公开(公告)号：US20230381916A1

公开(公告)日：2023-11-30

申请号：US18323658

申请日：2023-05-25

申请人： EBARA CORPORATION

发明人： Kuniaki YAMAGUCHI ,  Dai YOSHINARI ,  Kentaro ASANO

IPC分类号： B24B37/30 ,  B24B37/005

CPC分类号： B24B37/30 ,  B24B37/005

摘要： One object is to suppress a substrate from being dried in the course of releasing the substrate from a substrate holding member in an apparatus for polishing. There is provided the apparatus for polishing, comprising: a polishing table configured to support a polishing pad; a substrate holding member having a substrate holding surface and a pressure chamber, which are made of an elastic membrane, wherein the pressure chamber has a plurality of areas arranged concentrically and a substrate is pressed against the polishing pad by a pressure in the pressure chamber; a pressure regulator configured to regulate a pressure of a gas that is supplied to the pressure chamber of the substrate holding member; one or a plurality of release nozzles configured to inject a pressurized fluid; and a control device configured to perform a substrate release process of releasing the substrate from the elastic membrane, the substrate release process controlling the pressure regulator to pressurize entirety of the elastic membrane by pressurizing all the areas in the pressure chamber and subsequently pressurize a center portion of the elastic membrane by pressurizing the pressure chamber such as to make a pressure in one or multiple areas on a center side, which include an area at a center of the pressure chamber, higher than pressures in other areas, wherein meanwhile the substrate release process controls the one or plurality of release nozzles to inject the pressurized fluid to a contact location between the elastic membrane and the substrate.

公开(公告)号：US20230226662A1

公开(公告)日：2023-07-20

申请号：US18094573

申请日：2023-01-09

申请人： EBARA CORPORATION

发明人： Kuniaki YAMAGUCHI ,  Kentaro ASANO ,  Dai YOSHINARI

IPC分类号： B24B41/00 ,  H01L21/687

CPC分类号： B24B41/005 ,  H01L21/6875

摘要： A pusher that holds a substrate includes: a pusher body, and a plurality of seating members that is attached to the pusher body and on which a substrate is seated. Each of the plurality of seating members includes: a pedestal member including a seating portion on which the substrate is seated and a magnet disposed at a position different from the seating portion, and supported by the pusher body such that the position of the magnet is moved according to seating or leaving of the substrate; a seating sensor configured to detect movement of the magnet; and a magnetic member disposed to shield a portion between a movable region of the magnet and the seating sensor.

公开(公告)号：US20210394332A1

公开(公告)日：2021-12-23

申请号：US17041734

申请日：2020-03-04

申请人： EBARA CORPORATION

发明人： Kuniaki YAMAGUCHI ,  Hiroshi SHIMOMOTO ,  Soichi ISOBE ,  Koji MAEDA ,  Kenji SHINKAI ,  Hidetatsu ISOKAWA ,  Dai YOSHINARI ,  Masayuki TAMURA ,  Haiyang XU ,  Shun EHARA ,  Kentaro ASANO

IPC分类号： B24B37/015 ,  B24B57/02 ,  B24B53/00

摘要： A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.