公开(公告)号：US20210199415A1

公开(公告)日：2021-07-01

申请号：US17122301

申请日：2020-12-15

Applicant: EBARA CORPORATION

Inventor： Hiroto YAMADA ,  Taro TAKAHASHI ,  Hiroaki SHIBUE ,  Atsushi ABE ,  Shinpei TOKUNAGA

IPC: G01B7/06 ,  H01L21/67

Abstract: An eddy current sensor assembly includes an eddy current sensor and an output signal processing circuit that processes an output signal from the eddy current sensor. The output signal processing circuit includes a mixer circuit that accepts the output signal and a signal of the predetermined frequency as input, multiplies the two signals received as input, and outputs an output signal obtained by the multiplication, and a low-pass filter that accepts the output signal output by the mixer circuit as input, cuts a high-frequency signal included in the output signal received as input, and outputs at least a direct-current (DC) signal.

公开(公告)号：US20240300068A1

公开(公告)日：2024-09-12

申请号：US18589145

申请日：2024-02-27

Applicant: EBARA CORPORATION

Inventor： Hiroto YAMADA ,  Taro TAKAHASHI

IPC: B24B49/04 ,  B24B49/10 ,  B24B49/16

CPC classification number: B24B49/04 ,  B24B49/105 ,  B24B49/16

Abstract: A polishing apparatus includes a polishing table with a polishing pad for polishing a film formed on a semiconductor wafer. The polishing apparatus includes a first sensor that outputs a first signal corresponding to the film thickness of the film and a second sensor that is more sensitive than the first sensor and that outputs a second signal corresponding to the film thickness of the film. When the film thickness of the film is equal to or less than a predetermined film thickness, the film thickness detector detects the film thickness of the film according to a second signal. When the film is thicker than the predetermined film thickness, the film thickness detector detects the film thickness of the film according to the first signal and the second signal.

公开(公告)号：US20240077297A1

公开(公告)日：2024-03-07

申请号：US18504301

申请日：2023-11-08

Applicant: EBARA CORPORATION

Inventor： Hiroto YAMADA ,  Taro TAKAHASHI ,  Hiroaki SHIBUE ,  Atsushi ABE ,  Shinpei TOKUNAGA

IPC: G01B7/06 ,  H01L21/67

CPC classification number: G01B7/105 ,  H01L21/67253

Abstract: An eddy current sensor assembly includes an eddy current sensor and an output signal processing circuit that processes an output signal from the eddy current sensor. The output signal processing circuit includes a mixer circuit that accepts the output signal and a signal of the predetermined frequency as input, multiplies the two signals received as input, and outputs an output signal obtained by the multiplication, and a low-pass filter that accepts the output signal output by the mixer circuit as input, cuts a high-frequency signal included in the output signal received as input, and outputs at least a direct-current (DC) signal.