公开(公告)号：US20240082885A1

公开(公告)日：2024-03-14

申请号：US18511727

申请日：2023-11-16

Applicant: EBARA CORPORATION

Inventor： Fumitoshi Oikawa ,  Koichi Fukaya ,  Erina Baba ,  Shuichi Suemasa ,  Hisajiro Nakano

IPC: B08B3/02 ,  B08B1/04

CPC classification number: B08B3/024 ,  B08B1/04 ,  B08B2203/0288

Abstract: A substrate cleaning device includes a rotation mechanism that rotates the substrate, a first cleaning solution supply nozzle that discharges a cleaning solution to which ultrasonic vibration is applied to the surface of the substrate, and a swing mechanism that swings the first cleaning solution supply nozzle from a vicinity of a rotation center of the substrate toward an outer peripheral edge of the substrate in a range narrower than a half-surface of the substrate.

公开(公告)号：US20220013352A1

公开(公告)日：2022-01-13

申请号：US17294212

申请日：2019-10-31

Applicant: EBARA CORPORATION

Inventor： Toshio Mizuno ,  Yosuke Himori ,  Erina Baba ,  Tomoatsu Ishibashi ,  Itsuki Kobata

IPC: H01L21/02 ,  H01L21/304 ,  H01L21/677 ,  H01L21/687

Abstract: To perform both buff cleaning of a substrate surface and cleaning of an edge part of the substrate, a cleaning module includes: a rotary table configured to support a circular substrate and have a diameter smaller than a diameter of the substrate; a buff cleaning portion configured to buff clean a front side of the substrate while contacting the front side of the substrate supported by the rotary table; a buff cleaning portion movement mechanism configured to move the buff cleaning portion with respect to the substrate; a buff cleaning portion control mechanism configured to control an operation of the buff cleaning portion movement mechanism; and an edge cleaning portion configured to clean an edge part of the substrate while contacting the edge part of the substrate supported by the rotary table.

公开(公告)号：US12033847B2

公开(公告)日：2024-07-09

申请号：US17294212

申请日：2019-10-31

Applicant: EBARA CORPORATION

Inventor： Toshio Mizuno ,  Yosuke Himori ,  Erina Baba ,  Tomoatsu Ishibashi ,  Itsuki Kobata

IPC: B24B9/06 ,  B24B37/34 ,  B24B41/06 ,  H01L21/02 ,  H01L21/304 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/02087 ,  B24B9/065 ,  B24B37/345 ,  B24B41/06 ,  H01L21/304 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67706 ,  H01L21/68764

Abstract: To perform both buff cleaning of a substrate surface and cleaning of an edge part of the substrate, a cleaning module includes: a rotary table configured to support a circular substrate and have a diameter smaller than a diameter of the substrate; a buff cleaning portion configured to buff clean a front side of the substrate while contacting the front side of the substrate supported by the rotary table; a buff cleaning portion movement mechanism configured to move the buff cleaning portion with respect to the substrate; a buff cleaning portion control mechanism configured to control an operation of the buff cleaning portion movement mechanism; and an edge cleaning portion configured to clean an edge part of the substrate while contacting the edge part of the substrate supported by the rotary table.

公开(公告)号：US20220203411A1

公开(公告)日：2022-06-30

申请号：US17561268

申请日：2021-12-23

Applicant: EBARA CORPORATION

Inventor： Fumitoshi Oikawa ,  Koichi Fukaya ,  Erina Baba ,  Shuichi Suemasa ,  Hisajiro Nakano

IPC: B08B3/12 ,  B08B3/02 ,  B08B1/04

Abstract: A substrate cleaning device includes a rotation mechanism that rotates the substrate, a first cleaning solution supply nozzle that discharges a cleaning solution to which ultrasonic vibration is applied to the surface of the substrate, and a swing mechanism that swings the first cleaning solution supply nozzle from a vicinity of a rotation center of the substrate toward an outer peripheral edge of the substrate in a range narrower than a half-surface of the substrate.

公开(公告)号：US20220168866A1

公开(公告)日：2022-06-02

申请号：US17432284

申请日：2020-01-08

Applicant: EBARA CORPORATION

Inventor： Erina Baba ,  Itsuki Kobata

IPC: B24B37/20 ,  B24B57/02 ,  B24B53/017 ,  B01J35/00

Abstract: Provided is an apparatus and a method that allow a control of a removal amount at an atomic level and allow a selective removal from a projecting portion of a process target.
According to one embodiment, a substrate processing apparatus is provided, and the substrate processing apparatus includes: a table for holding a substrate; a nozzle for supplying a process liquid to a top of the substrate held onto the table; a head for holding a photocatalyst; a conditioner for conditioning the photocatalyst; a first moving mechanism for moving the head in a direction perpendicular to a surface of the table; and a second moving mechanism for moving the head between the table and the conditioner.