公开(公告)号：US08273668B2

公开(公告)日：2012-09-25

申请号：US12805432

申请日：2010-07-30

申请人： Dong Ki Yoon ,  Shiyong Yi ,  Kyoungseon Kim ,  Seongwoon Choi ,  Seokhwan Oh ,  Sang Ouk Kim ,  Seung Hak Park

发明人： Dong Ki Yoon ,  Shiyong Yi ,  Kyoungseon Kim ,  Seongwoon Choi ,  Seokhwan Oh ,  Sang Ouk Kim ,  Seung Hak Park

IPC分类号： H01L21/31 ,  H01L21/302

CPC分类号： H01L21/31144 ,  H01L21/0337 ,  H01L21/0338 ,  H01L21/32139

摘要： Methods of forming a pattern and methods of fabricating a semiconductor device having a pattern are provided, the methods include forming a self-assembly induction layer including a first region and a second region on a semiconductor substrate. A block copolymer layer is coated on the self-assembly induction layer. A first pattern, a second pattern and a third pattern are formed by phase separating the block copolymer. At least one of the first, second and third patterns may be removed to form a preliminary pattern. An etching process may be performed using the preliminary pattern as an etching mask. The first pattern contains the same material as that of the second pattern, and the third pattern contains a material different from that of the first pattern.

摘要翻译： 提供了形成图案的方法和制造具有图案的半导体器件的方法，所述方法包括在半导体衬底上形成包括第一区域和第二区域的自组装感应层。 在自组装感应层上涂布嵌段共聚物层。 通过相分离嵌段共聚物形成第一图案，第二图案和第三图案。 可以去除第一，第二和第三图案中的至少一个以形成初步图案。 可以使用初步图案作为蚀刻掩模来执行蚀刻工艺。 第一图案包含与第二图案相同的材料，第三图案包含与第一图案不同的材料。

公开(公告)号：US20110081777A1

公开(公告)日：2011-04-07

申请号：US12805432

申请日：2010-07-30

申请人： Dong Ki Yoon ,  Shiyong Yi ,  Kyoungseon Kim ,  Seongwoon Choi ,  Seokhwan Oh ,  Sang Ouk Kim ,  Seung Hak Park

发明人： Dong Ki Yoon ,  Shiyong Yi ,  Kyoungseon Kim ,  Seongwoon Choi ,  Seokhwan Oh ,  Sang Ouk Kim ,  Seung Hak Park

IPC分类号： H01L21/768 ,  H01L21/302

CPC分类号： H01L21/31144 ,  H01L21/0337 ,  H01L21/0338 ,  H01L21/32139

摘要： Methods of forming a pattern and methods of fabricating a semiconductor device having a pattern are provided, the methods include forming a self-assembly induction layer including a first region and a second region on a semiconductor substrate. A block copolymer layer is coated on the self-assembly induction layer. A first pattern, a second pattern and a third pattern are formed by phase separating the block copolymer. At least one of the first, second and third patterns may be removed to form a preliminary pattern. An etching process may be performed using the preliminary pattern as an etching mask. The first pattern contains the same material as that of the second pattern, and the third pattern contains a material different from that of the first pattern.

摘要翻译： 提供了形成图案的方法和制造具有图案的半导体器件的方法，所述方法包括在半导体衬底上形成包括第一区域和第二区域的自组装感应层。 在自组装感应层上涂布嵌段共聚物层。 通过相分离嵌段共聚物形成第一图案，第二图案和第三图案。 可以去除第一，第二和第三图案中的至少一个以形成初步图案。 可以使用初步图案作为蚀刻掩模来执行蚀刻工艺。 第一图案包含与第二图案相同的材料，第三图案包含与第一图案不同的材料。

公开(公告)号：US08314036B2

公开(公告)日：2012-11-20

申请号：US12794890

申请日：2010-06-07

申请人： Seongho Moon ,  Yool Kang ,  HyoungHee Kim ,  Seokhwan Oh ,  So-Ra Han ,  Seongwoon Choi

发明人： Seongho Moon ,  Yool Kang ,  HyoungHee Kim ,  Seokhwan Oh ,  So-Ra Han ,  Seongwoon Choi

IPC分类号： H01L21/302

CPC分类号： H01L21/32139 ,  G03F7/40 ,  H01L21/0273 ,  H01L21/0338 ,  H01L21/31144

摘要： A method of forming fine patterns of a semiconductor device is provided. The method includes forming plural preliminary first mask patterns, which are spaced apart from each other by a first distance in a direction parallel to a surface of a substrate, on the substrate; forming an acid solution layer on the substrate to cover the plural preliminary first mask patterns; forming plural first mask patterns which are spaced apart from each other by a second distance larger than the first distance, of which upper and side portions are surrounded by acid diffusion regions having first solubility; exposing the first acid diffusion regions by removing the acid solution layer; forming a second mask layer having second solubility lower than the first solubility in spaces between the acid diffusion regions; and forming plural second mask patterns located between the plural first mask patterns, respectively, by removing the acid diffusion regions by the dissolvent.

