摘要:
This invention relates to a curable silicone composition comprising: (A) a straight-chain organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by the following average unit formula: (R1SiO3/2)a(R12SiO2/2)b(R13SiO1/2)c(SiO4/2)d(XO1/2)e wherein, R1 each independently represent an alkyl group having from 1 to 12 carbons, an alkenyl group having from 2 to 12 carbons, an aryl group having from 6 to 20 carbons, an aralkyl group having from 7 to 20 carbons, or a group in which some or all of the hydrogen atoms of these groups are substituted with halogen atoms, with the proviso that at least two R1 in a molecule are the alkenyl groups, X is a hydrogen atom or an alkyl group, a is a number from 0 to 0.3, b is 0 or a positive number, c is a positive number, d is a positive number, e is a number from 0 to 0.4, a+b+c+d=1, c/d is a number from 0 to 10, and b/d is a number from 0 to 0.5; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a cerium-containing organopolysiloxane; and (E) a hydrosilylation reaction catalyst. The curable silicone composition does not develop cracks due to thermal aging and can form a cured product having little yellow discoloration.
摘要:
This invention relates to a curable silicone composition comprising: (A) a straight-chain organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by the following average unit formula: (R1SiO3/2)a (R12SiO2/2)b(R13SiO1/2)c(SiO4/2)d(XO1/2)e wherein, R1 each independently represent an alkyl group having from 1 to 12 carbons, an alkenyl group having from 2 to 12 carbons, an aryl group having from 6 to 20 carbons, an aralkyl group having from 7 to 20 carbons, or a group in which some or all of the hydrogen atoms of these groups are substituted with halogen atoms, with the proviso that at least two R1 in a molecule are the alkenyl groups, X is a hydrogen atom or an alkyl group, a is a number from 0 to 0.3, b is 0 or a positive number, c is a positive number, d is a positive number, e is a number from 0 to 0.4, a+b+c+d=1, c/d is a number from 0 to 10, and b/d is a number from 0 to 0.5; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a cerium-containing organopolysiloxane; and (E) a hydrosilylation reaction catalyst. The curable silicone composition does not develop cracks due to thermal aging and can form a cured product having little yellow discoloration.
摘要:
Described are hydrosilylation-curable polyorganosiloxane compositions containing sulfur, including hydrosilylation-curable polyorganosiloxane prepolymers and hydrosilylation-cured polyorganosiloxane polymer products made therefrom, as well as methods of preparing and using the same, devices comprising or prepared from the same, and sulfur-functional organosiloxanes useful therein.
摘要:
An additive for a silicone encapsulant has the structure: (I) R1Ce(OSi—R2) I I a R3 wherein a is 3 or 4, wherein R1 and R2 are each —O—Si(R4)(R5)(R6) and each of R4, R5, and R6 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups, and wherein R3 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups. More specifically, the cerium is cerium (III) or (IV). The additive is formed using a method that includes the step of reacting cerium metal or a cerium (III) or (IV) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an optoelectronic component and the encapsulant disposed on the optoelectronic component. The device is formed using a method that includes the step of disposing the encapsulant on the optoelectronic device.