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公开(公告)号:US20250051528A1
公开(公告)日:2025-02-13
申请号:US18719488
申请日:2021-12-17
Applicant: Dow Global Technologies LLC
Inventor: Yunfeng Yang , Yabin Sun , Colin Li Pi Shan , Gaoxiang Wu , Wenxin Zhang
Abstract: A process to form a crosslinked composition, the process comprising thermally treating a composition that comprises the following components: a) at least one olefin/silane interpolymer comprising at least one Si—H group, b) at least one peroxide, and c) at least one crosslinking coagent, wherein the composition has a mole ratio of active oxygen atom to carbon-carbon double bond of ≥0.02 and ≤0.7, based on the active oxygen atom content of component b and the carbon-carbon double bond content of component c. A composition that comprises the following components: a) at least one olefin/silane interpolymer comprising at least one Si—H group, b) at least one peroxide, and c) at least one crosslinking coagent, wherein the composition has a mole ratio of active oxygen atom to carbon-carbon double bond of ≥0.02 and ≤0.7, based on the active oxygen atom content of component b and the carbon-carbon double bond content of component c.
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公开(公告)号:US20250051527A1
公开(公告)日:2025-02-13
申请号:US18719393
申请日:2021-12-17
Applicant: Dow Global Technologies LLC
Inventor: Bo Lyu , Xiaochun Liu , Yabin Sun , Wenxin Zhang , Colin Li Pi Shan , Gaoxiang Wu
Abstract: A process to form a crosslinked, foamed composition, and related processes and compositions, the process comprising thermally treating a first composition that comprises the following components: a) at least one olefin/silane interpolymer comprising at least one Si—H group, b) at least one peroxide, and c) at least one blowing agent.
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公开(公告)号:US20240213386A1
公开(公告)日:2024-06-27
申请号:US18254591
申请日:2020-12-17
Applicant: Dow Global Technologies LLC
Inventor: Wenxin Zhang , Yabin Sun , Yunfeng Yang , Yuyan Li
IPC: H01L31/048 , H01L31/18
CPC classification number: H01L31/0481 , H01L31/186
Abstract: An encapsulant sheet includes a material formed from an ethylene/C4-C8α-olefin copolymer having a resin volume resistivity (VR) from greater than 1×1014Ω cm at 60° C. to less than 1×1016Ω cm at 60° C. and from 0.01 wt % to 0.2 wt % of an ion scavenger. The encapsulant sheet has a transmittance greater than 91%. A photovoltaic module (10) includes a front encapsulant sheet (12a) and a rear encapsulant sheet (12b) composed of the material. The photovoltaic module (10) has a power loss after potential induced degradation (PID) test from 0.05% to less than 5%.
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公开(公告)号:US20240067845A1
公开(公告)日:2024-02-29
申请号:US18275154
申请日:2021-02-02
Applicant: Dow Global Technologies LLC , Rohm and Haas Company
Inventor: Chenyan Bai , Yin Xue , Xinhong Wang , Wenxin Zhang
IPC: C09D175/06 , B32B15/082 , B32B15/20 , B32B27/30 , B32B37/24
CPC classification number: C09D175/06 , B32B15/082 , B32B15/20 , B32B27/304 , B32B37/24 , B32B2037/243 , B32B2250/02 , B32B2255/06 , B32B2255/26 , B32B2307/308 , B32B2307/31 , B32B2311/24 , B32B2327/06 , B32B2439/80
Abstract: A waterborne coating composition, comprising (a) a first polyurethane dispersion comprising a first polyurethane having a Tg of 5° C. to 20° C., (b) a second polyurethane dispersion comprising a second polyurethane having a Tg of −40° C. to −60° C., and (c) a polyacrylic emulsion comprising an acrylic (co) polymer having a Tg of −40° C. to −20° C., is provided. A method for preparing a laminated material with the waterborne coating composition, and a laminated material prepared therefrom are also provided.
