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    SEMICONDUCTOR DEVICE WITH REDISTRIBUTED CONTACTS
    3.
    发明申请
    SEMICONDUCTOR DEVICE WITH REDISTRIBUTED CONTACTS 有权
    具有重新分配联系的半导体器件

    公开(公告)号：US20130341796A1

    公开(公告)日：2013-12-26

    申请号：US13530118

    申请日：2012-06-22

    申请人： Navas Khan Oratti Kalandar ,  Chee Seng Foong ,  Norazham Mohd Sukemi ,  Kesvakumar V.C. Muniandy

    发明人： Navas Khan Oratti Kalandar ,  Chee Seng Foong ,  Norazham Mohd Sukemi ,  Kesvakumar V.C. Muniandy

    IPC分类号： H01L23/528 ,  H01L21/78

    CPC分类号： H01L23/49827 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2924/15311

    摘要： A semiconductor device has external, exposed electrical contacts at an device active face and a semiconductor die, which has internal, electrical contacts at a die active face. The exposed contacts are offset from the internal contacts laterally of the device active face. A redistribution layer includes a layer of insulating material and redistribution interconnectors within the insulating material, the interconnectors connecting with the exposed contacts. A set of conductors connect the internal contacts and the interconnectors. The conductors have oblong, tear drop shaped cross-sections extending laterally of the die active face beyond the respective internal contacts, and contact the interconnectors at positions spaced further apart than the internal contacts. The redistribution layer may be prefabricated using less costly manufacturing techniques such as lamination.

    摘要翻译： 半导体器件在器件主动面和半导体管芯处具有外部暴露的电触头，半导体管芯在管芯主动面处具有内部电接触。 暴露的触点从设备主动面侧面的内部触点偏移。 再分配层包括绝缘材料层和绝缘材料内的再分配互连器，该连接器与暴露的触点连接。 一组导体连接内部触点和互连器。 导体具有长圆形的泪滴形横截面，其横向延伸到模具主动面的外侧，超过相应的内部触点，并且在相互间隔开的位置处与互连器接触。 可以使用较便宜的制造技术（例如层压）来预制再分布层。

    METHOD OF PACKAGING SEMICONDUCTOR DIE
    5.
    发明申请
    METHOD OF PACKAGING SEMICONDUCTOR DIE 有权
    包装半导体器件的方法

    公开(公告)号：US20130113091A1

    公开(公告)日：2013-05-09

    申请号：US13292103

    申请日：2011-11-09

    申请人： Dominic Koey Poh Meng ,  Zhiwei Gong ,  Kesvakumar V.C. Muniandy ,  Weng Foong Yap

    发明人： Dominic Koey Poh Meng ,  Zhiwei Gong ,  Kesvakumar V.C. Muniandy ,  Weng Foong Yap

    IPC分类号： H01L23/28 ,  B29C33/12 ,  H01L21/56

    CPC分类号： H01L23/49816 ,  H01L21/561 ,  H01L21/568 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00

    摘要： A method of packaging a semiconductor die includes the use of an embedded ground plane or drop-in embedded unit. The embedded unit is a single, stand-alone unit with at least one cavity. The embedded unit is placed on and within an encapsulation area of a process mounting surface. The embedded unit may have different sizes and shapes and a number of different cavities that can be placed in a predetermined position on a substrate, panel or tape during processing of semiconductor dies that are embedded into redistributed chip package (RCP) or wafer level package (WFL) panels. The embedded unit provides the functionality and design flexibility to run a number of embedded units and semiconductor dies or components having different sizes and dimensions in a single processing panel or batch and reduces die drift, movement or skew during encapsulation and post-encapsulation cure.

    摘要翻译： 封装半导体管芯的方法包括使用嵌入式接地层或嵌入式嵌入式单元。 嵌入式单元是具有至少一个空腔的单个独立单元。 嵌入式单元被放置在过程安装表面的封装区域内和之内。 嵌入式单元可以具有不同的尺寸和形状以及在处理半导体管芯期间可以放置在基板，面板或带上的预定位置中的多个不同的空腔，该半导体管芯嵌入到再分布芯片封装（RCP）或晶片级封装 WFL）面板。 嵌入式单元提供功能和设计灵活性，可以在单个处理面板或批次中运行多个嵌入式单元和半导体管芯或具有不同尺寸和尺寸的部件，并减少封装和封装后固化期间的裸片漂移，移动或偏斜。