CAPACITOR AND METHOD OF MAKING
    1.
    发明申请

    公开(公告)号:US20180315547A1

    公开(公告)日:2018-11-01

    申请号:US15965328

    申请日:2018-04-27

    Applicant: EEStor, Inc.

    Inventor: Richard D. Weir

    CPC classification number: H01G4/1227 H01G4/18 H01G4/206

    Abstract: A capacitor includes a dielectric layer including a polymer matrix and ceramic particles dispersed with the polymer matrix. The polymer matrix includes epoxy. The ceramic particles include composition-modified barium titanate ceramic particles. The capacitor may include a plurality of layers. The dielectric layer may have a thickness of 0.1 microns to 100 microns.

    Method of preparing ceramic powders

    公开(公告)号:US10239792B2

    公开(公告)日:2019-03-26

    申请号:US14475091

    申请日:2014-09-02

    Applicant: EEStor, Inc.

    Abstract: A method of forming composition-modified barium titanate ceramic particulate includes mixing a plurality of precursor materials and a precipitant solution to form an aqueous suspension. The plurality of precursors include barium nitrate, titanium chelate, and a metal or oxometal chelate. The precipitant solution includes tetraalkylammonium hydroxide and tetraalkylammonium oxalate. The method further includes treating the aqueous suspension at a temperature of at least 150° C. and a pressure of at least 200 psi, and separating particulate from the aqueous suspension after treating.

    ENHANCED STACKING FOR IMPROVED CAPACITANCE
    3.
    发明申请

    公开(公告)号:US20170278636A1

    公开(公告)日:2017-09-28

    申请号:US15622623

    申请日:2017-06-14

    Applicant: EEStor, Inc.

    Inventor: Richard D. Weir

    Abstract: A capacitor includes a first conductive plate, a second conductive plate, a floating conductive plate and a dielectric material separating the floating conductive plate from the first conductive plate and from the second conductive plate. The floating conductive plate has a first surface closer to the first conductive plate than to the second conductive plate and has a second surface closer to the second conductive plate than to the first conductive plate. In response to an electric field between the first conductive plate and the second conductive plate, charge separation is induced in the floating conductive plate such that a first charge induced on the first surface has a first polarity and a second charge induced on the second surface has a second polarity, where the second polarity different from the first polarity.

    Enhanced stacking for improved capacitance

    公开(公告)号:US10388458B2

    公开(公告)日:2019-08-20

    申请号:US15622623

    申请日:2017-06-14

    Applicant: EEStor, Inc.

    Inventor: Richard D. Weir

    Abstract: A capacitor includes a first conductive plate, a second conductive plate, a floating conductive plate and a dielectric material separating the floating conductive plate from the first conductive plate and from the second conductive plate. The floating conductive plate has a first surface closer to the first conductive plate than to the second conductive plate and has a second surface closer to the second conductive plate than to the first conductive plate. In response to an electric field between the first conductive plate and the second conductive plate, charge separation is induced in the floating conductive plate such that a first charge induced on the first surface has a first polarity and a second charge induced on the second surface has a second polarity, where the second polarity different from the first polarity.

    CAPACITOR AND METHOD OF MAKING
    5.
    发明申请

    公开(公告)号:US20170372839A1

    公开(公告)日:2017-12-28

    申请号:US15533617

    申请日:2015-12-07

    Applicant: EEStor, Inc.

    Inventor: Richard D. Weir

    CPC classification number: H01G4/1227 H01G4/18 H01G4/206

    Abstract: A capacitor can include a dielectric layer including a polymer matrix and ceramic particles dispersed with the polymer matrix. The polymer matrix can include epoxy. The ceramic powders can include composition modified barium titanate ceramic powders. In an embodiment, the capacitor can include a plurality of layers. In another embodiment, the dielectric layer can have a thickness of 0.1 microns to 100 microns.

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