摘要:
A protective device (10) for protecting thermal interface material (30) spread on a central surface (512) of a bottom of a base (51) of a heat sink (50). The device includes a case (12) and a tab (18) extending from an edge of the case. The heat sink (50) has air channels (552) extending vertically therethrough and around the base. The case comprises an annular frame (120) and a cap (15) protruding downwardly from inside edges of the frame. The cap covers the thermal interface material. The frame is attached to the heat sink around the thermal interface material. The frame blocks portions of the air channels adjacent to the base, thereby to prevent dust or foreign particles from contaminating the thermal interface material through the air channels.
摘要:
A heat sink assembly includes an unit and a plurality of fasteners extending through the unit for fixing the unit to a heat-generating electronic component. Each fastener comprises a bolt and a supporting clip mounted on the bolt and located at a bottom of the heat sink. The supporting clip comprises a body and a support extending from the body. When the bolt of each fastener extends through the unit and the body of the supporting clip, a distance between the bottom of the unit and the heat-generating electronic component remains unchanged with the help of the support of the supporting clip.
摘要:
A heat sink assembly includes a first heat sink, a second heat sink, and a wire clip connecting the first and second heat sinks together. Each of the first and second heat sinks includes a base and a plurality of connecting members extending upwardly from the base. The wire clip includes a pivot portion and a pair of pressing portions extending from opposite ends of the pivot portion towards each other. The connecting members of the first and second heat sinks cooperatively clasp the pivot portion of the wire clip. The pressing members of the wire clip resiliently abut against the connecting members of the first and second heat sinks and push the connecting members of the first and second heat sink outwardly away from each other. The bases of the first and second heat sinks clamp an add-on card therebetween.
摘要:
An exemplary thermal module includes a heat absorbing member, a heat sink, a heat conducting member connecting the heat absorbing member with the heat sink, and centrifugal fan. The heat absorbing member has four fixing portions for fixing the thermal module. The heat sink includes a base and a fin assembly disposed on the base. The centrifugal fan includes a housing defining a lateral air outlet therein and an impeller rotatably received in the housing. The housing engages with the engaging portion and is detachably mounted to the heat absorbing member, with the air outlet facing the fin assembly. One of the fixing portions of heat absorbing member is shaded by the housing. The housing and the engaging portion cooperatively provide a sliding mechanism therebetween to allow the centrifugal blower to be slidable relative to the base after the lateral side of the housing detached from the heat absorbing member.
摘要:
A centrifugal fan includes a plurality of blades, a housing for receiving the blades therein and an air guiding mechanism. The housing includes a top wall and a sidewall around the top wall. The sidewall defines a first air outlet and a second air outlet adjacent and perpendicular to the first air outlet. The air guiding mechanism is located between the first air outlet and the second air outlet. The air guiding mechanism includes an air guiding wall parallel to the second air outlet and an air partition wall extending inwardly from the air guiding wall towards the blades. The first air outlet is defined between the air partition wall and the sidewall. The second air outlet is defined between the air guiding wall and the sidewall of the housing.
摘要:
A heat dissipation device for dissipating heat from an electronic component. The heat dissipation device includes a shroud having a bottom wall and a sidewall partially surrounding the bottom wall, a base mounted on a bottom of the bottom wall, a bracket fixed on a top of the bottom wall, an impeller rotatably mounted on the bracket, a fin assembly arranged on the bottom wall, a plurality of heat pipes connecting the fin assembly with the base, and a cover secured on the sidewall. An end of the bottom wall extends beyond the sidewall to support the fin assembly thereon. An opening and a window are respectively defined in the bottom wall and the cover. A plate is formed within the opening of the bottom wall and connects the bracket with the base.
摘要:
An electronic assembly includes a printed circuit board mounted with an electronic component, a heat sink, and a clip securing the heat sink on the printed circuit board to enable the heat sink to have an intimate contact with the electronic component. The printed circuit board forms two engaging portions each defining a receiving hole therein. The heat sink includes a base and a plurality of fins. The clip includes a pressing member pressing the heat sink to the electronic component, two V-shaped operating members extending slantwise from ends of the pressing member, and two clasps extending outwardly from ends of the operating members. Height of each of the clasps is larger than that of each of the receiving holes of the engaging portions. The clasps of the clip lock with the engaging portions by manipulating the operating members.
摘要:
A heat sink comprises a plurality of individual plates. Each of the plates comprises a heat-dissipating portion and a binding portion connecting with the heat-dissipating portion. The binding portions are stacked together on each other to form a heat-absorbing portion. At least some of the heat-dissipating portions are bent at angles relative to the respective binding portions. At least a hoop encloses the heat-absorbing portion. A method of manufacturing the heat sink is also disclosed.