公开(公告)号：US20230226662A1

公开(公告)日：2023-07-20

申请号：US18094573

申请日：2023-01-09

申请人： EBARA CORPORATION

发明人： Kuniaki YAMAGUCHI ,  Kentaro ASANO ,  Dai YOSHINARI

IPC分类号： B24B41/00 ,  H01L21/687

CPC分类号： B24B41/005 ,  H01L21/6875

摘要： A pusher that holds a substrate includes: a pusher body, and a plurality of seating members that is attached to the pusher body and on which a substrate is seated. Each of the plurality of seating members includes: a pedestal member including a seating portion on which the substrate is seated and a magnet disposed at a position different from the seating portion, and supported by the pusher body such that the position of the magnet is moved according to seating or leaving of the substrate; a seating sensor configured to detect movement of the magnet; and a magnetic member disposed to shield a portion between a movable region of the magnet and the seating sensor.

公开(公告)号：US20230381916A1

公开(公告)日：2023-11-30

申请号：US18323658

申请日：2023-05-25

申请人： EBARA CORPORATION

发明人： Kuniaki YAMAGUCHI ,  Dai YOSHINARI ,  Kentaro ASANO

IPC分类号： B24B37/30 ,  B24B37/005

CPC分类号： B24B37/30 ,  B24B37/005

摘要： One object is to suppress a substrate from being dried in the course of releasing the substrate from a substrate holding member in an apparatus for polishing. There is provided the apparatus for polishing, comprising: a polishing table configured to support a polishing pad; a substrate holding member having a substrate holding surface and a pressure chamber, which are made of an elastic membrane, wherein the pressure chamber has a plurality of areas arranged concentrically and a substrate is pressed against the polishing pad by a pressure in the pressure chamber; a pressure regulator configured to regulate a pressure of a gas that is supplied to the pressure chamber of the substrate holding member; one or a plurality of release nozzles configured to inject a pressurized fluid; and a control device configured to perform a substrate release process of releasing the substrate from the elastic membrane, the substrate release process controlling the pressure regulator to pressurize entirety of the elastic membrane by pressurizing all the areas in the pressure chamber and subsequently pressurize a center portion of the elastic membrane by pressurizing the pressure chamber such as to make a pressure in one or multiple areas on a center side, which include an area at a center of the pressure chamber, higher than pressures in other areas, wherein meanwhile the substrate release process controls the one or plurality of release nozzles to inject the pressurized fluid to a contact location between the elastic membrane and the substrate.

公开(公告)号：US20230352326A1

公开(公告)日：2023-11-02

申请号：US18349666

申请日：2023-07-10

申请人： EBARA CORPORATION

发明人： Kuniaki YAMAGUCHI ,  Toshio MIZUNO ,  Itsuki KOBATA ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC分类号： H01L21/67 ,  B24B37/10 ,  B24B49/14 ,  B24B53/017 ,  B24B37/34 ,  H01L21/304 ,  H01L21/306 ,  H01L21/02

CPC分类号： H01L21/67248 ,  H01L21/67178 ,  H01L21/67109 ,  H01L21/67051 ,  H01L21/67046 ,  H01L21/67028 ,  H01L21/67219 ,  B24B37/105 ,  B24B49/14 ,  B24B53/017 ,  B24B37/345 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/6704 ,  H01L21/02065 ,  H01L21/02052

摘要： A polishing apparatus is provided. The polishing apparatus includes:



a polishing unit configured to polish a substrate by bringing a polishing tool into contact with the substrate and moving the substrate relatively to the polishing tool; a cleaning unit; and a first transfer robot configured to transfer the substrate before polishing to the polishing unit and/or configured to transfer the substrate after polishing from the polishing unit to the cleaning unit. The cleaning unit includes: at least one cleaning module, a buff processing module configured to perform a buff process to the substrate, and a second transfer robot configured to transfer the substrate between the cleaning module and the buff processing module, the second transfer robot being different from the first robot.

公开(公告)号：US20180169831A1

公开(公告)日：2018-06-21

申请号：US15898028

申请日：2018-02-15

申请人： EBARA CORPORATION

发明人： Hiromitsu WATANABE ,  Kuniaki YAMAGUCHI ,  Itsuki KOBATA ,  Yutaka WADA

IPC分类号： B24B57/00 ,  B24B37/04 ,  B24B37/34

CPC分类号： B24B57/00 ,  B24B37/04 ,  B24B37/34

摘要： A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a polishing liquid, which has passed through a filter, is supplied onto the polishing pad. The polishing method includes: passing the polishing liquid through the filter while increasing a physical quantity of the polishing liquid until the physical quantity reaches a predetermined set value, the physical quantity being one of flow rate and pressure of the polishing liquid; and polishing the substrate W on the polishing pad while supplying the polishing liquid that has passed through the filter onto the polishing pad.

公开(公告)号：US20240308028A1

公开(公告)日：2024-09-19

申请号：US18605311

申请日：2024-03-14

申请人： EBARA CORPORATION

发明人： Noriyuki SATO ,  Masayuki TAMURA ,  Kuniaki YAMAGUCHI ,  Tetsuya TERADA

IPC分类号： B24B57/02 ,  B24B53/017

CPC分类号： B24B57/02 ,  B24B53/017

摘要： A liquid supply device includes a swing arm capable of horizontally swinging above a polishing table, and a plurality of spray nozzles that is arranged in a longitudinal direction of the swing arm and sprays a cleaning fluid onto the polishing table, in which each of the plurality of spray nozzles has a slit-shaped fluid outlet, and a fluid outlet of the spray nozzle closer to a distal end of the swing arm is oriented to have a larger inclination angle with respect to a longitudinal direction of the swing arm in plan view.

