公开(公告)号：US08980696B2

公开(公告)日：2015-03-17

申请号：US13292103

申请日：2011-11-09

申请人： Dominic Koey Poh Meng ,  Zhiwei Gong ,  Kesvakumar V. C. Muniandy ,  Weng Foong Yap

发明人： Dominic Koey Poh Meng ,  Zhiwei Gong ,  Kesvakumar V. C. Muniandy ,  Weng Foong Yap

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  A01J21/00 ,  A01J25/12 ,  H01L23/498 ,  H01L21/56 ,  H01L23/538 ,  H01L23/00 ,  H01L23/24 ,  H01L23/31

CPC分类号： H01L23/49816 ,  H01L21/561 ,  H01L21/568 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00

摘要： A method of packaging a semiconductor die includes the use of an embedded ground plane or drop-in embedded unit. The embedded unit is a single, stand-alone unit with at least one cavity. The embedded unit is placed on and within an encapsulation area of a process mounting surface. The embedded unit may have different sizes and shapes and a number of different cavities that can be placed in a predetermined position on a substrate, panel or tape during processing of semiconductor dies that are embedded into redistributed chip package (RCP) or wafer level package (WFL) panels. The embedded unit provides the functionality and design flexibility to run a number of embedded units and semiconductor dies or components having different sizes and dimensions in a single processing panel or batch and reduces die drift, movement or skew during encapsulation and post-encapsulation cure.

摘要翻译： 封装半导体管芯的方法包括使用嵌入式接地层或嵌入式嵌入式单元。 嵌入式单元是具有至少一个空腔的单个独立单元。 嵌入式单元被放置在过程安装表面的封装区域内和之内。 嵌入式单元可以具有不同的尺寸和形状以及在处理半导体管芯期间可以放置在基板，面板或带上的预定位置的多个不同的空腔，该半导体管芯嵌入到再分布芯片封装（RCP）或晶片级封装 WFL）面板。 嵌入式单元提供功能和设计灵活性，可以在单个处理面板或批次中运行多个嵌入式单元和半导体管芯或具有不同尺寸和尺寸的部件，并减少封装和封装后固化期间的管芯漂移，移动或歪斜。

公开(公告)号：US20130113091A1

公开(公告)日：2013-05-09

申请号：US13292103

申请日：2011-11-09

申请人： Dominic Koey Poh Meng ,  Zhiwei Gong ,  Kesvakumar V.C. Muniandy ,  Weng Foong Yap

发明人： Dominic Koey Poh Meng ,  Zhiwei Gong ,  Kesvakumar V.C. Muniandy ,  Weng Foong Yap

IPC分类号： H01L23/28 ,  B29C33/12 ,  H01L21/56

CPC分类号： H01L23/49816 ,  H01L21/561 ,  H01L21/568 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00

摘要： A method of packaging a semiconductor die includes the use of an embedded ground plane or drop-in embedded unit. The embedded unit is a single, stand-alone unit with at least one cavity. The embedded unit is placed on and within an encapsulation area of a process mounting surface. The embedded unit may have different sizes and shapes and a number of different cavities that can be placed in a predetermined position on a substrate, panel or tape during processing of semiconductor dies that are embedded into redistributed chip package (RCP) or wafer level package (WFL) panels. The embedded unit provides the functionality and design flexibility to run a number of embedded units and semiconductor dies or components having different sizes and dimensions in a single processing panel or batch and reduces die drift, movement or skew during encapsulation and post-encapsulation cure.

摘要翻译： 封装半导体管芯的方法包括使用嵌入式接地层或嵌入式嵌入式单元。 嵌入式单元是具有至少一个空腔的单个独立单元。 嵌入式单元被放置在过程安装表面的封装区域内和之内。 嵌入式单元可以具有不同的尺寸和形状以及在处理半导体管芯期间可以放置在基板，面板或带上的预定位置中的多个不同的空腔，该半导体管芯嵌入到再分布芯片封装（RCP）或晶片级封装 WFL）面板。 嵌入式单元提供功能和设计灵活性，可以在单个处理面板或批次中运行多个嵌入式单元和半导体管芯或具有不同尺寸和尺寸的部件，并减少封装和封装后固化期间的裸片漂移，移动或偏斜。