公开(公告)号：US20210362277A1

公开(公告)日：2021-11-25

申请号：US17047254

申请日：2019-06-04

申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC.

发明人： Patrick Riechel ,  Mark Unrath ,  Jake Roberts ,  Joseph Hasty ,  James Brookhyser ,  Zachary Dunn ,  Christopher Hamner ,  Geoffrey Lott ,  Jacob Magers ,  Jack Rundel ,  Jeffrey Howerton ,  Jan Kleinert ,  Doug Hall ,  Gary Larsen ,  Julie Wilson ,  Lee Petersen ,  Mark Wegner ,  Kurt Eaton

IPC分类号： B23K26/70 ,  B23K26/08 ,  B23K26/03 ,  B23K26/067 ,  B23K26/082 ,  B65H18/10 ,  G02F1/33 ,  G02B27/10

摘要： Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to use of beam characterization tools to facilitate adaptive processing, process control and other desirable features. Other embodiments relate to laser power sensors incorporating integrating spheres. Still other embodiments relate to workpiece handling systems capable of simultaneously providing different workpieces to a common laser-processing apparatus. A great number of other embodiments and arrangements are also detailed.