摘要翻译： 提供了形成半导体器件的精细图案的方法。 该方法包括在基板上形成在平行于基板的表面的方向上彼此间隔开第一距离的多个初步第一掩模图案; 在所述基板上形成酸溶液层以覆盖所述多个初步第一掩模图案; 形成彼此间隔开大于第一距离的第二距离的多个第一掩模图案，其中上侧部分和第二部分被具有第一溶解度的酸性扩散区域包围; 通过除去酸溶液层暴露第一酸扩散区; 在所述酸扩散区之间形成第二掩模层，所述第二掩模层的第二溶解度低于所述第一溶解度; 以及分别通过所述溶剂除去所述酸扩散区而形成位于所述多个第一掩模图案之间的多个第二掩模图案。

公开(公告)号：US20110027993A1

公开(公告)日：2011-02-03

申请号：US12794890

申请日：2010-06-07

申请人： Seongho Moon ,  Yool Kang ,  HyoungHee Kim ,  Seokhwan Oh ,  So-Ra Han ,  Seongwoon Choi

发明人： Seongho Moon ,  Yool Kang ,  HyoungHee Kim ,  Seokhwan Oh ,  So-Ra Han ,  Seongwoon Choi

IPC分类号： H01L21/308

CPC分类号： H01L21/32139 ,  G03F7/40 ,  H01L21/0273 ,  H01L21/0338 ,  H01L21/31144

摘要： A method of forming fine patterns of a semiconductor device is provided. The method includes forming plural preliminary first mask patterns, which are spaced apart from each other by a first distance in a direction parallel to a surface of a substrate, on the substrate; forming an acid solution layer on the substrate to cover the plural preliminary first mask patterns; forming plural first mask patterns which are spaced apart from each other by a second distance larger than the first distance, of which upper and side portions are surrounded by acid diffusion regions having first solubility; exposing the first acid diffusion regions by removing the acid solution layer; forming a second mask layer having second solubility lower than the first solubility in spaces between the acid diffusion regions; and forming plural second mask patterns located between the plural first mask patterns, respectively, by removing the acid diffusion regions by the dissolvent.

摘要翻译： 提供了形成半导体器件的精细图案的方法。 该方法包括在基板上形成在平行于基板的表面的方向上彼此间隔开第一距离的多个初步第一掩模图案; 在所述基板上形成酸溶液层以覆盖所述多个初步第一掩模图案; 形成彼此间隔开大于第一距离的第二距离的多个第一掩模图案，其中上侧部分和第二部分被具有第一溶解度的酸性扩散区域包围; 通过除去酸溶液层暴露第一酸扩散区; 在所述酸扩散区之间形成第二掩模层，所述第二掩模层的第二溶解度低于所述第一溶解度; 以及分别通过所述溶剂除去所述酸扩散区而形成位于所述多个第一掩模图案之间的多个第二掩模图案。

公开(公告)号：US20110025944A1

公开(公告)日：2011-02-03

申请号：US12848776

申请日：2010-08-02

申请人： Joohong Lee ,  Seokhwan Oh

发明人： Joohong Lee ,  Seokhwan Oh

IPC分类号： G02F1/1335 ,  F21V7/22

CPC分类号： G02B6/0061 ,  G02B6/0036 ,  G02B6/0051 ,  G02B6/0053 ,  G02B6/0055 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/0085 ,  G02B6/009

摘要： A backlight unit comprises a light emitting diode (LED) package including one or more LED chips, a light source PCB mounting one side of a bottom of the LED package or both sides of the bottom of the LED package, a bottom cover supporting the light source PCB under the light source PCB, and having an embossing portion which protrudes toward the LED package with a size corresponding to the bottom of the LED package which is not mounted on the light source PCB, and a heat emission material filling between the bottom of the LED package and the embossing portion.

