公开(公告)号：US20180001440A1

公开(公告)日：2018-01-04

申请号：US15615375

申请日：2017-06-06

申请人： Ebara Corporation

发明人： Hiroshi AONO ,  Kuniaki YAMAGUCHI ,  Hiroshi SHIMOMOTO ,  Koji MAEDA ,  Tetsuya YASHIMA ,  Kenji SHINKAI ,  Koichi HASHIMOTO ,  Mitsuhiko INABA ,  Hidetatsu ISOKAWA ,  Hidetaka NAKAO ,  Soichi ISOBE

IPC分类号： B24B37/34 ,  H01L21/67 ,  B24B37/10 ,  B08B3/12 ,  B08B1/04 ,  H01L21/687 ,  B08B1/00

摘要： A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.

公开(公告)号：US20140116466A1

公开(公告)日：2014-05-01

申请号：US14061686

申请日：2013-10-23

申请人： Ebara Corporation

发明人： Koji Maeda ,  Soichi ISOBE ,  Hiroshi SHIMOMOTO ,  Hideaki TANAKA

IPC分类号： H01L21/02 ,  H01L21/66

CPC分类号： H01L21/02057 ,  H01L21/67046

摘要： A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate with an elongated cylindrical roll cleaning member. The substrate cleaning apparatus includes a roll holder for supporting the cleaning member and rotate the roll cleaning member, a vertical movement mechanism for vertically moving the roll holder so that the roll cleaning member applies a roll load to the substrate at the time of cleaning the substrate by actuation of an actuator having a regulating device, a load cell for measuring the roll load, and a controller for performing feedback control of the roll load through the regulating device based on the measured value of the load cell. The substrate cleaning apparatus further includes a monitor unit for monitoring whether an operation amount of the regulating device falls outside an allowable range of a preset reference value of an operation amount corresponding to a preset roll load.

摘要翻译： 基板清洁装置用细长的圆筒形辊清洁构件进行基板表面的擦洗清洁。 基板清洗装置包括用于支撑清洁部件并旋转辊清洁部件的辊保持器，用于使辊保持器垂直移动的垂直移动机构，使得辊清洁部件在清洁基板时向基板施加辊荷载 通过具有调节装置的致动器的致动器，用于测量辊荷载的测力传感器，以及控制器，用于根据称重传感器的测量值对通过调节装置的辊载荷进行反馈控制。 基板清洗装置还包括监视单元，用于监视调节装置的操作量是否超出对应于预设滚动载荷的操作量的预设基准值的允许范围。

公开(公告)号：US20170271178A1

公开(公告)日：2017-09-21

申请号：US15616582

申请日：2017-06-07

申请人： EBARA CORPORATION

发明人： Koji MAEDA ,  Soichi ISOBE ,  Hiroshi SHIMOMOTO ,  Hideaki TANAKA

IPC分类号： H01L21/67 ,  H01L21/02

CPC分类号： H01L21/02057 ,  H01L21/67046

摘要： A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate with an elongated cylindrical roll cleaning member. The substrate cleaning apparatus includes a roll holder for supporting the cleaning member and rotate the roll cleaning member, a vertical movement mechanism for vertically moving the roll holder so that the roll cleaning member applies a roll load to the substrate at the time of cleaning the substrate by actuation of an actuator having a regulating device, a load cell for measuring the roll load, and a controller for performing feedback control of the roll load through the regulating device based on the measured value of the load cell. The substrate cleaning apparatus further includes a monitor unit for monitoring whether an operation amount of the regulating device falls outside an allowable range of a preset reference value of an operation amount corresponding to a preset roll load.

公开(公告)号：US20200176281A1

公开(公告)日：2020-06-04

申请号：US16780049

申请日：2020-02-03

申请人： EBARA CORPORATION

发明人： Koji MAEDA ,  Hiroshi SHIMOMOTO ,  Hisajiro NAKANO ,  Masayoshi IMAI ,  Yoichi SHIOKAWA

IPC分类号： H01L21/67 ,  B24B37/04 ,  B24B37/34

摘要： Various methods of cleaning a substrate are provided. In one aspect, method of cleaning a substrate, comprising: holding and rotating a substrate by a substrate holder; and supplying a chemical liquid to a chemical liquid nozzle and supplying two fluids to a two-fluid nozzle while moving the chemical-liquid nozzle and the two-fluid nozzle radially outwardly from the center to the periphery of the substrate, wherein the distance of the chemical-liquid nozzle from a rotating axis of the substrate holder is longer than the distance of the two-fluid nozzle from the rotating axis of the substrate holder while the chemical-liquid nozzle and the two-fluid nozzle are moved radially outwardly from the rotating axis of the substrate holder.

公开(公告)号：US20210394332A1

公开(公告)日：2021-12-23

申请号：US17041734

申请日：2020-03-04

申请人： EBARA CORPORATION

发明人： Kuniaki YAMAGUCHI ,  Hiroshi SHIMOMOTO ,  Soichi ISOBE ,  Koji MAEDA ,  Kenji SHINKAI ,  Hidetatsu ISOKAWA ,  Dai YOSHINARI ,  Masayuki TAMURA ,  Haiyang XU ,  Shun EHARA ,  Kentaro ASANO

IPC分类号： B24B37/015 ,  B24B57/02 ,  B24B53/00

摘要： A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.