公开(公告)号：US10978315B2

公开(公告)日：2021-04-13

申请号：US15313990

申请日：2015-05-28

Applicant: EBARA CORPORATION

Inventor： Atsushi Shiokawa ,  Tetsuro Sugiura ,  Shinichi Sekiguchi ,  Takashi Kyotani ,  Tetsuo Komai ,  Norio Kimura ,  Keiichi Ishikawa ,  Toru Osuga

IPC: C23C16/44 ,  H01L21/67 ,  F04B37/16 ,  H01L21/205 ,  H01L21/3065 ,  H01L21/31 ,  C23C16/52 ,  F04B37/14 ,  H01J37/32 ,  F04B41/00 ,  C23C14/22 ,  G05D16/20

Abstract: The present invention relates to a vacuum evacuation system used to evacuate a processing gas from one or more process chambers for use in, for example, a semiconductor-device manufacturing apparatus. The vacuum evacuation system is a vacuum apparatus for evacuating a gas from a plurality of process chambers (1). The vacuum evacuation system includes a plurality of first vacuum pumps (5) coupled to the plurality of process chambers (1) respectively, a collecting pipe (7) coupled to the plurality of first vacuum pumps (5), and a second vacuum pump (8) coupled to the collecting pipe (7).