公开(公告)号：US20150050468A1

公开(公告)日：2015-02-19

申请号：US14461171

申请日：2014-08-15

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Robert REICHENBACH ,  Chuan YANG ,  Fang SHAN

IPC: B41J2/455

CPC classification number: B23K26/0624 ,  B23K26/0006 ,  B23K26/082 ,  B23K26/0823 ,  B23K26/083 ,  B23K26/0853 ,  B23K26/0869 ,  B23K26/0876 ,  B23K26/53 ,  B23K26/57 ,  B23K2101/007 ,  B23K2101/34 ,  B23K2101/40 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/14 ,  B23K2103/15 ,  B23K2103/56 ,  Y10T428/24802

Abstract: Laser output (114) is employed to mark an article (100) including a layer (104) supported by a substrate (102), wherein the layer (104) has a thickness (t) that is less than or equal to 50 microns. The laser output (114) is focused to a numerical aperture diffraction-limited spot size (32) of less than or equal to 5 microns at a focal point (80) of the beam waist (90) and directed into the layer (104) to form a plurality of structures comprising a plurality of laser-induced cracks within the layer (104) and within a region of the article (100), wherein the laser-induced cracks terminate within the layer (104) without extending to the substrate (102) or an outer surface (108) of the layer (104), and wherein the plurality of structures are configured to scatter light incident upon the article (100).

Abstract translation: 激光输出（114）用于标记包括由衬底（102）支撑的层（104）的制品（100），其中该层（104）的厚度（t）小于或等于50微米。 在束腰（90）的焦点（80）处将激光输出（114）聚焦到小于或等于5微米的数值孔径衍射限制光斑尺寸（32）并被引导到层（104）中， 以形成多个结构，其包括在所述层（104）内并且在所述制品（100）的区域内的多个激光诱发的裂纹，其中所述激光诱发的裂纹终止于所述层（104）内而不延伸到所述衬底 102）或所述层（104）的外表面（108），并且其中所述多个结构被配置为散射入射在所述物品（100）上的光。

公开(公告)号：US20140083983A1

公开(公告)日：2014-03-27

申请号：US14032829

申请日：2013-09-20

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Haibin Zhang ,  Fang SHAN ,  Mathew Rekow ,  Min Zhang ,  Glenn Simenson ,  Qian XU ,  James Brookhyser ,  Joe Frankel ,  Michael Darwin ,  Jack Rundel ,  Matthew Pysher

IPC: B23K26/36

CPC classification number: B23K26/364 ,  B23K26/0006 ,  B23K26/57 ,  B23K2103/50

Abstract: The present invention is a method for separating a workpiece from a common substrate. It includes the steps of providing the workpiece, generating, within a beam source, a beam of laser pulses configured to modify a portion of the workpiece, determining a depth for creating a modified region based upon a characteristic of the workpiece and modifying a plurality of regions within the workpiece to form a plurality of modified regions. Modifying the plurality of regions includes directing the beam of laser pulses from an output of the beam source onto the workpiece, causing relative motion between the workpiece and the output of the beam source while directing the beam of laser pulses onto workpiece, and modifying a characteristic of the pulses of the beam upon generating a number of pulses which generally correspond to creating the modified regions to the determined depth.

Abstract translation: 本发明是用于从共用基板分离工件的方法。 其包括以下步骤：提供工件，在光束源内产生构造成修改工件的一部分的激光脉冲束，基于工件的特性确定用于产生修改区域的深度，并修改多个 区域，以形成多个修改区域。 修改多个区域包括将激光脉冲束从射束源的输出引导到工件上，引起工件和光束源的输出之间的相对运动，同时将激光脉冲束引导到工件上，并修改特性 产生多个脉冲的波束的脉冲，这些脉冲通常对应于将修改的区域创建到确定的深度。