公开(公告)号：US11284540B2

公开(公告)日：2022-03-22

申请号：US16589503

申请日：2019-10-01

Applicant: Elbit Systems Ltd.

Inventor： Oleg Naigertsik ,  Alex Fischman ,  Ian Engleman ,  Isaac Jak Kettner

IPC: H05K7/20 ,  D03D25/00 ,  D03D11/00 ,  D03D1/00 ,  D03D15/267 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/42 ,  H05K7/14 ,  H05K1/09 ,  H05K3/00 ,  H05K1/18

Abstract: A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

公开(公告)号：US20170303392A1

公开(公告)日：2017-10-19

申请号：US15639788

申请日：2017-06-30

Applicant: ELBIT SYSTEMS LTD.

Inventor： Oleg Naigertsik ,  Alex Fischman ,  Ian Engleman ,  Isaac Jak Kettner

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K1/09 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K7/20563 ,  D03D1/0082 ,  D03D11/00 ,  D03D15/0011 ,  D03D25/005 ,  D10B2101/06 ,  H05K1/0201 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/09 ,  H05K1/115 ,  H05K1/18 ,  H05K3/0011 ,  H05K3/42 ,  H05K3/429 ,  H05K7/1422 ,  H05K7/20163 ,  H05K7/207 ,  H05K2201/029 ,  H05K2201/068

Abstract: A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

公开(公告)号：US20200245502A1

公开(公告)日：2020-07-30

申请号：US16589503

申请日：2019-10-01

Applicant: Elbit Systems Ltd.

Inventor： Oleg Naigertsik ,  Alex Fischman ,  Ian Engleman ,  Isaac Jak Kettner

IPC: H05K7/20 ,  H05K1/03 ,  D03D11/00 ,  H05K1/09 ,  D03D1/00 ,  H05K1/02 ,  H05K7/14 ,  D03D25/00 ,  D03D15/00 ,  H05K3/42 ,  H05K3/00 ,  H05K1/11 ,  H05K1/18

Abstract: A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

公开(公告)号：US10064311B2

公开(公告)日：2018-08-28

申请号：US15541127

申请日：2015-11-11

Applicant: ELBIT SYSTEMS LTD.

Inventor： Oleg Naigertsik ,  Alex Fischman ,  Ian Engleman ,  Isaac Jak Kettner

IPC: H05K7/20 ,  H05K7/14 ,  H05K1/03 ,  H05K1/11 ,  H05K3/42 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K7/20563 ,  D03D1/0082 ,  D03D11/00 ,  D03D15/0011 ,  D03D25/005 ,  D10B2101/06 ,  H05K1/0201 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/09 ,  H05K1/115 ,  H05K1/18 ,  H05K3/0011 ,  H05K3/42 ,  H05K3/429 ,  H05K7/1422 ,  H05K7/20163 ,  H05K7/207 ,  H05K2201/029 ,  H05K2201/068

Abstract: A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

公开(公告)号：US20170359921A1

公开(公告)日：2017-12-14

申请号：US15541127

申请日：2015-11-11

Applicant: ELBIT SYSTEMS LTD.

Inventor： Oleg Naigertsik ,  Alex Fischman ,  Ian Engleman ,  Isaac Jak Kettner

IPC: H05K7/20 ,  H05K7/14 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K3/42

CPC classification number: H05K7/20563 ,  D03D1/0082 ,  D03D11/00 ,  D03D15/0011 ,  D03D25/005 ,  D10B2101/06 ,  H05K1/0201 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/09 ,  H05K1/115 ,  H05K1/18 ,  H05K3/0011 ,  H05K3/42 ,  H05K3/429 ,  H05K7/1422 ,  H05K7/20163 ,  H05K7/207 ,  H05K2201/029 ,  H05K2201/068

Abstract: A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.