公开(公告)号：US06956386B2

公开(公告)日：2005-10-18

申请号：US10633022

申请日：2003-08-01

申请人： Dong Il Kim ,  Byung Chang Song ,  Ha Poong Jeong

发明人： Dong Il Kim ,  Byung Chang Song ,  Ha Poong Jeong

IPC分类号： G01R1/067 ,  G01R1/073 ,  G01R31/02

CPC分类号： G01R1/07342 ,  G01R1/06733

摘要： A probe card has probe sections with silicon probes formed on an insulated circuit board that are connected by an adhesive on the supporting structures. The supporting structures are supported by fixing structures with each of the fixing structures being fixed on the circuit board. The probe card has the probe section's wiring and the circuit board's wiring being electrically connected by a metallic wiring and the sub printed circuit and the pogo pin electrically connected by an anisotropic conducting film with the sub printed circuit board and the pogo pin. A metallic layer is formed by the plating of the probe in the probe section. This reduces the manufacturing costs by enabling the damaged probes during manufacturing to be discarded and the others being used continually.

摘要翻译： 探针卡具有探针部分，其中硅探针形成在绝缘电路板上，其通过粘合剂连接在支撑结构上。 支撑结构由固定结构支撑，每个固定结构固定在电路板上。 探针卡具有探针部分的布线，电路板的布线通过金属布线和副印刷电路电连接，弹簧针通过各向异性导电膜与副印刷电路板和弹簧针电连接。 通过探针在探针部中的电镀而形成金属层。 这可以通过在制造过程中使损坏的探头被丢弃而其他的被不断使用来降低制造成本。

公开(公告)号：US06414501B2

公开(公告)日：2002-07-02

申请号：US09965607

申请日：2001-09-27

申请人： Dong Il Kim ,  Young Kyum Ahn ,  Sam Won Chung ,  Byung Chang Song ,  Ha Poong Jeong

发明人： Dong Il Kim ,  Young Kyum Ahn ,  Sam Won Chung ,  Byung Chang Song ,  Ha Poong Jeong

IPC分类号： G01R3102

CPC分类号： G01R1/06744 ,  G01R1/06727 ,  G01R1/07342

摘要： The present invention is to provide a micro cantilever-type probe disposed on a probe card, having such appropriate elasticity and mechanical strength that the probe would recover its unforced shape after deformation during an inspection and maintain its original shape even after three hundred thousand uses. The present invention provides a probe card which has an electrically insulated substrate fixed on a circuit board; a plurality of elastic probes with a sharpened end fixed on the insulated substrate; and wiring formed on the probe, the insulated substrate and the circuit board. The inventive probe is manufactured by patterning a substrate using photolithography and etching a portion except a pattern-defined portion. The probe is coated by metal layer(s).

摘要翻译： 本发明提供一种设置在探针卡上的微型悬臂式探头，其具有适当的弹性和机械强度，使得探针在检查过程中变形后能够恢复其非强制形状，并且即使在三十万次使用后也保持其原始形状。 本发明提供了一种探针卡，其具有固定在电路板上的电绝缘基板; 多个具有固定在所述绝缘基板上的尖端的弹性探针; 以及形成在探针，绝缘基板和电路板上的布线。 本发明的探针通过使用光刻图案化衬底并蚀刻除了图案限定部分之外的部分来制造。 探针被金属层涂覆。

公开(公告)号：US20100207652A1

公开(公告)日：2010-08-19

申请号：US12734049

申请日：2008-10-08

申请人： In Buhm Chung ,  Byung Chang Song ,  Dong Il Kim

发明人： In Buhm Chung ,  Byung Chang Song ,  Dong Il Kim

IPC分类号： G01R31/02

CPC分类号： G01R31/2887 ,  G01R1/0491

摘要： A method of testing a wafer capable of minimizing the asymmetrical thermal deformation of a probe card when a wafer is tested using a probe card and of minimizing the number of times of tests to effectively test a large area wafer and a probe card for the same is presented. For the wafer test method for testing semiconductor chips on a wafer using a probe card, the method includes creating virtual repeating units corresponding to N semiconductor chips, wherein the N is natural number larger than or equal to 2, arranging the plurality of repeating units on the wafer and moving the probe card or the wafer N times and testing the semiconductor chips on a wafer, wherein the semiconductor chips in the repeating units are sequentially tested one by one per each touchdown. Also, the probe cards to realize above mentioned method have been described.

摘要翻译： 当使用探针卡测试晶片并且最小化有效测试大面积晶片和探针卡的测试次数的最小化时，测试能够最小化探针卡的不对称热变形的晶片的方法是 呈现。 对于使用探针卡对晶片上的半导体芯片进行测试的晶片测试方法，该方法包括产生对应于N个半导体芯片的虚拟重复单元，其中N是大于或等于2的自然数，将多个重复单元设置在 晶片并移动探针卡或晶片N次并测试晶片上的半导体芯片，其中重复单元中的半导体芯片每次触地一个接一个地依次测试。 另外，已经描述了用于实现上述方法的探针卡。

公开(公告)号：US20120081140A1

公开(公告)日：2012-04-05

申请号：US13322416

申请日：2010-04-22

申请人： Yun Hee Shim ,  Sung Hee Yoon ,  Seung Ho Yoo ,  Byung Chang Song ,  In Buhm Chung ,  Dong Il Kim

发明人： Yun Hee Shim ,  Sung Hee Yoon ,  Seung Ho Yoo ,  Byung Chang Song ,  In Buhm Chung ,  Dong Il Kim

IPC分类号： G01R1/067

CPC分类号： G01R31/2889 ,  G01R1/06727 ,  G01R1/07342

摘要： Provided is a probe card which has a space transformer which may be effectively changed to correspond to a change in wafer chip structure and is capable of maximizing acceptable channels of the space transformer. The probe card for testing a semiconductor chip on a wafer includes: a space transformer body in which a plurality of unit probe modules are arranged at intervals; a main circuit board to which an electrical signal is applied from an external test device; a reinforcement plate for supporting the main circuit board such that the unit probe modules become stable against an external effect; a standing conductive medium which is inserted into a penetration portion provided in the space transformer body; a lower surface circuit board in which the standing conductive medium is electrically connected to the unit probe module as a flexible conductive medium and the standing conductive media are mounted; and a mutual connection member for electrically connecting the lower surface circuit board to the main circuit board.

摘要翻译： 提供了一种具有可以有效地改变以对应于晶片芯片结构的变化并且能够使空间变压器的可接受的通道最大化的空间变压器的探针卡。 用于测试晶片上的半导体芯片的探针卡包括：空间变换器主体，多个单元探针模块间隔排列; 主电路板，从外部测试装置向其施加电信号; 用于支撑主电路板的加强板，使得单元探针模块抵抗外部效应变得稳定; 插入到设置在所述空间变换器主体中的贯通部的立体导电介质; 其中，所述立体导电介质与所述单元探针模块电连接为柔性导电介质并且所述直立导电介质安装在其中; 以及用于将下表面电路板电连接到主电路板的相互连接构件。