摘要翻译： 背光单元包括包括一个或多个LED芯片的发光二极管（LED）封装，安装LED封装底部的一侧或LED封装底部两侧的光源PCB，支撑该光的底盖 源PCB，并且具有朝向LED封装突出的压花部分，其尺寸对应于未安装在光源PCB上的LED封装的底部，并且散热材料填充在光源PCB的底部之间， LED封装和压花部分。

公开(公告)号：US08687142B2

公开(公告)日：2014-04-01

申请号：US12848776

申请日：2010-08-02

申请人： Joohong Lee ,  Seokhwan Oh

发明人： Joohong Lee ,  Seokhwan Oh

IPC分类号： G02F1/1335 ,  G09F13/04 ,  F21V7/04

CPC分类号： G02B6/0061 ,  G02B6/0036 ,  G02B6/0051 ,  G02B6/0053 ,  G02B6/0055 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/0085 ,  G02B6/009

摘要： A backlight unit comprises a light emitting diode (LED) package including one or more LED chips, a light source PCB mounting one side of a bottom of the LED package or both sides of the bottom of the LED package, a bottom cover supporting the light source PCB under the light source PCB, and having an embossing portion which protrudes toward the LED package with a size corresponding to the bottom of the LED package which is not mounted on the light source PCB, and a heat emission material filling between the bottom of the LED package and the embossing portion.

摘要翻译： 背光单元包括包括一个或多个LED芯片的发光二极管（LED）封装，安装LED封装底部的一侧或LED封装底部两侧的光源PCB，支撑该光的底盖 源PCB，并且具有朝向LED封装突出的压花部分，其尺寸对应于未安装在光源PCB上的LED封装的底部，并且散热材料填充在光源PCB的底部之间， LED封装和压花部分。

公开(公告)号：US20110058319A1

公开(公告)日：2011-03-10

申请号：US12862836

申请日：2010-08-25

申请人： Youngjoong KIM ,  Wonseok Joo ,  Seokhwan Oh ,  Janghyun Song ,  Minsoo Kim

发明人： Youngjoong KIM ,  Wonseok Joo ,  Seokhwan Oh ,  Janghyun Song ,  Minsoo Kim

IPC分类号： H05K7/00

CPC分类号： H04M1/0274 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/1686

摘要： A mobile terminal includes: a terminal main body having a window formed on a front surface thereof; an interface disposed at the side of the main body and electrically connected with an external device; and a cap module configured to open and close the interface, wherein the cap module includes: a cover configured to cover the interface; and a movement mechanism configured to rotate the cover toward a front side or a rear side of the main body from the side of the main body and slidably moving a rotational center of the cover by interworking with a rotation of the cover.

摘要翻译： 移动终端包括：终端主体，其具有形成在其前表面上的窗口; 接口，设置在主体的侧面并与外部设备电连接; 以及盖模块，被配置为打开和关闭所述界面，其中所述盖模块包括：覆盖所述界面的盖; 以及移动机构，其构造成使得所述盖朝着主体的前侧或后侧从主体侧旋转，并且通过与盖的旋转相互作用而可滑动地移动盖的旋转中心。

公开(公告)号：US08456809B2

公开(公告)日：2013-06-04

申请号：US12870677

申请日：2010-08-27

申请人： Youngjoong Kim ,  Seokhwan Oh ,  Janghyun Song ,  Wonseok Joo

发明人： Youngjoong Kim ,  Seokhwan Oh ,  Janghyun Song ,  Wonseok Joo

IPC分类号： H05K5/03

CPC分类号： H04M1/0252 ,  H04M1/0264

摘要： Disclosed is a mobile terminal in which while a rear case is coupled to or separated from a terminal body, a case is slopingly moved with respect to the terminal body, so a camera hole of the rear case can be freely moved without being restricted by a camera mounting part protruded from the terminal body.

摘要翻译： 公开了一种移动终端，其中当后壳体与终端主体联接或分离时，壳体相对于终端主体倾斜地移动，因此后壳体的照相机孔可以自由地移动而不受 相机安装部分从终端主体突出。

公开(公告)号：US08380265B2

公开(公告)日：2013-02-19

申请号：US12862836

申请日：2010-08-25

申请人： Youngjoong Kim ,  Wonseok Joo ,  Seokhwan Oh ,  Janghyun Song ,  Minsoo Kim

发明人： Youngjoong Kim ,  Wonseok Joo ,  Seokhwan Oh ,  Janghyun Song ,  Minsoo Kim

IPC分类号： H04M1/00

CPC分类号： H04M1/0274 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/1686

摘要： A mobile terminal includes: a terminal main body having a window formed on a front surface thereof; an interface disposed at the side of the main body and electrically connected with an external device; and a cap module configured to open and close the interface, wherein the cap module includes: a cover configured to cover the interface; and a movement mechanism configured to rotate the cover toward a front side or a rear side of the main body from the side of the main body and slidably moving a rotational center of the cover by interworking with a rotation of the cover.

摘要翻译： 移动终端包括：终端主体，其具有形成在其前表面上的窗口; 接口，设置在主体的侧面并与外部设备电连接; 以及盖模块，被配置为打开和关闭所述界面，其中所述盖模块包括：覆盖所述界面的盖; 以及移动机构，其构造成使得所述盖朝着主体的前侧或后侧从主体侧旋转，并且通过与盖的旋转相互作用而可滑动地移动盖的旋转中心。