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    METHOD OF CORRECTING FILM THICKNESS MEASUREMENT VALUE, FILM THICKNESS CORRECTOR AND EDDY CURRENT SENSOR
    1.
    发明申请
    METHOD OF CORRECTING FILM THICKNESS MEASUREMENT VALUE, FILM THICKNESS CORRECTOR AND EDDY CURRENT SENSOR 有权
    校正薄膜厚度测量值的方法，薄膜厚度校正器和EDDY电流传感器

    公开(公告)号：US20150262893A1

    公开(公告)日：2015-09-17

    申请号：US14656429

    申请日：2015-03-12

    Applicant: EBARA CORPORATION

    Inventor： Akira NAKAMURA ,  Hiroaki SHIBUE ,  Yasumasa HIROO ,  Hiroshi OTA ,  Taro TAKAHASHI ,  Mitsuo TADA

    IPC: H01L21/66 ,  H01L21/67 ,  H01L21/306 ,  G01B7/06 ,  B24B37/013 ,  B24B49/10

    CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/105 ,  G01B7/105 ,  H01L22/14

    Abstract: The polishing process includes a first state where an eddy current sensor and a polishing target object do not face each other and a second state where the eddy current sensor and the polishing target object face each other. The method of correcting a film thickness measurement value includes obtaining a first measurement signal (Xout, Yout) output from the eddy current sensor in the first state (step S108), computing a correction value (ΔX, ΔY) on the basis of the obtained first measurement signal and a reference signal (Xsd, Ysd) set in advance, obtaining a second measurement signal (X, Y) output from the eddy current sensor in the second state (step S104), and correcting the obtained second measurement signal on the basis of the computed correction value while the polishing process is being performed (step S105).

    Abstract translation: 抛光处理包括涡流传感器和抛光对象物不彼此相对的第一状态以及涡流传感器和抛光对象物体彼此面对的第二状态。 修正膜厚测量值的方法包括获得在第一状态下从涡流传感器输出的第一测量信号（Xout，Yout）（步骤S108），计算校正值（＆Dgr; X，＆Dgr; Y） 获取第一测量信号的基础和预先设置的参考信号（Xsd，Ysd），获得在第二状态下从涡流传感器输出的第二测量信号（X，Y）（步骤S104），并且校正所获得的第二测量信号 在进行抛光处理时，基于计算出的校正值的测量信号（步骤S105）。

    OUTPUT SIGNAL PROCESSING APPARATUS FOR EDDY CURRENT SENSOR
    5.
    发明申请
    OUTPUT SIGNAL PROCESSING APPARATUS FOR EDDY CURRENT SENSOR 有权

    公开(公告)号：US20220063056A1

    公开(公告)日：2022-03-03

    申请号：US17410099

    申请日：2021-08-24

    Applicant: EBARA CORPORATION

    Inventor： Atsushi ABE ,  Taro TAKAHASHI ,  Hiroaki SHIBUE ,  Shinpei TOKUNAGA ,  Katsuhide WATANABE

    IPC: B24B49/10 ,  G01B7/06

    Abstract: An eddy current sensor has an exciting coil and a detection coil. A holding circuit holds reference data indicating a characteristic of an output signal output from the detection coil at a reference state and outputs the reference data at a state other than the reference state. A pseudo signal generating circuit generates and outputs a balance coil pseudo signal corresponding to the output signal output from the detection coil at the reference state from the reference data output from the holding circuit. A bridge circuit, at the state other than the reference state, receives the output signal output from the detection coil and the balance coil pseudo signal and outputs a bridge output signal corresponding to a difference between the output signal and the balance coil pseudo signal as a bridge output signal.

    POLISHING APPARATUS
    6.
    发明申请
    POLISHING APPARATUS 审中-公开

    公开(公告)号：US20170259394A1

    公开(公告)日：2017-09-14

    申请号：US15438505

    申请日：2017-02-21

    Applicant: EBARA CORPORATION

    Inventor： Taro TAKAHASHI ,  Akira NAKAMURA ,  Hiroaki SHIBUE ,  Mitsuo TADA

    IPC: B24B37/013 ,  H01L21/304 ,  H01L21/67 ,  B24B37/20 ,  B24B37/30

    CPC classification number: B24B37/013 ,  B24B37/20 ,  B24B37/30 ,  H01L21/304 ,  H01L21/67092 ,  H01L22/14 ,  H01L22/26

    Abstract: An end-point detection sensor 50 detects an end point of polishing, the end-point detection sensor 50 being arranged in a polishing table 100. The end-point detection sensor 50 has a pot core. The pot core 60 has a bottom portion 61a, a magnetic core base portion 61b and a peripheral wall base portion 61c. The end-point detection sensor 50 has an exciting coil 62, and a detection coil 63. The back surface 101b of the polishing pad 101 has a space 30 which is arranged at a portion facing the polishing table 100 and houses a magnetic core extension portion 8 and a peripheral wall extension portion 11. The magnetic core extension portion 8 and the peripheral wall extension portion 11 extending to the space 30 are located in the space 30.

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