconductor circuit are thereby improved.
摘要:
The invention relates to an ultrathin semiconductor circuit having contact bumps and to a corresponding production method. The semiconductor circuit includes a bump supporting layer having a supporting layer thickness and having a supporting layer opening for uncovering a contact layer element being formed on the surface of a semiconductor circuit. An electrode layer is situated on the surface of the contact layer element within the opening of the bump supporting layer, on which electrode layer is formed a bump metallization for realizing the contact bump. On account of the bump supporting layer, a thickness of the semiconductor circuit can be thinned to well below 300 micrometers, with the wafer reliably being prevented from breaking. Furthermore, the moisture barrier properties of the semiconductor circuit are thereby improved.
摘要:
The invention relates to an ultrathin semiconductor circuit having contact bumps and to a corresponding production method. The semiconductor circuit includes a bump supporting layer having a supporting layer thickness and having a supporting layer opening for uncovering a contact layer element being formed on the surface of a semiconductor circuit. An electrode layer is situated on the surface of the contact layer element within the opening of the bump supporting layer, on which electrode layer is formed a bump metallization for realizing the contact bump. On account of the bump supporting layer, a thickness of the semiconductor circuit can be thinned to well below 300 micrometers, with the wafer reliably being prevented from breaking. Furthermore, the moisture barrier properties of the semiconductor circuit are thereby improved.
摘要:
The rear-view mirror comprises a mirror housing, in which a mirror glass is disposed. It is surrounded by a rim portion, wherein at least a part of the rim portion is configured moveable relative to the mirror housing. Said part can be configured elastically resilient, linked with the mirror housing, or it can be provided detachable. When the mirror housing touches its installed elements during an evasive movement, the corresponding part of the rim portion can move, whereby an additional travel distance for the mirror housing is provided.
摘要:
The rear-view mirror comprises a mirror housing, in which a mirror glass is disposed. It is surrounded by a rim portion, wherein at least a part of the rim portion is configured moveable relative to the mirror housing. Said part can be configured elastically resilient, linked with the mirror housing, or it can be provided detachable. When the mirror housing touches its installed elements during an evasive movement, the corresponding part of the rim portion can move, whereby an additional travel distance for the mirror housing is provided.
摘要:
A dispensing cartridge, particularly for dental impression materials, formed from a plastic material having at least one inlet and at least one outlet, and including a metal reinforcement tube.
摘要:
Two sensors (20, 30) which cooperate with one another are used in the interior of an activator (10) in order to trigger functions in a vehicle, said sensors (20, 30) being a proximity sensor (20) with a capacitive electrode (21) and a pressure sensor (30) with a pressure measuring element (31). The intention is that the pressure measuring element (31) will be acted on when pressure is applied manually (44) to an application point (43) on the outside of the actuator (10). It is proposed that in order to improve the method of functioning that the electrode (21) of the proximity sensor (20) be provided with a breakthrough (22) and that the pressure transmission between the application point (43) on the actuator (10) and the pressure measuring element (31) be lead through the breakthrough (22) in the electrode (21). The space between the application point (43) and the pressure measuring element (31) is spanned by a pressure transmitting means (50) which passes through the breakthrough (22). The functioning of the proximity sensor (20) is not hampered just as the functioning of the pressure measuring element (31) is unimpeded, (FIG. 1).
摘要:
Disclosed is an optical transmission system and module which includes a negative dispersion, dispersion compensating optical fiber coupled to a micro-structured optical fiber (such as band gap fiber, photonic crystal fiber or holey fiber) for compensating for the accumulated dispersion in a transmission fiber. The optical transmission system and module in accordance with the invention provides substantially equal compensation of total dispersion over an operating wavelength band, reduced overall system length, and lower insertion loss.
摘要:
A door handle assembly for a motor vehicle has a handle mount, a handle and a coupling device, wherein the handle is coupled to the coupling device in the region of its second handle end which provides a door handle assembly in a structurally simple manner, in which the play in the longitudinal direction of the handle mount, and thus the clearance in the opening in the door panel for the handle ends, is reduced to a minimum. This is achieved in that the second handle end of the handle and a deflection lever of the mechanical coupling device are moveably coupled to one another by a pivotable and hinge-like articulated connection of the second handle end in relation to the deflection lever, when the handle has been actuated.