Abstract:
A method for forming a thermally conductive thermal radical cure silicone composition comprising (I) a clustered functional polyorganopolysiloxane; optionally (II) a silicone reactive diluent, (III) a filler comprising a thermally conductive filler, (III′) a filler treating agent, and (IV) a radical initiator is provided. In this method, the clustered functional polyorganosiloxane (I) and the optional silicone reactive diluent (II) are premade prior to their addition to respective components (III), (III′) and (IV).
Abstract:
A hydrosilylation process is used to prepare a clustered functional polyorganosiloxane. The clustered functional polyorganosiloxane comprises a reaction product of a reaction of a) a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and c) a reactive species having, per molecule at least 1 aliphatically unsaturated organic group and 1 or more radical curable groups selected from an acrylate group and a methacrylate group; in the presence of d) a hydrosilylation catalyst, and e) an isomer reducing agent. The weight percent of silicon bonded hydrogen atoms in component b) divided by the weight percent of aliphatically unsaturated organic groups in component a) (the SiHb/Via ratio) ranges from 4/1 to 20/1. The resulting clustered functional polyorganosiloxane is useful in a curable silicone composition for electronics applications.
Abstract:
A curable silicone composition is provided that comprises a reaction product of a reaction of (I) a clustered functional polyorganopolysiloxane having at least one radical curable group selected from an acrylate group and a methacrylate group; (II) a silicone reactive diluent, and a (III) a radical initiator.
Abstract:
A hydrosilylation process is used to prepare a clustered functional polyorganosiloxane. The clustered functional polyorganosiloxane comprises a reaction product of a reaction of a) a polyorganosiloxane having an average, per molecule, of at least 2 ahphatically unsaturated organic groups; b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and c) a reactive species having, per molecule at least 1 aliphatically unsaturated organic group and 1 or more radical curable groups selected from an acrylate group and a methacrylate group; in the presence of d) a hydrosilylation catalyst, and e) an isomer reducing agent. The weight percent of silicon bonded hydrogen atoms in component b) divided by the weight percent of aliphatically unsaturated organic groups in component a) (the SiHb/Via ratio) ranges from 4/1 to 20/1. The resulting clustered functional polyorganosiloxane is useful in a curable silicone composition for electronics applications.
Abstract:
A curable silicone composition is provided that comprises a reaction product of a reaction of (I) a clustered functional polyorganopolysiloxane having at least one radical curable group selected from an acrylate group and a methacrylate group; (II) a silicone reactive diluent, and a (III) a radical initiator.
Abstract:
An in situ method for forming a thermally conductive thermal radical cure silicone composition is provided. The in situ method comprises forming a thermally conductive clustered functional polymer comprising the reaction product of a reaction of a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and a reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and 1 or more curable groups; in the presence of a filler treating agent, a filler comprising a thermally conductive filler, an isomer reducing agent, and a hydrosilylation catalyst. The method further comprises blending the thermally conductive clustered functional polymer with a radical initiator.
Abstract:
An in situ method for forming a thermally conductive thermal radical cure silicone composition is provided. The in situ method comprises forming a thermally conductive clustered functional polymer comprising the reaction product of a reaction of a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and a reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and 1 or more curable groups; in the presence of a filler treating agent, a filler comprising a thermally conductive filler, an isomer reducing agent, and a hydrosilylation catalyst. The method further comprises blending the thermally conductive clustered functional polymer with a radical initiator.