公开(公告)号：US11527422B2

公开(公告)日：2022-12-13

申请号：US16983285

申请日：2020-08-03

Applicant: EBARA CORPORATION

Inventor： Takafumi Sekine ,  Takanori Inada ,  Kazutomo Miyazaki ,  Naoya Hanafusa

IPC: B01D47/02 ,  B01D47/06 ,  B01D53/68 ,  B01D53/78 ,  H01L21/67

Abstract: There is provided an exhaust gas processing apparatus configured to cause a processing gas to be exposed to or come into contact with a liquid and thereby detoxify the processing gas. The exhaust gas processing apparatus comprises a suction casing provided with an inlet which the processing gas is sucked into and with an outlet which the processing gas is flowed out from; a liquid tank configured to receive an outlet-side part of the suction casing and store the liquid therein; and one or multiple spray nozzles placed in the liquid tank. The outlet of the suction casing is arranged to be located above a liquid surface of the liquid stored in the liquid tank. The one or multiple spray nozzles are configured to spray the liquid from around the outlet of the suction casing to a peripheral part of the outlet.

公开(公告)号：US12300520B2

公开(公告)日：2025-05-13

申请号：US17746279

申请日：2022-05-17

Applicant: EBARA CORPORATION ,  EBARA REFRIGERATION EQUIPMENT & SYSTEMS CO., LTD.

Inventor： Motoshi Kohaku ,  Yukihiro Fukusumi ,  Nobutaka Bannai ,  Hiromasa Miyata ,  Naoya Hanafusa ,  Ken Taoka ,  Kazutomo Miyazaki

IPC: H01L21/67 ,  C23C16/44 ,  F25B25/00 ,  F25B49/02

Abstract: A sub-fab area installation apparatus includes: a vacuum pump configured to evacuate a processing gas from a processing chamber of the semiconductor manufacturing equipment; a cooling unit configured to cool a first circulation liquid used in the processing chamber; a heating unit configured to heat a second circulation liquid used in the processing chamber; and a cooling-liquid line configured to pass a cooling liquid therethrough. The cooling liquid is supplied from a cooling source. The cooling-liquid line includes: a distribution line configured to supply the cooling liquid to the vacuum pump and the cooling unit; and a merging return line configured to merge the cooling liquid that has passed through the vacuum pump and the cooling unit and return the cooling liquid to the cooling source.