公开(公告)号：US20170216991A1

公开(公告)日：2017-08-03

申请号：US15514785

申请日：2016-01-18

申请人： EBARA CORPORATION

发明人： Kuniaki YAMAGUCHI ,  ltsuki KOBATA ,  Toshio MIZUNO

IPC分类号： B24B37/005 ,  H01L21/66 ,  H01L21/306 ,  B24B37/10 ,  B24B37/34

摘要： The invention simulates polishing amount taking into account pressure concentration that occurs in the vicinity of the edge of a substrate when a small-diameter buffing pad overhangs the substrate to be buffed.One embodiment of the invention provides a method for simulating polishing amount in a case where a polishing pad of a smaller size than a substrate is used to buff the substrate. The method includes measuring distributions of pressure that is applied from the polishing pad to the substrate according to each overhang amount of the polishing pad relative to the substrate by using a pressure sensor, and correcting the pressure that is used in the polishing amount simulation in accordance with the overhang amounts and the measured pressure distributions.

公开(公告)号：US20160101498A1

公开(公告)日：2016-04-14

申请号：US14879786

申请日：2015-10-09

申请人： EBARA CORPORATION

发明人： Kuniaki YAMAGUCHI ,  Itsuki KOBATA ,  Toshio MIZUNO

IPC分类号： B24B37/11 ,  H01L21/67

CPC分类号： B24B37/11 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67219

摘要： A buffing apparatus for buffing a substrate is provided. The apparatus includes: a buff table for holding the substrate, the buff table being rotatable; a buff head to which a buff pad for buffing the substrate is attachable, the buff head being rotatable and movable in a direction approaching the buff table and a direction away from the buff table, and an internal supply line for supplying process liquid for the buffing to the substrate being formed inside the buff head; and an external nozzle provided separately through the internal supply line in order to supply the process liquid to the substrate.

摘要翻译： 提供了一种用于抛光衬底的抛光装置。 该装置包括：用于保持基板的抛光台，可旋转的抛光台; 一个抛光头，用于抛光衬底的抛光垫可附接到该抛光头上，该抛光头可旋转并且可在接近该抛光台的方向上移动并且远离该抛光台的方向，以及用于为抛光提供处理液体的内部供应线 到形成在抛光头内部的基板; 以及通过内部供应管线单独设置的外部喷嘴，以便将处理液体供应到基板。

公开(公告)号：US20160059380A1

公开(公告)日：2016-03-03

申请号：US14832767

申请日：2015-08-21

申请人： EBARA CORPORATION

发明人： Kuniaki YAMAGUCHI ,  Itsuki KOBATA ,  Toshio MIZUNO ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC分类号： B24B53/017 ,  B08B3/12 ,  B08B3/10 ,  B08B3/02 ,  H01L21/306 ,  B08B1/00

CPC分类号： B24B53/017 ,  B08B1/04 ,  B08B3/02 ,  B08B2203/0288 ,  H01L21/67046 ,  H01L21/67051

摘要： An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

摘要翻译： 本发明的实施例提供了一种buff处理模块。 抛光处理模块包括：抛光台，其上安装有加工对象物体; 保持用于将预定处理应用于处理目标对象的抛光垫的抛光头; 一个支撑和摆动buff头的抛光臂; 用于打磨抛光垫的梳妆台; 以及清洁机构，其布置在抛光台和修整器之间并且用于清洁抛光垫。

公开(公告)号：US20140287653A1

公开(公告)日：2014-09-25

申请号：US14187150

申请日：2014-02-21

申请人： EBARA CORPORATION

发明人： Takahiro SHIMANO ,  Mutsumi TANIKAWA ,  Hisanori MATSUO ,  Kuniaki YAMAGUCHI ,  Katsuhide WATANABE

IPC分类号： B24B53/017 ,  B24B37/005

CPC分类号： B24B53/017 ,  B24B37/005

摘要： The method includes the steps of measuring a surface height of a polishing member 10 at each of plural oscillation sections Z1 to Z5 which are defined in advance on the polishing member 10 along an oscillation direction of a dresser 5; calculating a difference between a current profile obtained from measured values of the surface height and a target profile of the polishing member 10; and correcting moving speeds of the dresser 5 in the plural oscillation sections Z1 to Z5 so as to eliminate the difference.

摘要翻译： 该方法包括以下步骤：沿着修整器5的摆动方向在研磨部件10上预先确定的多个振动部Z1〜Z5的每一个上测量研磨部件10的表面高度; 计算从抛光构件10的表面高度和目标轮廓的测量值获得的电流曲线之间的差; 并修正多个振荡部Z1〜Z5中的修整器5的移动速度，以消除差异。

公开(公告)号：US20240286246A1

公开(公告)日：2024-08-29

申请号：US18441851

申请日：2024-02-14

申请人： EBARA CORPORATION

发明人： Masayuki TAMURA ,  Yusuke MOCHIDA ,  Tetsuya TERADA ,  Noriyuki SATO ,  Kuniaki YAMAGUCHI

IPC分类号： B24B41/047 ,  B24B37/005

CPC分类号： B24B41/047 ,  B24B37/005

摘要： A technique is disclosed that can allow an elastic membrane to be inflated into a desired shape when a workpiece is released from a polishing head, or when the workpiece is held on the polishing head, thereby avoiding excessive stress on the workpiece. The method includes supplying a gas into a first pressure chamber and a second pressure chamber at a first flow rate and a second flow rate regulated by a first flow-rate control valve and a second flow-rate control valve to inflate an elastic membrane of a polishing head when a polished workpiece is released from the polishing head, or when a workpiece to be polished is held on the polishing head. The first pressure chamber and the second pressure chamber are formed by the elastic membrane.