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公开(公告)号:US20240240068A1
公开(公告)日:2024-07-18
申请号:US17296238
申请日:2018-11-22
Applicant: Dow Global Technologies LLC , ROHM AND HAAS COMPANY
Inventor: Rui Shi , Wenxin Zhang , Zhaohui Qu
IPC: C09J175/06 , B32B7/12 , B32B15/085 , B32B15/088 , B32B15/20 , B32B27/32 , B32B27/34 , B32B37/12 , C08G18/38 , C08G18/42 , C08G18/76 , C09J5/00 , H01M10/0525 , H01M50/105 , H01M50/119 , H01M50/129
CPC classification number: C09J175/06 , B32B7/12 , B32B15/085 , B32B15/088 , B32B15/20 , B32B27/32 , B32B27/34 , B32B37/12 , C08G18/3885 , C08G18/42 , C08G18/7621 , C09J5/00 , H01M10/0525 , H01M50/105 , H01M50/119 , H01M50/129 , B32B2037/1253 , B32B2250/03 , B32B2255/10 , B32B2255/26 , B32B2307/748 , B32B2439/00 , C09J2475/00
Abstract: A polyurethane adhesive composition, such as a two-component polyurethane adhesive, including (A) at least one isocyanate group-containing component including at least one isocyanate group-containing compound; and (B) at least one polyol component including: (Bi) at least one polyester polyol compound; and (Bii) at least one phosphate ester polyol compound; and a process for making the above composition.
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公开(公告)号:US20250145795A1
公开(公告)日:2025-05-08
申请号:US18719400
申请日:2021-12-17
Applicant: Dow Global Technologies LLC
Inventor: Yabin Sun , Gaoxiang Wu , Colin Li Pi Shan , Wenxin Zhang
IPC: C08K5/134 , C08K5/1545 , C08K5/3492 , C08K5/52 , C08L23/08
Abstract: A process to form a composition, and related composition, the process comprising mixing at least the following components: a) at least one olefin/silane interpolymer comprising at least one Si—H group, and b) at least one hindered phenol selected from Formula H, as described herein.
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公开(公告)号:US20250136798A1
公开(公告)日:2025-05-01
申请号:US18719668
申请日:2021-12-17
Applicant: Dow Global Technologies LLC
Inventor: Andong Liu , Yabin Sun , Wenxin Zhang , Colin Li Pi Shan , Gaoxiang Wu
Abstract: A process to form a composition, and related composition, the process comprising thermally treating at least the following components: a) an olefin/silane interpolymer comprising at least one Si—H group, and b) a propylene-based polymer, or a propylene-based composition that comprises a propylene-based polymer. A process to form a composition, the process comprising thermally treating at least the following component(s): a) an olefin/silane interpolymer comprising at least one Si—H group, and wherein the olefin/silane interpolymer is formed in the presence of a bis-biphenyloxy metal complex; and wherein the composition does not comprise a peroxide.
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公开(公告)号:US20250125075A1
公开(公告)日:2025-04-17
申请号:US18704326
申请日:2021-12-17
Applicant: Dow Global Technologies LLC , Dow Silicones Corporation
Inventor: Yabin Sun , Gaoxiang Wu , Colin LiPiShan , Timothy J. Person , Wenxin Zhang , Kainan Zhang , Jie Ji
Abstract: The present disclosure provides a process. In an embodiment, the process includes providing an initial cable core. The initial cable core includes (i) a conductor and (ii) an initial insulation layer. The initial insulation layer includes a crosslinkable polymeric composition composed of (a) an ethylene-based polymer composed of (1) ethylene monomer, (2) an optional α-olefin comonomer, and (3) an optional organosiloxane comonomer. The crosslinkable polymeric composition further includes (b) dicumyl peroxide (DCP), (c) an Si—H containing (AP) scavenger, (d) optional curing coagent, and (e) optional anti-oxidant. The process includes subjecting the initial cable core to a crosslinking procedure sufficient to crosslink the crosslinkable polymeric composition and form a cable core with a crosslinked insulation layer.
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